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FAN21SV06 데이터시트 PDF




Fairchild Semiconductor에서 제조한 전자 부품 FAN21SV06은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 FAN21SV06 자료 제공

부품번호 FAN21SV06 기능
기능 Integrated Synchronous Buck Regulator
제조업체 Fairchild Semiconductor
로고 Fairchild Semiconductor 로고


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FAN21SV06 데이터시트, 핀배열, 회로
December 2008
FAN21SV06www.datasheet4u.com — TinyBuck™
6A, 24V Single-Input Integrated Synchronous Buck
Regulator with Synchronization Capability
Features
ƒ Single-Supply Operation with 6A Output Current
ƒ Over 94% Efficiency
ƒ Fully Synchronous Operation with Integrated
Schottky Diode on Low-Side MOSFET Boosts
Efficiency
ƒ Single Supply Device for VIN > 6.5V – 24V
ƒ Programmable Frequency Operation (200-600KHz)
ƒ Externally Synchronizable Clock with Master/Slave
Provisions
ƒ Wide Input Range with Dual Supply: 3.0V to 24V
ƒ Output Voltage Range: 0.8V to 80%VIN
ƒ Power-Good Signal
ƒ Accepts Ceramic Capacitors on Output
ƒ External Compensation for Flexible Design
ƒ Starts Up on Pre-Bias Outputs
ƒ Integrated Bootstrap Diode
ƒ Programmable Over-Current Protection
ƒ Under-Voltage, Over-Voltage, and Thermal-
Shutdown Protections
ƒ 5x6mm, 25-pin, 3-pad MLP
Applications
ƒ Servers & Telecom
ƒ Graphics Cards & Displays
ƒ High-End Computing Systems
ƒ Set-Top Boxes & Game Consoles
ƒ Point-of-Load Regulation
Description
The FAN210SV06 TinyBuckTM is a highly efficient,
small-footprint, programmable-frequency, 6A integrated
synchronous buck regulator.
FAN21SV06 contains both synchronous MOSFETs and
a controller/driver with optimized interconnects in one
package, which enables designers to solve high-current
requirements in a small area with minimal external
components, thereby saving cost. On-board internal 5V
regulator enables single-supply operation for input
voltages >6.5V.
The FAN21SV06 can be configured to drive multiple
slave devices OR synchronize to an external system
clock. In slave mode, FAN21SV06 may be set up to be
free-running in the absence of a master clock signal.
External compensation, programmable switching
frequency, and current-limit features allow for design
optimization and flexibility. High-frequency operation
allows for all ceramic solutions.
Fairchild’s advanced BiCMOS power process combined
with low-RDS(ON) internal MOSFETs and a thermally
efficient MLP package provide the ability to dissipate
high power in a small package. Integration helps to
minimize critical inductances making layout simpler and
more efficient compared to discrete solutions.
Output over-voltage, under-voltage, over-current and
thermal-shutdown protections help protect the device
from damage during fault conditions. FAN21SV06
prevents pre-biased output discharge during startup in
point-of-load applications.
Ordering Information
Operating
Eco
Part Number Temperature Range Status
Package
Packing
Method
FAN21SV06MPX
-10°C to 85°C
RoHS Molded Leadless Package (MLP) 5x6mm Tape and Reel
FAN21SV06EMPX
-40°C to 85°C
RoHS Molded Leadless Package (MLP) 5x6mm Tape and Reel
© 2006 Fairchild Semiconductor Corporation
FAN21SV06 Rev. 1.0.0
www.fairchildsemi.com




FAN21SV06 pdf, 반도체, 판매, 대치품
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
www.datasheet4uP.caomrameter
VIN, VIN_Reg to
AGND
5V_Reg to AGND
BOOT to PGND
BOOT to SW
SW to PGND
All other pins
ESD
Conditions
AGND=PGND
AGND=PGND
Continuous
Transient (t < 20ns, f < 600KHz)
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
Min.
-0.5
-0.5
-5
-0.3
1.5
2.5
Max.
28
6
35
6.0
24.0
30
6.0
Units
V
V
V
V
V
V
V
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
fSW
VIN,
VIN_Reg
Parameter
Switching Frequency
Supply Voltage for Power and Bias
TA Ambient Temperature
TJ Junction Temperature
Conditions
VIN to PGND
VIN_Reg to AGND
FAN21SV06MX
FAN21SV06EMX
Min.
200
3.0
6.5
-10
-40
Typ.
500
Max Units
600 KHz
24.0 V
24.0 V
+85 °C
+85 °C
+125 °C
Thermal Information
Symbol
Parameter
Min.
Typ.
Max. Units
TSTG
TL
Storage Temperature
Lead Soldering Temperature, 30sec
P1 (Q2)
-65
+150
°C
+300
°C
4 °C/W
θJC
θJ-PCB
PD
Thermal Resistance: Junction-to-Case P2 (Q1)
P3
Thermal Resistance: Junction-to-Mounting Surface(1)
Total Power Dissipation in the package, TA=25°C(1)
7
4
35(1)
°C/W
°C/W
°C/W
2.8 W
Note:
1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 37. Actual results
are dependent upon mounting method and surface related to the design.
© 2006 Fairchild Semiconductor Corporation
FAN21SV06 Rev. 1.0.0
4
www.fairchildsemi.com

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FAN21SV06 전자부품, 판매, 대치품
Typical Characteristics
1.010
1.20
www.datasheet41u..0c0o5m
1.000
1.10
1.00
0.995
0.90
0.990
-50
0 50 100
Temperature (oC)
150
Figure 4. Reference Voltage (VFB) vs. Temperature,
Normalized
0.80
-50
0 50 100
Temperature (oC)
Figure 5. Reference Bias Current (IFB) vs.
Temperature, Normalized
150
1500
1.02
1200
900
600
300
1.01
600KHz
1.00
300KHz
0.99
0
0 20 40 60 80 100 120
RT (KΩ)
Figure 6. Frequency vs. RT (Master)
0.98
140 -50
0 50 100
Temperature (oC)
150
Figure 7. Frequency vs. Temperature, Normalized
1.60
1.40
1.20
1.00
0.80
0.60
-50
Q1 ~0.32 %/oC
Q2 ~0.35 %/oC
0 50 100
Temperature (oC)
150
Figure 8. RDS vs. Temperature, Normalized
(5V_Reg=VGS=5V)
1.04
1.02
1.00
0.98
0.96
-50
0 50 100
Temperature (oC)
150
Figure 9. ILIM Current (IILIM) vs. Temperature,
Normalized
© 2006 Fairchild Semiconductor Corporation
FAN21SV06 Rev. 1.0.0
7
www.fairchildsemi.com

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