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부품번호 | CIP21T901NE 기능 |
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기능 | Splitter | ||
제조업체 | ETC | ||
로고 | |||
Splitter
Splitter is used for dividing local power in a mobile phone . It is positioned ahead of
VCO output and sends the local power to Rx/Tx parts separately. Output signals
have mutually the same phase and amplitude.
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General Features
-Available in the 700MHz to 1.9GHz frequency range.
- Low loss and high isolation
- Ultra-small size and lightweight SMDs.
- Available in tape and reel packings for automatic mounting.
- Operating temperature: -35℃ to +85℃
- Recommended Matching Capacitor
: 3pF for CIP21T701NE : 2pF for CIP21(or 31)T901NE
- Reflow soldering available.
: 1pF for CIP21(or 31)T182NE
Applications
- Dividing local power in a mobile phone.
Part Numbering
●2 SERIES
CI P 21 T 901 N
●1 ●2 ●3 ●4 ●5 ●6
●1 Abbreviation of Splitter
●2 Series
●3 Dimension
●4 Material
●5 Frequency Band for Application
●6 Thickness Option
E
●7
CODE
P
DESCRIPTION OF CODE
CHIP SPLITTER
CARACTERISTIC LINE UP
Product
CIP31T901NE
CIP31T182NE
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CIP21T901NE
CIP21T182NE
Insertion Loss
0.3dB
0.3dB
0.3dB
0.3dB
Isolation
23dB
23dB
23dB
23dB
VSWR
1.3
1.3
1.3
1.3
Dimension
3.2X1.6mm
3.2X1.6mm
2.0X1.2mm
2.0X1.2mm
Thickness
1.0mm
1.0mm
1.0mm
1.0mm
※ 901 : 90X101 = 900MHz
182 : 18X102= 1800MHz
4페이지 APPLICATION MANUAL
STAGE
PRECAUTION
TECHNICAL CONSIDERATION
1. Soldering
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▶ Soldering
1. Temperature, time, amount of solder, etc. are
specified in accordance with the following
recommended conditions.
1-1. Preheating when soldering
Heating : Splitter should be preheated within 100
to 130℃ of the soldering.
Cooling : The temperature difference between the
components and cleaning process should not be
greater than 100℃ . Splitter is susceptible to
thermal shock when exposed to rapid or concentrated
heating or rapid cooling. Therefore, the soldering
process must be conducted with a great care so as
to prevent malfunction of the components due to
excessive thermal shock..
※ Recommended conditions for soldering
[Reflow soldering]
Temperature Profile
TEMP
P rehea ti ng
Soldering Temp
Soldering
Coo l i ng
250℃
△T ≤1 50
Preheating Temp
30~50 sec
220℃
60≥ 60~120
6≥
TIME (sec)
※ 1. The ideal condition is to have solder mass (fillet)
controlled to 1/2 to 1/3 of the thickness of the
Splitter, as shown below:
SPLITTER 1/2T∼1/3T
Solder
T
PC board
2. Because excessive dwell times can detrimentally
affect solderability, soldering duration should be
kept as close to recommended times as possible.
2. Cleaning
▶ Cleaning conditions
1. When cleaning the PC board after the
splitters are all mounted, select the
appropriate cleaning solution according to
the type of flux used and purpose of the
cleaning(e.g. to remove soldering flux or
other materials from the production
process.)
2. Cleaning conditions should be determined
after verifying, through a test run, that
the cleaning process does not affect the
splitter's characteristics.
1. The use of inappropriate solutions can cause foreign
substances such as flux residue to adhere to the
splitter, resulting in a degradation of the splitter's
electrical properties (especially insulation resistance).
2. Inappropriate cleaning conditions (insufficient or
excessive cleaning) may detrimentally affect the
performance of the splitters.
(1)Excessive cleaning
In the case of ultrasonic cleaning, too much power
output can cause excessive vibration of the PC board
which may lead to the cracking of the splitter or the
soldered portion, or decrease the terminal electrodes'
strength. Thus the following conditions should be
carefully checked;
Ultrasonic output
Below 20 w/l
Ultrasonic frequency
Below 40 kHz
Ultrasonic washing period 5 min. or less
7페이지 | |||
구 성 | 총 11 페이지수 | ||
다운로드 | [ CIP21T901NE.PDF 데이터시트 ] |
당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는 |
구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
CIP21T901NE | Splitter | ETC |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |