|
|
PDF PRTR5V0U2D Data sheet ( Hoja de datos )
| Número de pieza | PRTR5V0U2D | |
| Descripción | Ultra Low Capacitance Double Rail-to-rail ESD Protection | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de PRTR5V0U2D (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
|
No Preview Available !
www.DataSheet4U.com
PRTR5V0U2D
Ultra low capacitance double rail-to-rail ESD protection
Rev. 01 — 28 April 2009
Product data sheet
1. Product profile
1.1 General description
Ultra low capacitance double rail-to-rail ElectroStatic Discharge (ESD) protection device in
a SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package.
The device is designed to protect two Hi-Speed data lines or high-frequency signal lines
from the damage caused by ESD and other transients.
PRTR5V0U2D integrates two ultra low capacitance rail-to-rail ESD protection channels
and one additional ESD protection diode to ensure signal line protection even if no supply
voltage is available.
1.2 Features
I ESD protection of two Hi-Speed data lines or high-frequency signal lines
I Ultra low input/output to ground capacitance: C(I/O-GND) = 1 pF
I ESD protection up to 8 kV
I IEC 61000-4-2, level 4 (ESD)
I Very low clamping voltage due to an integrated additional ESD protection diode
I Very low reverse current
I AEC-Q101 qualified (85 °C)
I Small SMD plastic package
1.3 Applications
I USB 2.0 interfaces
I Digital Video Interface (DVI)
I High Definition Multimedia Interface (HDMI)
I Mobile and cordless phones
I Personal Digital Assistants (PDA)
I Digital cameras
I Wide Area Network (WAN) / Local Area Network (LAN) systems
I PCs, notebooks, printers and other PC peripherals
1 page  
www.DNatXaSPheSete4Um.coicmonductors
PRTR5V0U2D
Ultra low capacitance double rail-to-rail ESD protection
6. Characteristics
Table 8. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Per channel
IR
C(I/O-GND)
reverse current
input/output to ground
capacitance
C(I/O-I/O)
input/output to input/output
capacitance
VF forward voltage
Zener diode
VRWM
VBR
Csup
reverse standoff voltage
breakdown voltage
supply pin to ground
capacitance
[1] Measured from pin 1, 3, 4 or 6 to ground.
[2] Measured from pin 1 or 6 to pin 3 or 4.
[3] Measured from pin 1, 3, 4 or 6 to pin 5.
[4] Measured from pin 5 to ground.
Conditions
VR = 5 V
f = 1 MHz;
V(I/O-GND) = 0 V
f = 1 MHz;
V(I/O-I/O) = 0 V
IF = 1 mA
f = 1 MHz;
VCC = 0 V
Min Typ Max Unit
[1] -
[1] -
[2] -
[3] -
< 1 100 nA
1.0 1.5 pF
0.6 -
pF
0.7 -
V
[4] -
[4] 6
[4] -
- 5.5 V
- 9V
16 -
pF
2.0
C(I/O-GND)
(pF)
1.6
006aaa483
1.2
0.8
0.4
0
012345
V(I/O-GND) (V)
Fig 2.
f = 1 MHz; Tamb = 25 °C
Input/output to ground capacitance as a
function of input/output to ground voltage;
typical values
1.0
C(I/O-I/O)
(pF)
0.8
006aaa484
0.6
0.4
0.2
0
012345
V(I/O-I/O) (V)
Fig 3.
f = 1 MHz; Tamb = 25 °C
Input/output to ground capacitance as a
function of input/output to input/output
voltage; typical values
PRTR5V0U2D_1
Product data sheet
Rev. 01 — 28 April 2009
© NXP B.V. 2009. All rights reserved.
5 of 12
5 Page 
www.DNatXaSPheSete4Um.coicmonductors
PRTR5V0U2D
Ultra low capacitance double rail-to-rail ESD protection
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet Development
Preliminary [short] data sheet Qualification
Product [short] data sheet
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
ESD protection devices — These products are only intended for protection
against ElectroStatic Discharge (ESD) pulses and are not intended for any
other usage including, without limitation, voltage regulation applications. NXP
Semiconductors accepts no liability for use in such applications and therefore
such use is at the customer’s own risk.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PRTR5V0U2D_1
Product data sheet
Rev. 01 — 28 April 2009
© NXP B.V. 2009. All rights reserved.
11 of 12
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet PRTR5V0U2D.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| PRTR5V0U2AX | Ultra low capacitance double rail-to-rail ESD protection diode | NXP Semiconductors |
| PRTR5V0U2D | Ultra Low Capacitance Double Rail-to-rail ESD Protection | NXP Semiconductors |
| PRTR5V0U2F | Ultra low capacitance double rail-to-rail ESD protection | NXP Semiconductors |
| PRTR5V0U2K | Ultra low capacitance double rail-to-rail ESD protection | NXP Semiconductors |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |