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PDF CM3107 Data sheet ( Hoja de datos )
| Número de pieza | CM3107 | |
| Descripción | 2 Amp Source/ Sink Bus Termination Regulator | |
| Fabricantes | California Micro Devices | |
| Logotipo |  |
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CM3107
2 Amp Source/ Sink Bus Termination Regulator
for DDR Memory and Front Side Bus Applications
Features
• Ideal for Intel 865 Front Side Bus VTT and DDR
VTT applications
• Sinks and sources 2 Amps
• Over current protection
• Over temperature protection
www.DataShee•t4U.cIonmtegrated power MOSFETs
• Excellent accuracy (0.5% load regulation)
• Selectable output (1.225V/1.45V or VDDQ/2)
• 8-lead SOIC and PSOP packages
• Lead-free versions available
Applications
• Intel 865/845 Front Side Bus termination
• Single and dual DDR memory termination
• Active termination buses
• Graphics card DDR memory termination
Product Description
The CM3107 is a sinking and sourcing regulator specif-
ically designed for series-parallel bus termination for
high-speed chip set busses as well as DDR memory
systems. It can source and sink current up to 2.0A with
a load regulation of 0.5%. The VTT output voltage is
selectable by VDDQSEL and FSBSEL pins. The
VDDQSEL pin controls whether the CM3107 is in DDR
memory mode with VTT=VDDQ/2, or in FSB mode. In
FSB mode, FSBSEL controls whether VTT is 1.225V or
1.45V. This allows the same chip to be used in two dif-
ferent circuits on an Intel 865-based motherboard.
The CM3107 provides over current and over tempera-
ture protection, which protect the chip from excessive
heating due to high current and high temperature. A
shutdown capability using an external transistor
reduces power consumption and provides a high
impedance output.
The CM3107 is housed in 8-lead SOIC and PSOP
packages and is available with optional lead-free finish-
ing.
Simplified Electrical Schematic
VCC
VDDQSEL FSBSEL
VDDQ
Over Temp
Over Current
Reference
VREF
OUT
Buffer
IN
Output
Select
Driver
VTT
VSENSE
GND
© 2004 California Micro Devices Corp. All rights reserved.
02/02/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
1
1 page  
Performance Information
Typical DC Characteristics (nominal conditions unless otherwise specified)
CM3107
www.DataSheet4U.com
Figure 1. Output Voltage with
VCC Supply (VDDQSEL= 2.5V)
Figure 3. Reference Voltage with
VCC Supply (VDDQSEL= 2.5V)
Figure 2. Load Regulation (Sink)
Figure 4. Load Regulation (Source)
© 2004 California Micro Devices Corp. All rights reserved.
02/02/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
5
5 Page 
Application Information (cont’d)
CM3107
VCC (CPU Core)
GMCH_EN
www.DataSheet4U.com
GMCHVCCP
Figure 20. Front Side Bus Timing diagram
VDDQSEL
"1"
FSBSEL
Don’t Care
VTT
VDDQSEL/2
(Note1)
NOTE
For DDR
Open or "0"
"0"
1.225V
For FSB
Open or "0"
"1"
1.45V
For FSB
Note 1:Assumes VDDQ and VDDQSEL are tied
together in DDR application.
Table 1: VTT Output Selection Truth Table.
PCB Layout Considerations
The CM3107-00SB has a heat spreader attached to
the underneath of the PSOP-8 package in order for
heat to be transferred much easier from the package to
the PCB. The heat spreader is a copper pad of dimen-
sions just smaller than the package itself. By position-
ing the matching pad on the PCB top layer to connect
to the spreader during manufacturing, the heat will be
transferred between the two pads. The drawing below
shows the recommended PCB layout. Note that there
are six vias on either side to allow the heat to dissipate
into the ground and power planes on the inner layers of
the PCB. Vias can be placed underneath the chip, but
this can cause blockage of the solder. The ground and
power planes should be at least 2 sq in. of copper by
the vias. It also helps dissipation to spread if the chip is
positioned away from the edge of the PCB, and not
near other heat dissipating devices. A good thermal
link from the PCB pad to the rest of the PCB will ensure
a thermal link from the CM3107 package to ambient,
θJA, of around 40°C/W.
Table 2: Recommended Heat Sink PCB Layout
© 2004 California Micro Devices Corp. All rights reserved.
02/02/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
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11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet CM3107.PDF ] | |
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