Datasheet.kr   

KFW8G16Q2M 데이터시트 PDF




Samsung semiconductor에서 제조한 전자 부품 KFW8G16Q2M은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


PDF 형식의 KFW8G16Q2M 자료 제공

부품번호 KFW8G16Q2M 기능
기능 2Gb OneNAND M-Die
제조업체 Samsung semiconductor
로고 Samsung semiconductor 로고


KFW8G16Q2M 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.



전체 30 페이지수

미리보기를 사용할 수 없습니다

KFW8G16Q2M 데이터시트, 핀배열, 회로
OneNAND2G(KFG2G16Q2M-DEBx)
OneNAND4G(KFH4G16Q2M-DEBx)
OneNAND8G(KFW8G16Q2M-DEBx)
FLASH MEMORY
www.DataSheet4U.com
KFG2G16Q2M
KFH4G16Q2M
KFW8G16Q2M
2Gb OneNAND M-die
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure could result in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
OneNAND¥‚ is a trademark of Samsung Electronics Company, Ltd. Other names and brands may be claimed as
the property of their rightful owners.
* Samsung Electronics reserves the right to change products or specification without notice.
1




KFW8G16Q2M pdf, 반도체, 판매, 대치품
OneNAND2G(KFG2G16Q2M-DEBx)
OneNAND4G(KFH4G16Q2M-DEBx)
OneNAND8G(KFW8G16Q2M-DEBx)
FLASH MEMORY
1.2 Ordering Information
KF x x 16 Q 2 M - D E x
Samsung
OneNAND Memory
Device Type
G : Single Chip
H : Dual Chip
W: Quad Chip
www.DataSheet4U.com
Density
2G : 2Gb
4G : 4Gb
8G : 8Gb
Organization
x16 Organization
Operating Voltage Range
Q : 1.8V(1.7 V to 1.95V)
x
Speed
6 : 66MHz
8 : 83MHz
Product Line desinator
B : Include Bad Block
D : Daisy Sample
Operating Temperature Range
E = Extended Temp. (-30 qC to 85 qC)
Package
D : FBGA(Lead Free)
Version
1st Generation
Page Architecture
2 : 2KB Page
1.3 Architectural Benefits
OneNAND is a highly integrated non-volatile memory solution based around a NAND Flash memory array.
The chip integrates system features including:
xA BootRAM and bootloader
xTwo independent bi-directional 2KB DataRAM buffers
xA High-Speed x16 Host Interface
xOn-chip Error Correction
xOn-chip NOR interface controller
This on-chip integration enables system designers to reduce external system logic and use high-density NAND Flash in applications
that would otherwise have to use more NOR components.
OneNAND takes advantage of the higher performance NAND program time, low power, and high density and combines it with the
synchronous read performance of NOR. The NOR Flash host interface makes OneNAND an ideal solution for applications like G3
Smart Phones, Camera Phones, and mobile applications that have large, advanced multimedia applications and operating systems,
but lack a NAND controller.
When integrated into a Samsung Multi-Chip-Package with Samsung Mobile DDR SDRAM, designers can complete a high-perfor-
mance, small footprint solution.
4

4페이지










KFW8G16Q2M 전자부품, 판매, 대치품
OneNAND2G(KFG2G16Q2M-DEBx)
OneNAND4G(KFH4G16Q2M-DEBx)
OneNAND8G(KFW8G16Q2M-DEBx)
FLASH MEMORY
2.0 DEVICE DESCRIPTION
2.1 Detailed Product Description
The OneNAND is an advanced generation, high-performance NAND-based Flash memory.
It integrates on-chip a single-level-cell (SLC) NAND Flash Array memory with two independent data buffers, boot RAM buffer, a page
buffer for the Flash array, and a one-time-programmable block.
www.DataSheet4U.Tchoemcombination of these memory areas enable high-speed pipelining of reads from host BufferRAM Page Bufferand NAND Flash
Array.
Clock speeds up to 66MHz / 83MHz with a x16 wide I/O yields a 108MByte/second bandwidth.
The OneNAND also includes a Boot RAM and boot loader. This enables the device to efficiently load boot code at device startup from
the NAND Array without the need for off-chip boot device.
One block of the NAND Array is set aside as an OTP memory area, and 1st Block (Block 0) can be used as OTP area. This area,
available to the user, can be configured and locked with secured user information.
On-chip controller interfaces enable the device to operate in systems without NAND Host controllers.
7

7페이지


구       성 총 30 페이지수
다운로드[ KFW8G16Q2M.PDF 데이터시트 ]

당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는

포괄적인 데이터시트를 제공합니다.


구매 문의
일반 IC 문의 : 샘플 및 소량 구매
-----------------------------------------------------------------------

IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한
광범위한 전력 반도체를 판매합니다.

전력 반도체 전문업체

상호 : 아이지 인터내셔날

사이트 방문 :     [ 홈페이지 ]     [ 블로그 1 ]     [ 블로그 2 ]



관련 데이터시트

부품번호상세설명 및 기능제조사
KFW8G16Q2M

2Gb OneNAND M-Die

Samsung semiconductor
Samsung semiconductor

DataSheet.kr       |      2020   |     연락처      |     링크모음      |      검색     |      사이트맵