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PDF TS2026L Data sheet ( Hoja de datos )
| Número de pieza | TS2026L | |
| Descripción | Dual-Channel Power Distribution Switch | |
| Fabricantes | Taiwan Semiconductor Company | |
| Logotipo |  |
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TS2026L
Dual-Channel Power Distribution Switch
Pin assignment:
1. ENA 5. OUTB
2. FLGA 6. GND
3. FLGB 7. IN
4. ENB 8. OUTA
140mΩ max. on-resistance per channel
2.7V to 5.5V operating range
Under voltage lockout
www.DataSheet4GUe.cnomeral Description
The TS2026L is high-side MOSFET switches optimized for general-purpose power distribution requiring circuit
protection.
The TS2026L are internally current limited and have thermal shutdown that protects the device and load. When a
thermal shutdown fault occurs, the output is latched off until the faulty load is removed. Removing that load or toggling
the enable input will reset the device output. Both device employ soft-start circuitry that minimized inrush current in
application where highly capacitive loads are employed. A fault status output flag is asserted during over current and
thermal shutdown conditions. Transient faults are internally filtered.
Features
140mΩ max. on-resistance per channel
2.7V to 5.5V operating range
500mA min. continuous current per channel
Short-circuit protection with thermal shutdown
Thermal isolated channels.
Fault status flag with 3ms filter eliminates false
assertions.
Under voltage lockout
Reverse current flow blocking (no “body diode”)
Logic-compatible inputs
Soft-start circuit
Low quiescent current
Applications
USB peripherals
General purpose power switching
ACPI power distribution
Notebook PCs
PDAsPC
Card hot swap
Ordering Information
Part No.
TS2026LCS
Operating Temp.
(Ambient)
-40 ~ +85 oC
Package
SOP-8
Absolute Maximum Rating
Supply Voltage
Fault Flag Voltage
Fault Flag Current
Output Voltage
Output Current
Enable input
Storage Temperature
VIN
VFLG
IFLG
VOUT
IOUT
IEN
TSTG
+6
+6
25
+6
Internal Limited
-0.3 ~ +3
-65 ~ +150
V
V
mA
oC
V
oC
TS2026L
1-7 2005/11 rev. A
1 page  
Function Description
Input and Output
IN is the power supply connection to the logic circuitry and the drain of the output MOSFET. OUT is the source of
the output MOSFET. In a typical circuit, current flows from IN to OUT toward the load. If VOUT is greater than VIN,
current will flow from OUT to IN, since the switch is bidirectional when enabled. The output MOSFET and driver
circuitry are also designed to allow the MOSFET source to be externally forced to a higher voltage than the drain
(VOUT > VIN ) when the switch is disabled. In this situation, the TS2026 prevents undesirable current flow from OUT
to IN.
Thermal Shutdown
www.DataSheet4UT.choemrmal shutdown is employed to protect the device from damage should the die temperature exceed safe margins
due mainly to short circuit faults. Each channel employs its own thermal sensor. Thermal shutdown shuts off the
output MOSFET and asserts the FLG output if the die temperature reaches 140 oC and the overheated channel is in
current limit. The over channel will be shut off. Upon determining a thermal shutdown condition. The TS2026 will
automatically reset its output when the die temperature cools down to 120 oC . The TS2026 output and FLG signal
will continue to cycle on and off until the device is disabled or the fault is removed. Figure 1. Depicts typical timing.
Depending on PCB layout, package, ambient temperature, etc., it may take several hundred milliseconds from the
incidence of the fault to the output MOSFET being shut off. This time will be shortest in the case of dead short on
the output.
Power Dissipation
The device’s junction temperature depends on several factors such as the load, PCB layout, ambient temperature
and package type. Equations that can be used to calculate power dissipation of each channel and junction
temperature are found below.
PD = RDS(ON) x IOUT2
Total power dissipation of the device will be the summation of PD for both channels. To relate this to junction
temperature, the following equation can be used:
TJ = PD x θJA + TA
Where:
TJ = junction temperature
TA = ambient temperature
θJA = is the thermal resistance of the package
Current Sensing and Limiting
The current-limit threshold is preset internally. The preset level prevents damage to the device and external load but
still allows a minimum current of 500mA to be delivered to the load. The current-limit circuit senses a portion of the
output MOSFET switch current. The current-sense resistor shown in the block diagram is virtual and has no voltage
drop. The reaction to an over current condition varies with three scenarios.
Switch Enable into Short-Circuit
If a switch is enabled into a heavy load or short-circuit, the switch immediately enters into a constant-current mode,
reducing the output voltage. The FLG signal is asserted indicating an over current condition.
Switch Enable Applied to Enabled Output
When a heavy load or short-circuit is applied to an enabled switch, a large transient current may flow until the
current limit circuitry responds. Once this occurs the device limits current to less than the short circuit current limit
specification.
Current-Limit Response-Ramped Load
The TS2026 current-limit profile exhibits a small fold back effect of about 200mA. Once this current-limit threshold is
exceeded the device switches into a constant current mode. It is important to note that the device will supply current
up to the current-limit threshold
TS2026L
5-7 2005/11 rev. A
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet TS2026L.PDF ] | |
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