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부품번호 | B3S 기능 |
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기능 | Mechanical Key Switch | ||
제조업체 | Omron Electronics | ||
로고 | |||
전체 5 페이지수
Mechanicalwww.datasheet4u.com Key Switch (SMD)
Surface-mounted Device (SMD) Design
Meets High-density Mounting
Requirements
The whole switch body can be washed after
soldering due to its sealing property.
Sealed construction provides high reliability in
dusty environments.
Available with ground terminal for protection
against static electricity.
Positive tactile feedback.
Fully sealed.
B3S
Ordering Information
6 6-mm-type B3S-1000 Series
Operating force (OF)
Without ground terminal
Bags
Embossed tape
(see note)
General-purpose 1.57 N (160 gf)
B3S-1000
B3S-1000P
High-force
2.25 N (230 gf)
B3S-1002
B3S-1002P
Note: Switches on embossed tape must be ordered in units of 1,000.
With ground terminal
Bags
Embossed tape
(see note)
B3S-1100
B3S-1100P
B3S-1102
B3S-1102P
Specifications
Ratings/Characteristics
Switching capacity
Insulation voltage
Contact configuration
Contact resistance
Insulation resistance
Dielectric strength
Bounce time
Vibration resistance
Shock resistance
Life expectancy
Ambient temperature
Ambient humidity
Weight
5 to 24 VDC, 1 to 30 mA (resistive load)
30 VDC
SPST-NO
100 mΩ max. (initial value) (Rated 5 VDC, 1 mA)
100 MΩ min. (at 250 VDC)
500 VAC, 50/60 Hz for 1 min
5 ms max.
Malfunction: 10 to 55 Hz, 1.5-mm double amplitude
Destruction: 1,000 m/s2 min. (approx. 100G min.)
Malfunction: 100 m/s2 min. (approx. 10G min.)
General-purpose models:
High-force models:
500,000 operations min.
300,000 operations min.
Operating: –25°C to 70°C (with no icing)
Operating: 35% to 85%
Approx. 0.30 g
1
B3S
Dimensions
Note: All units are in millimeters unless otherwise indicated.
Without Ground Terminal
B3S-1000
B3S-1002
www.datasheet4u.com
3.3
dia.
With Ground Terminal
B3S-1100
B3S-1102
3.3
dia.
B3S
PCB Mounting
(Top View)
Terminal Arrangement
/Internal Connections
(Top View)
PCB Mounting
(Top View)
Terminal Arrangement
/Internal Connections
(Top View)
Precautions
Reflow Soldering
Attach a thermocouple to one side of the terminal with high-temper-
ature solder and use the thermocouple to set the reflow oven to a
peak terminal temperature of 230°±5°C. The optimum heating
curve is shown below.
10 s max.
1 to 4°C/s
1 to 5°C/s
Normal
temperature
60 to 90 s
20 s 30 s
max.
Time (s)
Note: The above heating curve applies if the
thickness of the circuit board is 1.6 mm.
Do not apply additional force to the plunger once it has stopped
moving.
Do not repeatedly press the plunger off-center or from an acute
angle.
B3S Switches are designed to allow submersed washing after sol-
dering. When washing, follow the guidelines given below:
1. Clean with alcohol solvents. Do not use chlorine solvents or
water.
2. When using ultrasonic cleaning in two- or three-tank systems
and do not clean for more than one minute at a time or for
more than three minutes total.
3. Do not apply external force to the Switch while washing.
4. Do not wash immediately after soldering. If possible, allow
components to stand for at least three minutes before
washing.
5. The Switch cannot be used where subject to direct contact
with water.
4
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