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PDF MRFIC1505 Data sheet ( Hoja de datos )
| Número de pieza | MRFIC1505 | |
| Descripción | Integrated GPS Downconverter | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MRFIC1505 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
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Freescale Semiconductor
Technical Data
MRFIC1505
Rev. 1, 08/2004
MRFIC1505/MRFIC1505A Integrated GPS
Downconverter
www.DataSheet4U.com
1.575 GHz GPS DOWNCONVERTER
This integrated circuit is intended for GPS receiver applications. The dual conversion design is implemented in Motorola’s
low–cost, high–performance MOSAIC 5. silicon bipolar process and is packaged in a low–cost surface mount LQFP–48 package.
In addition to the mixers, a VCO, PLL, Crystal Oscillator, A/D converter and a loop filter are integrated on–chip. Output IF is
nominally 4.1 MHz.
• 105 dB Typical Conversion Gain
• 2.7 V Operation
• 28 mA Typical Current Consumption
• Low–Cost, Low–Profile Plastic LQFP Package
MOSAIC 5 is a trademark of Motorola, Inc.
Device
MRFIC1505R2
MRFIC1505AR2
Ordering Information
Operating Temperature
Range
TA = –40 to 85°C
TA = –40 to 85°C
Package
LQFP-48
LQFP-48
Plastic Package
Case 932
(LQFP-48)
© Freescale Semiconductor, Inc., 2004. All rights reserved.
1 page  
9
1
T
www.DataSheet4U.com
B
B1
12
4X
0.200 AB T-U Z
A1
48
A
37
Outline Dimensions
PLASTIC PACKAGE
CASE 932-03
(LQFP-48)
ISSUE F
DETAIL Y
36
U
V
V1
25
P
AE
NO1TEDSIM: ENSIONING AND TOLERANCING PER ASME
23 DCYOA1TN4U.T5MRMOP,L1LA9IN9GE4.ADBIMISENLOSCIOANT:EMDILALTIMBEOTTETRO. MOF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODYAT
4 DTAHTEUBMOSTT,OUM, AONFDTZHTEOPABRETDINEGTELRINMEIN. ED AT
5 DDIMATEUNMSIOPNLASNSEANB.D VTO BE DETERMINED AT
6 DSIMEAETNINSGIOPNLSAANEANADC.B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS AAND B DO
INCLUDE MOLD MISMATCH AND ARE
7 DDIMETEENRSMIOINNED DATODESATNUOMTPINLACNLUEDAEB.DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
8 M0IN.3I5M0U.MSOLDER PLATE THICKNESS SHALLBE
9 E0X.A0C0T76S.HAPE OF EACH CORNER IS OPTIONAL.
AE
13
S1
24
Z
S
4X
0.200 AC T-U Z
AB G
AD
AC
BASE METAL
NJ
F
D
0.080 M AC T-U Z
SECTION AE-AE
0.080 AC
DETAIL Y
Mð_
TOP & BOTTOM
T, U, Z
MILLIMETERS
DIM MIN MAX
A 7.000 BSC
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.170 0.270
E 1.350 1.450
F 0.170 0.230
G 0.500 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
L 0 ð_ 7 ð_
M 12 ðR_EF
N 0.090 0.160
P 0.250 BSC
R 0.150 0.250
S 9.000 BSC
S1 4.500 BSC
V 9.000 BSC
V1 4.500 BSC
W 0.200 REF
AA 1.000 REF
R
CE
HW
DETAIL AD
K
AA
L ð_
Freescale Semiconductor
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet MRFIC1505.PDF ] | |
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