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WF5027 데이터시트 PDF




Nippon Precision Circuits에서 제조한 전자 부품 WF5027은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


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부품번호 WF5027 기능
기능 Crystal Oscillator Module ICs
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WF5027 데이터시트, 핀배열, 회로
www.datasheet4u.com
WF5027 series
Crystal Oscillator Module ICs
OVERVIEW
The WF5027 series are miniature crystal oscillator module ICs. The oscillator circuit stage has voltage regula-
tor drive, significantly reducing current consumption and crystal current, compared with existing devices, and
significantly reducing the oscillator characteristics supply voltage dependency. There are 3 pad layout package
options available for optimized mounting, making these devices ideal for miniature crystal oscillators.
FEATURES
I Wide range of operating supply voltage: 1.60 to 3.63V
I Regulated voltage drive oscillator circuit for reduced
power consumption and crystal drive current
I Optimized low crystal drive current oscillation for
miniature crystal units
I 3 pad layout options for mounting
• 5027A×, M×, Q× series: for Flip Chip Bonding
• 5027B×, N×, R× series: for Wire Bonding (type I)
• 5027C×, P×, S× series: for Wire Bonding (type II)
I Recommended oscillation frequency range
For fundamental oscillator
• Low frequency version: 20MHz to 60MHz
• High frequency version: 60MHz to 100MHz
For 3rd overtone oscillator
• Low frequency version: 40MHz to 110MHz
• High frequency version*1: 110MHz to 180MHz
*1: under development
I Multi-stage frequency divider for low-frequency
output support: 0.9MHz (min)
I Frequency divider built-in (for fundamental oscil-
lator)
• Selectable by version: fO, fO/2, fO/4, fO/8, fO/16,
fO/32, fO/64
I 40 to 85°C operating temperature range
I Standby function
• High impedance in standby mode, oscillator
stops
I CMOS output duty level (1/2VDD)
I 50 ± 5% output duty
I 15pF output drive capability
I Wafer form (WF5027××)
Chip form (CF5027××)
APPLICATIONS
I 3.2 × 2.5, 2.5 × 2.0, 2.0 × 1.6 size miniature crystal oscillator modules
ORDERING INFORMATION
Device
WF5027××–4
CF5027××–4
Package
Wafer form
Chip form
SEIKO NPC CORPORATION —1




WF5027 pdf, 반도체, 판매, 대치품
WF5027 series
VERSION DISCRIMINATION INTERNAL COMPONENTS
The WF5027 series device version is not determined solely by the mask pattern, but can also be determined by
the trimming of internal trimming fuses.
www.datasheIetV4ue.rcsoimon determined by laser trimming:
These chips are produced from a common device by the laser trimming of fuses corresponding to the ordered
version, shown in table 1. These devices are shipped for electrical characteristics testing. Laser-trimmed ver-
sions are identied externally by the combination of the version name marking (1) and the locations of
trimmed fuses (2).
I Version determined by mask pattern:
These chips are fabricated using the mask corresponding to the ordered version, and do not require trimming.
Mask-fabricated versions are identied externally by the version name marking (1) only.
Since the WF5027 series devices are manufactured using 2 methods, there are 2 types of IC chip available
(identied externally) for the same version name. The identication markings for all WF5027 series device
versions is shown in table 2.
(750,690)
(1) Version code on die
NPC (2) Trimming fuses
F1 F2 F3 F4 F5 F6 F7 F8 F9
SEIKO NPC CORPORATION —4

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WF5027 전자부품, 판매, 대치품
WF5027 series
Table 4. Version identification by version name and chip markings (for 3rd overtone oscillator)
Version set by trimming fuses
Version set by mask pattern
www.datasheet4Vuer.scioomn
name Version code
Trimming fuses*1
Trimming
Version code fuses
on chip
on chip
F1 F2 F3 F4 F5 F6 F7 F8 F9
F1 to F9
5027MA
MX
−−−−−−×××
MA
5027MB
MX
−×−−−−−××
MB
5027MC
MX
××−−×−×−×
MC
5027MD
MX
−××××−×−×
MD
5027NA
NX
−−−−−−×××
NA
5027NB
5027NC
NX
NX
−×−−−−−××
××−−×−×−×
NB
Untrimmed
NC
5027ND
NX
−××××−×−×
ND
5027PA
PX
−−−−−−×××
PA
5027PB
PX
−×−−−−−××
PB
5027PC
PX
××−−×−×−×
PC
5027PD
PX
−××××−×−×
PD
(5027QE)
(5027QF)
(5027RE)
(5027RF)
TBD
(5027SE)
(5027SF)
*1. : untrimmed, ×: trimmed
SEIKO NPC CORPORATION —7

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