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March 2001
Revised July 2002
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SSTV16859
Dual Output 13-Bit Register with
SSTL-2 Compatible I/O and Reset
General Description
The SSTV16859 is a dual output 13-bit register designed
for use with 184 and 232 pin DDR-1 memory modules. The
device has a differential input clock, SSTL-2 compatible
data inputs and a LVCMOS compatible RESET input. The
device has been designed to meet the JEDEC DDR mod-
ule register specifications.
The device has been fabricated on an advanced sub-
micron CMOS process and is designed to operate at power
supplies of less than 3.6V’s.
Features
I Compliant with DDR-I registered module specifications
I Operates at 2.5V ± 0.2V VDD
I SSTL-2 compatible input structure
I SSTL-2 compliant output structure
I Differential SSTL-2 compatible clock inputs
I Low power mode when device is reset
I Industry standard 64 pin TSSOP package
I Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Ordering Code:
Order Number Package Number
Package Description
SSTV16859G
(Note 1)(Note 2)
BGA96A
96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
SSTV16859MTD
(Note 2)
MTD64
64-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 1: Ordering code “G” indicates Trays.
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
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DC Electrical Characteristics (Continued)
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Symbol
Parameter
Conditions
ROH
ROL
RO∆
Output HIGH On Resistance
Output LOW On Resistance
| ROH - ROL |
IOH = −20 mA
IOL = 20 mA
IO = 20 mA, TA = 25°C
AC Electrical Characteristics (Note 6)
Symbol
Parameter
fMAX
Maximum Clock Frequency
tW
tACT
(Note 7)
Pulse Duration, CK, CK HIGH or LOW (Figure 2)
Differential Inputs Activation Time,
data inputs must be LOW after RESET HIGH (Figure 3)
tINACT
(Note 7)
Differential Inputs De-activation Time,
data and clock inputs must be held at valid levels
(not floating) after RESET LOW
tS Setup Time, Fast Slew Rate (Note 8)(Note 9) (Figure 5)
Setup Time, Slow Slew Rate (Note 9)(Note 10) (Figure 5)
tH Hold Time, Fast Slew Rate (Note 8)(Note 10) (Figure 5)
Hold Time, Slow Slew Rate (Note 9)(Note 10) (Figure 5)
tREM
Reset Removal Time (Figure 7)
tPHL, tPLH Propagation Delay CK, CK to Qn (Figure 4)
tPHL Propagation Delay RESET to Qn (Figure 6)
Note 6: Refer to Figure 1 through Figure 7.
Note 7: This parameter is not production tested.
Note 8: For data signal input slew rate ≥ 1 V/ns.
Note 9: For data signal input slew rate ≥ 0.5 V/ns and < 1 V/ns.
Note 10: For CK, CK signals input slew rates are ≥ 1 V/ns.
Capacitance (Note 11)
Symbol
CIN
Parameter
Data Pin Input Capacitance
CK, CK - Input Capacitance
Min Typ
2.2
2.2
RESET
2.3
Note 11: TA = +25°C, f = 1 MHz, Capacitance is characterized but not tested.
VDD
Min
Typ
Max
Units
(V)
2.3 to 2.7
7
20 Ω
2.3 to 2.7
7
20 Ω
2.5 4 Ω
TA = 0°C to +70°C, CL = 30 pF, RL = 50Ω
VDD = 2.5V ± 0.2V; VDDQ = 2.5V ± 0.2V
Min Typ Max
200
2.5
22
Units
MHz
ns
ns
22
0.75
0.9
0.75
0.9
10
1.1
ns
ns
ns
ns
2.8 ns
5.0 ns
Max
3.2
3.2
3.3
Units
pF
pF
pF
Conditions
VDD = 2.5V, VI = VREF ± 310 mV
VDD = 2.5V, VICR = 1.25, VI(PP) = 360 mV
VDD = 2.5V, VI = VDD or GND
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