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Número de pieza | L6711 | |
Descripción | 3 Phase controller | |
Fabricantes | STMicroelectronics | |
Logotipo | ||
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L6711
3 Phase controller with dynamic VID and selectable DACs
Features
■ 2A integrated gate drivers
■ Fully differential current reading across
inductor or LS MOSFET
■ 0.5% Output voltage accuracy
■ 6 bit programmable output from 0.8185V to
1.5810V in 12.5mV steps
■ 5 bit programmable output from 0.800V to
1.550V in 25mV steps
■ Dynamic VID management
■ Adjustable reference voltage offset
■ 3% active current sharing accuracy
■ Digital 2048 step soft-start
■ Programmable over voltage protection
■ Integrated temperature sensor
■ Constant over current protection
■ Oscillator internally fixed at 150kHz (450kHz
ripple) externally adjustable
■ Output enable
■ Integrated remote sense buffer
■ TQFP48 7x7 Package with exposed pad
Applications
■ High current VRM/VRD for desktop / Server /
Workstation CPUs
■ High density DC/DC Converters
TQFP48 (Exposed Pad)
Description
The device implements a three phase step-down
controller with a 120° phase-shift between each
phase with integrated high current drivers in a
compact 7x7mm body package with exposed pad.
The device embeds selectable DAC: the output
voltage ranges from 0.8185V to 1.5810V with
12.5mV steps (VID_SEL = OPEN) or from 0.800V
to 1.550V with 25mV steps (VID_SEL = GND;
VID5 drives an optional +25mV offset) managing
dynamic VID with 0.5% accuracy over line and
temp variations. Additional programmable offset
can be added to the voltage reference with a
single external resistor.
The device assures a fast protection against load
over current and load over/under voltage. An
internal crowbar is provided turning on the low
side mosfet if an over-voltage is detected.
In case of over-current, the system works in
Constant Current mode until UVP.
Selectable current reading adds flexibility in
system design.
Order codes
Part Number
L6711
L6711TR
Package
TQFP48
TQFP48
Packing
Tube
Tape & Reel
April 2006
Rev 4
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www.st.com
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Typical application circuit and block diagram
Figure 2. Typical application circuit for inductor DCR current sense
VIN LIN
GNDIN
VID5
VID4
VID3
VID2
VID1
VID0
VID_SEL
OUTEN
CF
RF
RFB
L6711 REF. SCH. (INDUCTOR)
1
VCCDR1
41
VCCDR2
38
VCCDR3
45
BOOT1
4
VCC
5,31
SGND
22
OSC/FAULT
6
OFFSET
20
TC
21
CS_SEL
9
OVP
46
UGATE1
47
PHASE1
2
LGATE1
3
PGND1
14
CS1-
Rg
15
CS1+
Rg(a)
44
BOOT2
43
UGATE2
23
VID5
28
VID4
27
VID3
26
VID2
25
VID1
24
VID0
29
VID_SEL
13
OUTEN
7
COMP
42
PHASE2
40
LGATE2
39
PGND2
16
CS2-
Rg
17
CS2+
34
BOOT3
Rg(a)
33
UGATE3
8
FB
32
PHASE3
36
LGATE3
35
PGND3
10
VSEN
11
FBR
12
FBG
N.C.
18
CS3-
19
CS3+
30
SS_END
N.C.
37 48
R
Rg(a)
CIN
HS1
L1
LS1
Rg(RC)
Cg
HS2
L2
LS2
Rg(RC)
Cg
COUT
HS3
L3
LS3
Rg(RC)
Cg
Vcc_core
LOAD
SS_END
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Pins description and connection diagrams
Table 1. Pins description (continued)
N° Name
Description
Channel 1 HS driver supply. This pin supplies the relative high side driver.
45 BOOT1 Connect through a capacitor (100nF Typ.) to the PHASE1 pin and through a diode to VCC
(cathode vs. boot).
Channel 1 HS driver output.
46 UGATE1
A little series resistor helps in reducing device-dissipated power.
47
PHASE1
Channel 1 HS driver return path. It must be connected to the HS1 mosfet source and provides
the return path for the HS driver of channel 1.
48 N.C. Not internally connected.
PAD
THERMAL
PAD
Thermal pad connects the silicon substrate and makes a good thermal contact with the PCB to
dissipate the power necessary to drive the external mosfets. Connect to the GND plane with
several vias to improve thermal conductivity.
11/50
11 Page |
Páginas | Total 50 Páginas | |
PDF Descargar | [ Datasheet L6711.PDF ] |
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