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NFSW036BT 데이터시트 PDF




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NFSW036BT 데이터시트, 핀배열, 회로
www.DataSheet4U.com
No. STSE-CC5129A
<Cat.No.051007>
SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED
MODEL : NFSW036BT
NICHIA CORPORATION
-0-




NFSW036BT pdf, 반도체, 판매, 대치품
www.DataSheet4U.com
Nichia STSE-CC5129A
<Cat.No.051007>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Standard
Test Item
Test Method
Resistance to
JEITA ED-4701
Soldering Heat
300 301
(Reflow Soldering)
Solderability
JEITA ED-4701
(Reflow Soldering)
300 303
Thermal Shock
JEITA ED-4701
300 307
Temperature Cycle
JEITA ED-4701
100 105
High Temperature Storage JEITA ED-4701
200 201
Temperature Humidity
JEITA ED-4701
Storage
100 103
Low Temperature Storage JEITA ED-4701
200 202
Steady State Operating Life
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
JEITA ED-4701
400 403
Substrate Bending
JEITA ED-4702
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
Ta=100°C
Ta=60°C, RH=90%
Ta=-40°C
Ta=25°C, IF=150mA
Tested with Nichia standard circuit board.
Ta=70°C, IF=100mA
Tested with Nichia standard circuit board.
60°C, RH=90%, IF=100mA
Tested with Nichia standard circuit board.
Ta=-40°C, IF=150mA
Tested with Nichia standard circuit board.
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s2
3direction, 4cycles
3mm, 5 ± 1 sec.
Note
2 times
Number of
Damaged
0/22
1 time
over 95%
20 cycles
100 cycles
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
500 hrs.
1000 hrs.
48min.
0/22
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/22
1 time
0/22
Adhesion Strength
JEITA ED-4702 5N, 10 ± 1 sec.
1 time
Electrostatic Discharges
JEITA ED-4701 R=1.5k, C=100pF
300 304
Test Voltage=2kV
3 times
Negative/Positive
Thermal resistance of LED with Nichia standard circuit board : Rja 120°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
0/22
0/22
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Item
Symbol Test Conditions
Min.
Max.
Forward Voltage
VF IF=150mA
- Initial Level
Luminous Flux
φv
IF=150mA
Initial Level 0.7
-
The test is performed after the board is cooled down to the room temperature.
1.1
-3-

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NFSW036BT 전자부품, 판매, 대치품
www.DataSheet4U.com
Nichia STSE-CC5129A
<Cat.No.051007>
(5) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Reflow Soldering
Hand Soldering
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Lead Solder
120 ~ 150°C
120 sec. Max.
240°C Max.
10 sec. Max.
refer to
Temperature - profile 1.
Lead-free Solder
180 ~ 200°C
120 sec. Max.
260°C Max.
10 sec. Max.
refer to
Temperature - profile 2.
(N2 reflow is recommended.)
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
After reflow soldering rapid cooling should be avoided.
[Temperature-profile (Surface of circuit board)]
<1 : Lead Solder>
2.5 ~ 5°C / sec.
240°C Max.
Pre-heating
10sec. Max.
2.5 ~ 5°C / sec. 120 ~ 150°C 60sec.Max.
Above 200°C
Use the conditions shown to the under figure.
<2 : Lead-free Solder>
1 ~ 5°C / sec.
260°C Max.
Pre-heating
10sec. Max.
1 ~ 5°C / sec.
180 ~ 200°C 60sec.Max.
Above 220°C
120sec.Max.
[Recommended soldering pad design]
4 .5
1 .4
120sec.Max.
Use the following conditions shown in the figure.
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow. It is recommended that the User use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package. The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used. It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
(6) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
-6-

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