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Número de pieza ADP1752
Descripción (ADP1752 / ADP1753) 800mA Low-Vin LDO Regulator
Fabricantes Analog Devices 
Logotipo Analog Devices Logotipo



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FEATURES
Maximum output current: 0.8 A
Input voltage range: 1.6 V to 3.6 V
Low shutdown current: <2 μA
Very low dropout voltage: 70 mV @ 0.8 A load
Initial accuracy: ±1%
Accuracy over line, load, and temperature: ±2%
7 fixed output voltage options with soft start
0.75 V to 2.5 V (ADP1752)
Adjustable output voltage option with soft start
0.75 V to 3.0 V (ADP1753)
High PSRR
65 dB @ 1 kHz
65 dB @ 10 kHz
54 dB @ 100 kHz
23 μV rms at 0.75 V output
Stable with small 4.7 μF ceramic output capacitor
Excellent load and line transient response
Current-limit and thermal overload protection
Power-good indicator
Logic-controlled enable
Reverse current protection
APPLICATIONS
Server computers
Memory components
Telecommunications equipment
Network equipment
DSP/FPGA/microprocessor supplies
Instrumentation equipment/data acquisition systems
GENERAL DESCRIPTION
The ADP1752/ADP1753 are low dropout (LDO) CMOS linear
regulators that operate from 1.6 V to 3.6 V and provide up to
800 mA of output current. These low VIN/VOUT LDOs are ideal
for regulation of nanometer FPGA geometries operating from
2.5 V down to 1.8 V I/O rails, and for powering core voltages
down to 0.75 V. Using an advanced proprietary architecture,
they provide high power supply rejection ratio (PSRR) and low
noise, and achieve excellent line and load transient response
with only a small 4.7 μF ceramic output capacitor.
The ADP1752 is available in seven fixed output voltage options.
The ADP1753 is the adjustable version, which allows output
0.8 A, Low VIN, Low Dropout
Linear Regulator
ADP1752/ADP1753
TYPICAL APPLICATION CIRCUITS
VIN = 1.8V
VOUT = 1.5V
4.7µF
100k
PG
16 15 14 13
VIN VIN VOUT VOUT
1 VIN
VOUT 12
2 VIN
3 VIN
ADP1752 VOUT 11
TOP VIEW
(Not to Scale) VOUT 10
4 EN
PG GND SS
5 67
SENSE 9
NC
8
4.7µF
10nF
VIN = 1.8V
Figure 1. ADP1752 with Fixed Output Voltage, 1.5 V
VOUT = 0.5V(1 + R1/R2)
4.7µF
100k
PG
16 15 14 13
VIN VIN VOUT VOUT
1 VIN
VOUT 12
2 VIN
3 VIN
ADP1753 VOUT 11
TOP VIEW
(Not to Scale) VOUT 10
4 EN
PG GND SS
567
ADJ 9
NC
8
4.7µF
R1
R2
10nF
Figure 2. ADP1753 with Adjustable Output Voltage, 0.75 V to 3.0 V
voltages that range from 0.75 V to 3.0 V via an external divider.
The ADP1752/ADP1753 allow an external soft start capacitor
to be connected to program the startup. A digital power-good
output allows power system monitors to check the health of the
output voltage.
The ADP1752/ADP1753 are available in a 16-lead, 4 mm × 4 mm
LFCSP, making them not only very compact solutions, but also
providing excellent thermal performance for applications that
require up to 800 mA of output current in a small, low profile
footprint.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2008–2009 Analog Devices, Inc. All rights reserved.

