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PDF ILX569K Data sheet ( Hoja de datos )
| Número de pieza | ILX569K | |
| Descripción | 5340-pixel x 6 line CCD Linear Sensor | |
| Fabricantes | Sony Corporation | |
| Logotipo |  |
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ILX569K
5340-pixel × 6 line CCD Linear Sensor (Color)
Description
The ILX569K is a reduction type CCD linear sensor
developed for color image scanner. This sensor
reads A4-size documents at a density of 600 DPI
and 1200 DPI.
22 pin DIP (Plastic)
Sensor Line Features
www.DataShee•t4NUu.cmomber of effective pixels:
32040 pixels (5340 pixels × 6)
• Pixel size: 4µm × 4µm (4µm pitch)
• Distance between main line:
48µm (12 lines)
• Distance between main line and sub line: 8µm (2 lines)
Common Features
• Single-sided readout
• Ultra low lag
• Single 12V power supply
• Maximum data rate: 8MHz/Color
• Input clock pulse: CMOS 5V drive
• Number of output: 3 (R, G, B)
• Package:
22 pin Plastic-DIP (400mil)
Absolute Maximum Ratings
• Supply voltage
VDD
• Operating temperature
15
–10 to +55
V
°C
Sensor Configuration
Pin Configuration (Top View)
1357
Blue
φL1 1
φ3 2
VDD 3
VOUT-R 4
VOUT-B 5
22 φL2
21 φ4
20 φRS
19 GND
18 VOUT-G
24 68
Blue
48µm
1357
Green
NC 6
NC 7
NC 8
NC 9
φROG-G 10
φROG-R 11
17 NC
16 NC
15 φ1
14 φ2
13 φROG-B
12 NC
24 68
Green
48µm
4µm 1 3 5 7
4µm
4µm 2 4 6 8
4µm
Red
8µm
Red
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E01750A27
1 page  
Clock Timing Chart 1 1200 DPI
5
φROG
0
5
φ1, φL1
0
5
φ2, φL2
0
5
φ3
0
5
φ4
0
5
φRS
0
VOUT
Optical black (42 pixels × 2)
Dummy signal (74 pixels × 2)
Effective pixels signal
(5340 pixels × 2)
Dummy signal (32 pixels × 2)
1-line output period (5446 pixels × 2)
Note) The transfer pulses (φ1, φ2) must have more than 5446 cycles.
The transfer pulses (φ3, φ4) must have more than 10892 cycles.
VOUT indicates VOUT-R, VOUT-G, VOUT-B.
5 Page 
ILX569K
Notes on Handling
1. Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensors.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
www.DataSheet4U.com
2. Notes on handling CCD packages
The following points should be observed when handling and installing packages.
a) Remain within the following limits when applying a static load to the package.
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer
perimeter of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
Cover glass
Plastic portion
39N
29N
29N
0.9Nm
Ceramic portion
(1) Adhesive
(2)
(3)
(4)
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the packege to crack or dust to be generated.
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.
(5) Applying the metal a crash or a rub against the plastic portion.
Note that the preceding notes should also be observed when removing a component from a board
after it has already been soldered.
3. Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnance causes damage to the glass and other defects. Use a grounded
30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image device, do not use a solder suction equipment. When using an electric
desoldering tool, ground the controller. For the control system, use a zero-cross type.
– 11 –
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet ILX569K.PDF ] | |
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