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ADP1612 PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 ADP1612
기능 (ADP1612 / ADP1613) 650 KHz /1.3 MHz Step-Up PWM DC-to-DC Switching Converter
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ADP1612 데이터시트, 핀배열, 회로
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650 kHz /1.3 MHz Step-Up
PWM DC-to-DC Switching Converters
ADP1612/ADP1613
FEATURES
Current limit
1.4 A for the ADP1612
2.0 A for the ADP 1613
Minimum input voltage
1.8 V for the ADP1612
2.5 V for the ADP1613
Pin-selectable 650 kHz or 1.3 MHz PWM frequency
Adjustable output voltage up to 20 V
Adjustable soft start
Undervoltage lockout
Thermal shutdown
8-lead MSOP
APPLICATIONS
TFT LCD bias supplies
Portable applications
Industrial/instrumentation equipment
TYPICAL APPLICATION CIRCUIT
L1
ADP1612/
VIN ADP1613
6 VIN
SW 5
ON
OFF
3 EN
CIN 1.3MHz
650kHz
7 FREQ
(DEFAULT)
FB 2
8 SS
COMP 1
CSS
GND
4
D1 VOUT
R1
R2
RCOMP
CCOMP
COUT
Figure 1. Step-Up Regulator Configuration
GENERAL DESCRIPTION
The ADP1612/ADP1613 are step-up dc-to-dc switching con-
verters with an integrated power switch capable of providing
an output voltage as high as 20 V. With a package height of less
than 1.1 mm, the ADP1612/ADP1613 are optimal for space-
constrained applications such as portable devices or thin film
transistor (TFT) liquid crystal displays (LCDs).
The ADP1612/ADP1613 operate in current mode pulse-width
modulation (PWM) with up to 94% efficiency. Adjustable
soft start prevents inrush currents when the part is enabled.
The pin-selectable switching frequency and PWM current-mode
architecture allow for excellent transient response, easy noise
filtering, and the use of small, cost-saving external inductors
and capacitors. Other key features include undervoltage lockout
(UVLO), thermal shutdown (TSD), and logic controlled enable.
The ADP1612/ADP1613 are available in the lead-free
8-lead MSOP.
100
VIN = 5V
90
fSW = 1.3MHz
TA = 25°C
80
70
60
50
ADP1612, VOUT = 12V
40
ADP1612, VOUT = 15V
ADP1613, VOUT = 12V
ADP1613, VOUT = 15V
30
1 10 100 1k
LOAD CURRENT (mA)
Figure 2. ADP1612/ADP1613 Efficiency for Various Output Voltages
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2009 Analog Devices, Inc. All rights reserved.




ADP1612 pdf, 반도체, 판매, 대치품
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ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, EN, FB to GND
FREQ to GND
COMP to GND
SS to GND
SW to GND
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
ESD (Electrostatic Discharge)
Human Body Model
Rating
−0.3 V to +6 V
−0.3 V to VIN + 0.3 V
1.0 V to 1.6 V
−0.3 V to +1.3 V
21 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
±5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination.
THERMAL RESISTANCE
Junction-to-ambient thermal resistance (θJA) of the package is
specified for the worst-case conditions, that is, a device soldered
in a circuit board for surface-mount packages. The junction-to-
ambient thermal resistance is highly dependent on the application
and board layout. In applications where high maximum power
dissipation exists, attention to thermal board design is required.
The value of θJA may vary, depending on PCB material, layout,
and environmental conditions.
Table 3.
Package Type
8-Lead MSOP
2-Layer Board1
4-Layer Board1
θJA
206.9
162.2
θJC
44.22
44.22
Unit
°C/W
°C/W
1 Thermal numbers per JEDEC standard JESD 51-7.
BOUNDARY CONDITION
Modeled under natural convection cooling at 25°C ambient
temperature, JESD 51-7, and 1 W power input with 2- and
4-layer boards.
ESD CAUTION
Rev. 0 | Page 4 of 28

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2.4
ADP1612
2.2
2.0 TA = +25°C
1.8
1.6 TA = –40°C
1.4 TA = +85°C
1.2
1.8 2.3 2.8 3.3 3.8 4.3 4.8
INPUT VOLTAGE (V)
Figure 10. ADP1612 Switch Current Limit vs. Input Voltage, VOUT = 5 V
2.0
ADP1612
1.8
1.6
TA = +25°C
1.4
1.2
TA = +85°C
TA = –40°C
1.0
1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3
INPUT VOLTAGE (V)
Figure 11. ADP1612 Switch Current Limit vs. Input Voltage, VOUT = 8 V
1.6
ADP1612
1.4
TA = –40°C
TA = +25°C
1.2
1.0 TA = +85°C
0.8
1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3
INPUT VOLTAGE (V)
Figure 12. ADP1612 Switch Current Limit vs. Input Voltage, VOUT = 15 V
ADP1612/ADP1613
3.4
ADP1613
3.2
3.0
TA = +25°C
2.8
2.6
2.4
2.2 TA = +85°C
TA = –40°C
2.0
2.5
3.0 3.5 4.0
INPUT VOLTAGE (V)
4.5
Figure 13. ADP1613 Switch Current Limit vs. Input Voltage, VOUT = 5 V
2.6
ADP1613
2.4
TA = +25°C
2.2
2.0 TA = –40°C
TA = +85°C
1.8
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
Figure 14. ADP1613 Switch Current Limit vs. Input Voltage, VOUT = 8 V
2.6
ADP1613
2.4
2.2
TA = –40°C
2.0
1.8
TA = +25°C
1.6 TA = +85°C
1.4
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
Figure 15. ADP1613 Switch Current Limit vs. Input Voltage, VOUT = 15 V
Rev. 0 | Page 7 of 28

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