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PDF ADL5320 Data sheet ( Hoja de datos )
| Número de pieza | ADL5320 | |
| Descripción | 400 MHz to 2700 MHz RF Driver Amplifier | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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FEATURES
Operation: 400 MHz to 2700 MHz
Gain of 17 dB at 880 MHz
OIP3 of 45 dBm at 880 MHz
P1dB of 25.4 dBm at 880 MHz
Noise figure: 4 dB at 880 MHz
Power supply: 5 V
www.DataSheePt4oUw.ceormsupply current: 104 mA typical
Internal active biasing
Thermally efficient SOT-89 package
ESD rating of ±4 kV (Class 3A)
GENERAL DESCRIPTION
The ADL5320 is a broadband, linear driver RF amplifier that
operates at frequencies from 400 MHz to 2700 MHz. The device
can be used in a wide variety of wired and wireless applications,
including ISM, WLL, PCS, GSM, CDMA, and W-CDMA.
The ADL5320 operates with a 5 V supply voltage and a supply
current of 104 mA.
400 MHz to 2700 MHz
RF Driver Amplifier
ADL5320
FUNCTIONAL BLOCK DIAGRAM
GND
(2)
ADL5320
1
RFIN
BIAS
23
GND RFOUT
Figure 1.
The ADL5320 is fabricated on a GaAs HBT process. The device
is packaged in a low cost SOT-89 that uses an exposed paddle
for excellent thermal impedance. It operates from −40°C to
+85°C, and a fully populated evaluation board is available.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062−9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2008 Analog Devices, Inc. All rights reserved.
1 page  
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage, VSUP
Input Power (50 Ω Impedance)
Internal Power Dissipation (Paddle Soldered)
θJC (Junction to Paddle)
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Rating
6.5 V
20 dBm
683 mW
28.5°C/W
150°C
−40°C to +85°C
−65°C to +150°C
www.DataSheet4U.com
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ADL5320
Rev. 0 | Page 5 of 16
5 Page 
ADL5320
BASIC LAYOUT CONNECTIONS
The basic connections for operating the ADL5320 are shown in
Figure 26.
Table 5 lists the required matching components. Capacitors C1,
C2, C3, C4, and C7 are Murata GRM155 series (0402 size) and
Inductor L1 is a Coilcraft 0603CS series (0603 size). For all
frequency bands, the placement of C3 and C7 are critical. From
2300 MHz to 2700 MHz, the placement of C2 is also important.
Table 6 lists the recommended component placement for
various frequencies.
A 5 V dc bias is supplied through L1 which is connected to
www.DataSheeRt4FUO.UcTo(mPin 3). In addition to C4, 10 nF and 10 μF power
supply decoupling capacitors are also required. The typical
current consumption for the ADL5320 is 110 mA.
GND VSUP
C6 10µF
RFIN C11
λ12
C31
(2)
ADL5320
1 2 3 λ22
C5 10nF
C41
L11
λ32
λ42 C21
C71
RFOUT
1SEE TABLE 5 FOR FREQUENCY SPECIFIC COMPONENTS.
2SEE TABLE 10 FOR RECOMMENDED COMPONENT SPACING.
Figure 26. Basic Connections
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 27 shows the recommended land pattern for the ADL5320.
To minimize thermal impedance, the exposed paddle on the
SOT-89 package underside is soldered down to a ground plane
along with Pin 2. If multiple ground layers exist, they should
be stitched together using vias. For more information on land
pattern design and layout, refer to the Application Note AN-772,
A Design and Manufacturing Guide for the Lead Frame Chip
Scale Package (LFCSP).
1.80mm
5.56mm
0.20mm
3.48mm
0.86mm
0.62mm
1.27mm
1.50mm
3.00mm
Figure 27. Recommended Land Pattern
Table 5. Recommended Components for Basic Connections
Frequency (MHz)
C1 (pF)
C2 (pF)
450 to 500
100 100
800 to 960
47 47
1805 to 1880
22 22
1930 to 1990
22 22
2110 to 2170
22 22
2300 to 2400
12 2.2
2500 to 2700
12 1.0
C3 (pF)
18
6.8
0.5
0.5
0.5
1.2
1.8
C4 (pF)
100
100
22
22
22
12
12
C7 (pF)
6.8
2.2
1.5
1.5
1.5
1.0
0.5
L1 (nH)
47
47
15
15
15
15
15
Table 6. Matching Component Spacing
Frequency (MHz)
450 to 500
800 to 960
1805 to 2170
2300 to 2400
2500 to 2700
λ1 (mils)
391
200
300
225
142
λ2 (mils)
75
75
75
75
75
λ3 (mils)
364
100
175
125
89
λ4 (mils)
50
350
275
125
75
Rev. 0 | Page 11 of 16
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet ADL5320.PDF ] | |
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