|
|
|
부품번호 | KFH2G1612M-DEB5 기능 |
|
|
기능 | FLASH MEMORY | ||
제조업체 | Samsung semiconductor | ||
로고 | |||
OneNAND4G(KFW4G16Q2M-DEB5)
OneNAND2G(KFH2G16Q2M-DEB5)
OneNAND1G(KFG1G16Q2M-DEB5)
FLASH MEMORY
www.DataSheet4U.com
OneNANDTM Specification
Density
1Gb
2Gb
4Gb
Part No.
KFG1G16Q2M-DEB5
KFH2G16Q2M-DEB5
KFW4G16Q2M-DEB5
VCC(core & IO)
1.8V(1.7V~1.95V)
1.8V(1.7V~1.95V)
1.8V(1.7V~1.95V)
Temperature
Extended
Extended
Extended
PKG
63FBGA(LF)
63FBGA(LF)
63FBGA(LF)
Version: Ver. 1.1
Date: July 20, 2005
1
OneNAND4G(KFW4G16Q2M-DEB5)
OneNAND2G(KFH2G16Q2M-DEB5)
OneNAND1G(KFG1G16Q2M-DEB5)
Revision History
Revision No. History
1.0
www.DataSheet4U.com
1. Corrected the errata
2. Added DFS restriction to Multi Block Erase.
3. Added Data Protection flow chart.
4. Removed Cache Read Operation.
5. Added additional information on command register.
6. Revised Interrupt status register information.
7. Added INT pin schematic.
8. Changed tPGM1 to 205 from 320us, tPGM2 to 220 from 350us.
9. Revised ECC Bypass description
10. Revised AC/DC parameters
11. Revised Reset Parameters and Timing Diagrams.
1.1 1. Corrected the errata
2. Deleted 2.65V/3.3V Device Descriptions.
3. Revised Data Protection Flow Chart.
4. Revised Invalid Block Table Creation Flow Chart.
5. Revised Multi Block Erase Description
FLASH MEMORY
Draft Date
May. 17, 2005
Remark
Final
Jul. 20, 2005
Final
4
4페이지 OneNAND4G(KFW4G16Q2M-DEB5)
OneNAND2G(KFH2G16Q2M-DEB5)
OneNAND1G(KFG1G16Q2M-DEB5)
FLASH MEMORY
1.5 Product Features
Device Architecture
• Design Technology:
• Supply Voltage:
• Host Interface:
• 5KB Internal BufferRAM:
• SLC NAND Array:
90nm
1.8V (1.7V ~ 1.95V)
16 bit
1KB BootRAM, 4KB DataRAM
(2K+64)B Page Size, (128K+4K)B Block Size
Device Performance
• Host Interface Type:
www.DataSheet4U.com
• Programmable Burst Read Latency:
• Multiple Sector Read/Write:
• Multiple Reset Modes:
• Multi Block Erase:
• Low Power Dissipation:
Synchronous Burst Read
- Up to 54MHz clock frequency
- Linear Burst 4-, 8-, 16-, 32-words with wrap around
- Continuous 1K word Sequential Burst
Asynchronous Random Read
- 76ns access time
Asynchronous Random Write
Latency 3(up to 40MHz), 4, 5, 6, and 7
Up to 4 sectors using Sector Count Register
Cold/Warm/Hot/NAND Flash Core Resets
Up to 64 Blocks
Typical Power,
- Standby current :
10uA @ Single , 20uA @ DDP, 40uA @ QDP
- Synchronous Burst Read current(54MHz) :
12mA @ Single, 17mA @ DDP/QDP
- Load current : 30mA
- Program current : 25mA
- Erase current : 20mA
- Multi Block Erase current : 20mA
- Endurance : 100K Program/Erase Cycles
- Data Retention : 10 Years
System Hardware
• Voltage detector generating internal reset signal from Vcc
• Hardware reset input (RP)
• Data Protection Modes
- Write Protection for BootRAM
- Write Protection for NAND Flash Array
- Write Protection during power-up
- Write Protection during power-down
• User-controlled One Time Programmable(OTP) area
• Internal 2bit EDC / 1bit ECC
• Internal Bootloader supports Booting Solution in system
• Handshaking Feature
- INT pin indicates Ready / Busy
- Polling the interrupt register status bit
• Detailed chip information
- by ID register
Packaging
• 1G products
• 2G DDP products
• 4G QDP products
63ball, 10mm x 13mm x max 1.0mmt, 0.8mm ball pitch FBGA
63ball, 11mm x 13mm x max 1.2mmt, 0.8mm ball pitch FBGA
63ball, 11mm x 13mm x max 1.4mmt, 0.8mm ball pitch FBGA
7
7페이지 | |||
구 성 | 총 30 페이지수 | ||
다운로드 | [ KFH2G1612M-DEB5.PDF 데이터시트 ] |
당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는 |
구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
KFH2G1612M-DEB5 | FLASH MEMORY | Samsung semiconductor |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |