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PDF ADXL345 Data sheet ( Hoja de datos )
| Número de pieza | ADXL345 | |
| Descripción | Digital Accelerometer | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Data Sheet
3-Axis, ±2 g/±4 g/±8 g/±16 g
Digital Accelerometer
ADXL345
FEATURES
GENERAL DESCRIPTION
Ultralow power: as low as 23 µA in measurement mode and
0.1 µA in standby mode at VS = 2.5 V (typical)
Power consumption scales automatically with bandwidth
User-selectable resolution
Fixed 10-bit resolution
Full resolution, where resolution increases with g range,
up to 13-bit resolution at ±16 g (maintaining 4 mg/LSB
scale factor in all g ranges)
Embedded memory management system with FIFO
technology minimizes host processor load
Single tap/double tap detection
Activity/inactivity monitoring
Free-fall detection
Supply voltage range: 2.0 V to 3.6 V
I/O voltage range: 1.7 V to VS
SPI (3- and 4-wire) and I2C digital interfaces
Flexible interrupt modes mappable to either interrupt pin
Measurement ranges selectable via serial command
Bandwidth selectable via serial command
Wide temperature range (−40°C to +85°C)
10,000 g shock survival
Pb free/RoHS compliant
Small and thin: 3 mm × 5 mm × 1 mm LGA package
APPLICATIONS
Handsets
Medical instrumentation
Gaming and pointing devices
Industrial instrumentation
Personal navigation devices
Hard disk drive (HDD) protection
The ADXL345 is a small, thin, ultralow power, 3-axis accelerometer
with high resolution (13-bit) measurement at up to ±16 g. Digital
output data is formatted as 16-bit twos complement and is acces-
sible through either a SPI (3- or 4-wire) or I2C digital interface.
The ADXL345 is well suited for mobile device applications. It
measures the static acceleration of gravity in tilt-sensing appli-
cations, as well as dynamic acceleration resulting from motion
or shock. Its high resolution (3.9 mg/LSB) enables measurement
of inclination changes less than 1.0°.
Several special sensing functions are provided. Activity and
inactivity sensing detect the presence or lack of motion by
comparing the acceleration on any axis with user-set thresholds.
Tap sensing detects single and double taps in any direction. Free-
fall sensing detects if the device is falling. These functions can
be mapped individually to either of two interrupt output pins.
An integrated memory management system with a 32-level first in,
first out (FIFO) buffer can be used to store data to minimize host
processor activity and lower overall system power consumption.
Low power modes enable intelligent motion-based power
management with threshold sensing and active acceleration
measurement at extremely low power dissipation.
The ADXL345 is supplied in a small, thin, 3 mm × 5 mm × 1 mm,
14-lead, plastic package.
FUNCTIONAL BLOCK DIAGRAM
VS VDD I/O
ADXL345
POWER
MANAGEMENT
3-AXIS
SENSOR
SENSE
ELECTRONICS
ADC
DIGITAL
FILTER
CONTROL
AND
INTERRUPT
LOGIC
INT1
INT2
32 LEVEL
FIFO
SERIAL I/O
SDA/SDI/SDIO
SDO/ALT
ADDRESS
SCL/SCLK
GND
CS
Figure 1.
Rev. E
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2009–2015 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
1 page  
Data Sheet
ADXL345
Parameter
TEMPERATURE
Operating Temperature Range
WEIGHT
Device Weight
Test Conditions
Min Typ1
−40
30
Max Unit
+85 °C
mg
1 The typical specifications shown are for at least 68% of the population of parts and are based on the worst case of mean ±1 σ, except for 0 g output and sensitivity,
which represents the target value. For 0 g offset and sensitivity, the deviation from the ideal describes the worst case of mean ±1 σ.
2 Cross-axis sensitivity is defined as coupling between any two axes.
3 Bandwidth is the −3 dB frequency and is half the output data rate, bandwidth = ODR/2.
4 The output format for the 3200 Hz and 1600 Hz ODRs is different than the output format for the remaining ODRs. This difference is described in the Data Formatting of
Upper Data Rates section.
5 Output data rates below 6.25 Hz exhibit additional offset shift with increased temperature, depending on selected output data rate. Refer to the Offset Performance at
Lowest Data Rates section for details.
6 Self-test change is defined as the output (g) when the SELF_TEST bit = 1 (in the DATA_FORMAT register, Address 0x31) minus the output (g) when the SELF_TEST bit =
0. Due to device filtering, the output reaches its final value after 4 × τ when enabling or disabling self-test, where τ = 1/(data rate). The part must be in normal power
operation (LOW_POWER bit = 0 in the BW_RATE register, Address 0x2C) for self-test to operate correctly.
7 Turn-on and wake-up times are determined by the user-defined bandwidth. At a 100 Hz data rate, the turn-on and wake-up times are each approximately 11.1 ms. For
other data rates, the turn-on and wake-up times are each approximately τ + 1.1 in milliseconds, where τ = 1/(data rate).
Rev. E | Page 5 of 40
5 Page 
Data Sheet
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–40 –20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Figure 22. X-Axis Sensitivity vs. Temperature—
Eight Parts Soldered to PCB, VS = 2.5 V, Full Resolution
280
275
270
265
260
255
250
245
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235
230
–40 –20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Figure 23. Y-Axis Sensitivity vs. Temperature—
Eight Parts Soldered to PCB, VS = 2.5 V, Full Resolution
280
275
270
265
260
255
250
245
240
235
230
–40 –20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Figure 24. Z-Axis Sensitivity vs. Temperature—
Eight Parts Soldered to PCB, VS = 2.5 V, Full Resolution
ADXL345
280
275
270
265
260
255
250
245
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230
–40 –20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Figure 25. X-Axis Sensitivity vs. Temperature—
Eight Parts Soldered to PCB, VS = 3.3 V, Full Resolution
280
275
270
265
260
255
250
245
240
235
230
–40
–20
0 20 40 60 80 100 120
TEMPERATURE (°C)
Figure 26. Y-Axis Sensitivity vs. Temperature—
Eight Parts Soldered to PCB, VS = 3.3 V, Full Resolution
280
275
270
265
260
255
250
245
240
235
230
–40 –20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Figure 27. Z-Axis Sensitivity vs. Temperature—
Eight Parts Soldered to PCB, VS = 3.3 V, Full Resolution
Rev. E | Page 11 of 40
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet ADXL345.PDF ] | |
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