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PDF SKY77517-21 Data sheet ( Hoja de datos )
| Número de pieza | SKY77517-21 | |
| Descripción | TX-RX iPAC FEM | |
| Fabricantes | Skyworks Solutions | |
| Logotipo |  |
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DATA SHEET
SKY77517–21 TX-RX iPAC™ FEM for Dual-Band GSM/GPRS
Applications
• Dual-band cellular handsets
encompassing
- Class 4 GSM850
- PCS1900
- Class 12 GPRS multi-slot
www.DataSheet4Uo.pceormation
Features
• High efficiency
- GSM850 48%
- PCS 41%
• Low transmit supply current
- GSM850 1.26 A
- PCS1900 0.9 A
• Internal ICC sense resistor for iPAC
• Closed loop iPAC
• 50 Ω matched Input/Output
• TX–VCO-to-antenna and antenna-
to-RX-SAW filter RF interface
• TX harmonics below –33 dBm
• PHEMT RF switches afford high
linearity, low insertion loss, and
less than 20 μA supply current in
receive modes
• Small outline: 6 mm x 8 mm
• Low profile: 1.2 mm
• Compatible with multiple logic
families
• Low APC current: 25 μA
Description
The SKY77517–21 is a transmit and receive front-end module (FEM) with Integrated Power
Amplifier Control (iPAC™) for dual-band cellular handsets comprising GSM850 and PCS1900
operation. Designed in a low profile, compact form factor, the SKY77517–21 offers a complete
Transmit VCO-to-Antenna and Antenna-to-Receive SAW filter solution. The FEM also supports
Class 12 General Packet Radio Service (GPRS) multi-slot operation.
The module consists of a GSM850 PA block and a PCS1900 PA block, impedance-matching
circuitry for 50 Ω input and output impedances, TX harmonics filtering, high linearity and low
insertion loss PHEMT RF switches, diplexer and a Power Amplifier Control (PAC) block with
internal current sense resistor. A custom BiCMOS integrated circuit provides the internal PAC
function and decoder circuitry to control the RF switches. The two Heterojunction Bipolar
Transistor (HBT) PA blocks are fabricated onto a single Gallium Arsenide (GaAs) die. One PA
block supports the GSM850 band and the other PA block supports the PCS1900 band. Both PA
blocks share common power supply pads to distribute current. The output of each PA block
and the outputs to the two receive pads are connected to the antenna pad through PHEMT RF
switches and a diplexer. The GaAs die, PHEMT die, Silicon (Si) die and passive components are
mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic
overmold.
Band selection and control of transmit and receive modes are performed using two external
control pads. Refer to the functional block diagram in Figure 1 below. The band select pad (BS)
selects between GSM and PCS modes of operation. The transmit enable (TX_EN) pad controls
receive or transmit mode of the respective RF switch (TX = logic 1). Proper timing between
transmit enable (TX_EN) and Analog Power Control (VRAMP) allows for high isolation between
the antenna and TX-VCO while the VCO is being tuned prior to the transmit burst.
The SKY77517 is compatible with logic levels from 1.2 V to VCC for BS and TX_EN pads,
depending on the level applied to the VLOGIC pad. This feature provides additional flexibility for
the designer in the selection of FEM interface control logic.
Figure 1. Functional Block Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200784A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • November 6, 2007
1
1 page  
SKY77517-21 TX–Rx iPAC™ FEM FOR DUAL-BAND GSM/GPRS
DATA SHEET
Table 4. SKY77517–21 Electrical Specifications 1 (3 of 5)
GSM850 Mode (f = 824 to 849 MHz and PIN = 0 to 6 dBm) [continued]
Parameter
Symbol
Test Condition
Minimum Typical Maximum Units
Spurious
Load mismatch
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Spur
Load
RX Band Spurious
RX_SPUR
Power control dynamic range
PCDR
Power control
variation
Control level 5-15
(VCC ≥ 3.3 V)
PCV
Control level 16-19
All combinations of the following
parameters:
VRAMP = controlled 2
PIN = min. to max.
VCC = 2.7 V to 4.8 V
Load VSWR = 12:1, all phase angles
All combinations of the following
parameters:
VRAMP = controlled 2
PIN = min. to max.
