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CIP21T901NE 데이터시트 PDF




ETC에서 제조한 전자 부품 CIP21T901NE은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


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부품번호 CIP21T901NE 기능
기능 Splitter
제조업체 ETC
로고 ETC 로고


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CIP21T901NE 데이터시트, 핀배열, 회로
Splitter
Splitter is used for dividing local power in a mobile phone . It is positioned ahead of
VCO output and sends the local power to Rx/Tx parts separately. Output signals
have mutually the same phase and amplitude.
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General Features
-Available in the 700MHz to 1.9GHz frequency range.
- Low loss and high isolation
- Ultra-small size and lightweight SMDs.
- Available in tape and reel packings for automatic mounting.
- Operating temperature: -35to +85
- Recommended Matching Capacitor
: 3pF for CIP21T701NE : 2pF for CIP21(or 31)T901NE
- Reflow soldering available.
: 1pF for CIP21(or 31)T182NE
Applications
- Dividing local power in a mobile phone.
Part Numbering
2 SERIES
CI P 21 T 901 N
1 2 3 4 5 6
1 Abbreviation of Splitter
2 Series
3 Dimension
4 Material
5 Frequency Band for Application
6 Thickness Option
E
7
CODE
P
DESCRIPTION OF CODE
CHIP SPLITTER




CIP21T901NE pdf, 반도체, 판매, 대치품
CARACTERISTIC LINE UP
Product
CIP31T901NE
CIP31T182NE
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CIP21T901NE
CIP21T182NE
Insertion Loss
0.3dB
0.3dB
0.3dB
0.3dB
Isolation
23dB
23dB
23dB
23dB
VSWR
1.3
1.3
1.3
1.3
Dimension
3.2X1.6mm
3.2X1.6mm
2.0X1.2mm
2.0X1.2mm
Thickness
1.0mm
1.0mm
1.0mm
1.0mm
901 : 90X101 = 900MHz
182 : 18X102= 1800MHz

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CIP21T901NE 전자부품, 판매, 대치품
APPLICATION MANUAL
STAGE
PRECAUTION
TECHNICAL CONSIDERATION
1. Soldering
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Soldering
1. Temperature, time, amount of solder, etc. are
specified in accordance with the following
recommended conditions.
1-1. Preheating when soldering
Heating : Splitter should be preheated within 100
to 130of the soldering.
Cooling : The temperature difference between the
components and cleaning process should not be
greater than 100. Splitter is susceptible to
thermal shock when exposed to rapid or concentrated
heating or rapid cooling. Therefore, the soldering
process must be conducted with a great care so as
to prevent malfunction of the components due to
excessive thermal shock..
Recommended conditions for soldering
[Reflow soldering]
Temperature Profile
TEMP
P rehea ti ng
Soldering Temp
Soldering
Coo l i ng
250
T 1 50
Preheating Temp
30~50 sec
220
6060~120
6
TIME (sec)
1. The ideal condition is to have solder mass (fillet)
controlled to 1/2 to 1/3 of the thickness of the
Splitter, as shown below:
SPLITTER 1/2T1/3T
Solder
T
PC board
2. Because excessive dwell times can detrimentally
affect solderability, soldering duration should be
kept as close to recommended times as possible.
2. Cleaning
Cleaning conditions
1. When cleaning the PC board after the
splitters are all mounted, select the
appropriate cleaning solution according to
the type of flux used and purpose of the
cleaning(e.g. to remove soldering flux or
other materials from the production
process.)
2. Cleaning conditions should be determined
after verifying, through a test run, that
the cleaning process does not affect the
splitter's characteristics.
1. The use of inappropriate solutions can cause foreign
substances such as flux residue to adhere to the
splitter, resulting in a degradation of the splitter's
electrical properties (especially insulation resistance).
2. Inappropriate cleaning conditions (insufficient or
excessive cleaning) may detrimentally affect the
performance of the splitters.
(1)Excessive cleaning
In the case of ultrasonic cleaning, too much power
output can cause excessive vibration of the PC board
which may lead to the cracking of the splitter or the
soldered portion, or decrease the terminal electrodes'
strength. Thus the following conditions should be
carefully checked;
Ultrasonic output
Below 20 w/l
Ultrasonic frequency
Below 40 kHz
Ultrasonic washing period 5 min. or less

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부품번호상세설명 및 기능제조사
CIP21T901NE

Splitter

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