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PDF SBU6K Data sheet ( Hoja de datos )
| Número de pieza | SBU6K | |
| Descripción | (SBU6x) General Purpose Diodes | |
| Fabricantes | Diotec Electronics Corporation | |
| Logotipo |  |
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DIOTEC ELECTRONICS CORP.
18020 Hobart Blvd., Unit B
Gardena, CA 90248 U.S.A
Tel.: (310) 767-1052 Fax: (310) 767-7958
Data Sheet No. BSBU-600-1C
FEATURES
wwwD.atShee4tUco.m
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
BUILT-IN STRESS RELIEF MECHANISM FOR
SUPERIOR RELIABILITY AND PERFORMANCE
SURGE OVERLOAD RATING TO 250 AMPS PEAK
IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS
THRU-HOLE FOR EASY HEAT SINK MOUNTING
UL RECOGNIZED - FILE #E124962
MECHANICAL SPECIFICATION
SBU PACKAGE SHOWN ACTUAL SIZE
C
C2
D D3
_
C1
D2
D1
+
A
D
A1
L
MECHANICAL DATA
Case: Molded plastic, U/L Flammability Rating 94V-0
Terminals: Round silver plated pins
Soldering: Per MIL-STD 202 Method 208 guaranteed
Polarity: Marked on case
Mounting Position: Any. Max. mounting torque = 5 in lb
Weight: 0.3 Ounces (8 Grams)
L1 B1
MILLIMETERS INCHES
SYM
MIN MAX MIN MAX
A 6.6 7.1 0.260 0.280
A1 4.7 5.2 0.185 0.205
B 1.22 1.32 0.048 0.052
B1 4.57 5.59 0.180 0.220
C 22.7 23.24 0.895 0.915
C1 4.2 4.7 0.165 0.185
C2 3.6 4.1 0.140 0.160
D n/a 19.3 n/a 0.760
D1 10.3 11.3 0.405 0.455
D2 1.7 2.2 0.065 0.085
D3 16.5 17.8 0.660 0.700
L 25.4 n/a 1.0
n/a
L1 4.57 6.8 0.180 0.260
B
_+
SERIES SBU6A - SBU6M
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
Ratings at 25 °C ambient temperature unless otherwise specified. Single phase, 60Hz, resistive or inductive load. For capacitive loads, derate current by 20%.
PARAMETER (TEST CONDITIONS)
SYMBOL
RATINGS
UNITS
Series Number
Maximum DC Blocking Voltage
SBU SBU SBU SBU SBU SBU
6A 6B 6D 6G 6J 6K
VRM 50 100 200 400 600 800
Maximum RMS Voltage
VRMS
35 70 140 280 420 560
Maximum Peak Recurrent Reverse Voltage
Average Forward Rectified Current
TC = 100o C (Notes 1, 3)
TA = 40o C (Note 2)
Peak Forward Surge Current. Single 60Hz Half-Sine Wave
Superimposed on Rated Load (JEDEC Method). TJ = 150O C
VRRM
IO
IFSM
50 100 200 400 600 800
6
6
250
Maximum Forward Voltage (Per Diode) at 6 Amps DC
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
@ TA = 25o C
@ TA = 100o C
Typical Thermal Resistance
Junction to Ambient (Note 2)
Junction to Case (Note 3)
Operating and Storage Temperature Range
VFM
IRM
RθJA
RθJC
TJ ,TSTG
0.95 (Typical < 0.90)
1
50
16.0
3.1
-55 to +150
NOTES: (1) Bridge mounted on 2.6" x 1.4" x 0.06" thick (6.5cm x 3.5cm x 0.15cm) aluminum plate
(2) Bridge mounted on PC Board with 0.5" sq. (12mm sq.) copper pads and bridge lead length of 0.375" (9.5mm)
(3) Bolt bridge on heat sink with #6 screw, using silicon thermal compound between bridge and mounting surface for maximum heat transfer.
SBU
6M
1000
700
1000
VOLTS
AMPS
VOLTS
µA
°C/W
°C
3.01 06sbu
E23
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| Páginas | Total 2 Páginas | |
| PDF Descargar | [ Datasheet SBU6K.PDF ] | |
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