VCC = 2.7 V to 4.8 V
Load VSWR = 20:1, all phase angles
At f0 + 20 MHz (869 to 894 MHz)
RBW = 100 kHz
VCC = 3.3 V
5 dBm ≤ POUT ≤ 33 dBm
TCASE = 25 °C
At 1930 to 1990 MHz
RBW = 100 kHz
VCC = 3.3 V
TCASE = 25 °C
5 dBm ≤ POUT ≤ 33 dBm
POUT 13 to 33 dBm
TCASE = 25 °C
POUT 13 to 33 dBm
POUT 5 to 11 dBm
TCASE = 25 °C
POUT 5 to 11 dBm
No parasitic oscillation > –36 dBm
No module damage or permanent degradation
⎯ –84 –83
dBm
⎯ –101 –84
30 50
–1.0 ⎯
–1.5 ⎯
–2.0 ⎯
–3.5 ⎯
⎯ dB
1.0
1.5
dB
2.0
3.5
Power control slope
PCS
5 to 33 dBm
⎯ ⎯ 150 dB/V
GSM850 RECEIVE (f = 869 to 894 MHz) Mode = GSM_RX
Parameter
Frequency range
Insertion Loss, ANT to GSM_RX 4
VSWR ANT, GSM_RX 4
Symbol
f
IL GSM_RX
ΓIN, ΓOUT
Test Condition
—
—
—
Minimum
869
⎯
⎯
Typical
⎯
1.0
1.2:1
Maximum
894
1.3
1.5:1
Units
MHz
dB
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200784A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • November 6, 2007
5
5 Page 
SKY77517-21 TX–Rx iPAC™ FEM FOR DUAL-BAND GSM/GPRS
DATA SHEET
1 20 19 18 17 16
VLOGIC 2
VRAMP 3
TX_EN 4
www.DataSheet4U.com
BS 5
GROUND PAD
15 GND
14 GND
13 GND
12 GND
6 7 8 9 10 11
Pad layout as seen from top view looking through the package. 200494_005
Figure 5. SKY77517–21 FEM Package Pad Configuration – 20-
Pad Leadless (Top View)
Figure 6. Typical Case Markings
Table 5. SKY77517–21 Pad Names and Signal Descriptions
Pad Name
Description
1 VBATT
2 VLOGIC
3 VRAMP
4 TX_EN
5 BS
6 PCS_RX
7 GSM_RX
8 GND
9 GND
10 GND
11 ANT
12 GND
13 GND
14 GND
15 GND
16 GND
17 GSM_IN
18 NC
19 PCS_IN
20 GND
GND PADS GROUND GRID
Battery input voltage
Control logic level selection/Standby control
Analog power control voltage input
TX / RX select (mode control)
Band Select (mode control)
PCS Receive RF Output (1930-1990 MHz)
GSM Receive RF Output (869-894 MHz)
RF and DC Ground
RF and DC Ground
RF and DC Ground
RF_IN / RF_OUT to Antenna
RF and DC Ground
RF and DC Ground
RF and DC Ground
RF and DC Ground
RF and DC Ground
RF input 824–849 MHz
No Connect
RF input 1850–1910 MHz
RF and DC Ground
Ground Pads, module underside
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77517–21 is capable of withstanding an MSL3/250 °C
solder reflow. Care must be taken when attaching this product,
whether it is done manually or in a production solder reflow
environment. If the part is attached in a reflow oven, the
temperature ramp rate should not exceed 3 °C per second;
maximum temperature should not exceed 250 °C. If the part is
manually attached, precaution should be taken to insure that the
part is not subjected to temperatures exceeding 250 °C for more
than 10 seconds. For details on attachment techniques,
precautions, and handling procedures recommended by
Skyworks, please refer to Skyworks Application Note: PCB Design
and SMT Assembly/Rework, Document Number 101752.
Additional information on standard SMT reflow profiles can also
be found in the JEDEC Joint Industry Standard J-STD-020.
Production quantities of this product are shipped in the standard
tape-and-reel format (see Figure 7). For additional packaging
details, refer to Skyworks Application Note: Tape and Reel
Information – RF Modules, Document Number 101568.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200784A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • November 6, 2007
11
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| PDF Descargar | [ Datasheet SKY77517-21.PDF ] | |
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