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ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN to GND
VOUT to GND
EN to GND
SS to GND
PG to GND
SENSE/ADJ to GND
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Rating
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−65°C to +150°C
−40°C to +125°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP1752/ADP1753 may be damaged if the
junction temperature limits are exceeded. Monitoring ambient
temperature does not guarantee that TJ is within the specified
temperature limits. In applications with high power dissipation
and poor thermal resistance, the maximum ambient tempera-
ture may need to be derated. In applications with moderate
power dissipation and low PCB thermal resistance, the maximum
ambient temperature can exceed the maximum limit as long as
the junction temperature is within specification limits. The
junction temperature (TJ) of the device is dependent on the
ambient temperature (TA), the power dissipation of the device
(PD), and the junction-to-ambient thermal resistance of the
package (θJA). TJ is calculated using the following formula:
TJ = TA + (PD × θJA)
ADP1752/ADP1753
Junction-to-ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θJA may vary, depending
on PCB material, layout, and environmental conditions. The
specified values of θJA are based on a 4-layer, 4 in × 3 in circuit
board. Refer to JEDEC JESD51-7 for detailed information about
board construction. For more information, see the AN-772
Application Note, A Design and Manufacturing Guide for the
Lead Frame Chip Scale Package (LFCSP) at www.analog.com.
ΨJB is the junction-to-board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a 4-layer board. The JESD51-12 document,
Guidelines for Reporting and Using Electronic Package Thermal
Information, states that thermal characterization parameters are
not the same as thermal resistances. ΨJB measures the component
power flowing through multiple thermal paths rather than
through a single path as in thermal resistance, θJB. Therefore,
ΨJB thermal paths include convection from the top of the package
as well as radiation from the package, factors that make ΨJB more
useful in real-world applications. Maximum junction temperature
(TJ) is calculated from the board temperature (TB) and the power
dissipation (PD) using the following formula:
TJ = TB + (PD × ΨJB)
Refer to the JEDEC JESD51-8 and JESD51-12 documents for more
detailed information about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA ΨJB Unit
16-Lead LFCSP with Exposed Pad (CP-16-4) 130 32.7 °C/W
ESD CAUTION
Rev. A | Page 5 of 20

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THEORY OF OPERATION
The ADP1752/ADP1753 are low dropout linear regulators that
use an advanced, proprietary architecture to provide high power
supply rejection ratio (PSRR) and excellent line and load transient
response with only a small 4.7 μF ceramic output capacitor.
Both devices operate from a 1.6 V to 3.6 V input rail and
provide up to 0.8 A of output current. Supply current in
shutdown mode is typically 2 μA.
ADP1752
VIN
UVLO
REVERSE POLARITY
PROTECTION
VOUT
GND
PG
EN
SHORT-CIRCUIT
AND THERMAL
PROTECTION
PG
DETECT
0.5V
REF
SHUTDOWN
SENSE
R1
R2
0.9µA
SS
VIN
GND
PG
EN
Figure 24. ADP1752 Internal Block Diagram
ADP1753
UVLO
REVERSE POLARITY
PROTECTION
VOUT
SHORT-CIRCUIT
AND THERMAL
PROTECTION
PG
DETECT
0.5V
REF
SHUTDOWN
ADJ
0.9µA
SS
Figure 25. ADP1753 Internal Block Diagram
Internally, the ADP1752/ADP1753 consist of a reference, an error
amplifier, a feedback voltage divider, and a PMOS pass transistor.
Output current is delivered via the PMOS pass transistor, which is
controlled by the error amplifier. The error amplifier compares the
reference voltage with the feedback voltage from the output and
amplifies the difference. If the feedback voltage is lower than the
reference voltage, the gate of the PMOS device is pulled lower,
allowing more current to pass and increasing the output voltage.
If the feedback voltage is higher than the reference voltage, the
gate of the PMOS device is pulled higher, allowing less current
to pass and decreasing the output voltage.
ADP1752/ADP1753
The ADP1752 is available in seven fixed output voltage options
between 0.75 V and 2.5 V. The ADP1752 allows for connection
of an external soft start capacitor that controls the output voltage
ramp during startup. The ADP1753 is the adjustable version
with an output voltage that can be set to a value between 0.75 V
and 3.0 V by an external voltage divider. Both devices are con-
trolled by an enable pin (EN).
SOFT START FUNCTION (ADP1752/ADP1753)
For applications that require a controlled startup, the ADP1752/
ADP1753 provide a programmable soft start function. The
programmable soft start is useful for reducing inrush current
upon startup and for providing voltage sequencing. To implement
soft start, connect a small ceramic capacitor from SS to GND.
Upon startup, a 0.9 μA current source charges this capacitor.
The ADP1752/ADP1753 start-up output voltage is limited by
the voltage at SS, providing a smooth ramp-up to the nominal
output voltage. The soft start time is calculated as follows:
tSS = VREF × (CSS/ISS)
(1)
where:
tSS is the soft start period.
VREF is the 0.5 V reference voltage.
CSS is the soft start capacitance from SS to GND.
ISS is the current sourced from SS (0.9 μA).
When the ADP1752/ADP1753 are disabled (using EN), the soft
start capacitor is discharged to GND through an internal 100 Ω
resistor.
2.50
2.25
EN
2.00
1.75
1nF
1.50
1.25
4.7nF
1.00
10nF
0.75
0.50
0.25
0
0 2 4 6 8 10
TIME (ms)
Figure 26. VOUT Ramp-Up with External Soft Start Capacitor
Rev. A | Page 11 of 20

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