|
|
PDF MMA621010AKEG Data sheet ( Hoja de datos )
| Número de pieza | MMA621010AKEG | |
| Descripción | Analog Dual Axis Micromachined Accelerometer | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de MMA621010AKEG (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
|
No Preview Available !
Freescale Semiconductor
Technical Data
MMA6222AKEG
Rev 0, 12/2009
Analog Dual Axis Micromachined
Accelerometer
The MMA62XXAKEG series of dual axis (X and Y) silicon capacitive,
micromachined accelerometers features a full digital signal processing for
filtering, trim and data formatting. It has been optimized for analog output and
offers an over-damped transducer.
Features
• Available in ±20/20g, ±50/50g, or ±100/100g versions. Additional g-ranges
between 20 and 100g may be available upon request
• Full-scale range is independently specified for each axis
• 400 Hz, 4 Pole, 16 µs sample time, additional filter options are available
• Ratiometric analog voltage output
• Capture/hold input for system-wide synchronization support
• 3.3 or 5 V single supply operation
• On-chip temperature sensor and voltage regulator
• Internal self-test
• Minimal external component requirements
• Pb-free 20-pin SOIC package
• Qualified AEC-Q100, Rev. F Grade 2 (-40°C/ +105°C)
Typical Applications
• Crash Detection (Airbag)
• Impact and vibration monitoring
• Shock detection
MMA6222AKEG
MMA6255AKEG
MMA621010AKEG
2-AXIS
ACCELEROMETER
KEG SUFFIX (Pb-free)
20-LEAD SOIC
CASE 475A-02
PIN CONNECTIONS
N/C
N/C
XOUT
VSSA
YOUT
CAP/HOLD
ST
VPP
CREG
RESET
1
2
3
4
5
6
7
8
9
10
20 N/C
19 N/C
18 CREGA
17 CREGA
16 CREF
15 CREF
14 VCC
13 VSS
12 STATUS
11 SCLK
20-PIN SOIC PACKAGE
N/C: NO INTERNAL CONNECTION
www.DataSheet4U.com
Device Name
X-Axis g-Level
MMA6222AEG
20
MMA6222AEGR2
20
MMA6222AKEG*
20
MMA6222AKEGR2*
20
MMA6255AEG
50
MMA6255AEGR2
50
MMA6255AKEG*
50
MMA6255AKEGR2*
50
MMA621010AEG
100
MMA621010AEGR2
100
MMA621010AKEG*
100
MMA621010AKEGR2*
100
*Part number sourced from a different facility.
ORDERING INFORMATION
Y-Axis g-Level Temperature Range
20 -40 to +105°C
20 -40 to +105°C
20 -40 to +105°C
20 -40 to +105°C
50 -40 to +105°C
50 -40 to +105°C
50 -40 to +105°C
50 -40 to +105°C
100 -40 to +105°C
100 -40 to +105°C
100 -40 to +105°C
100 -40 to +105°C
Package
475A-02
475A-02
475A-02
475A-02
475A-02
475A-02
475A-02
475A-02
475A-02
475A-02
475A-02
475A-02
Packaging
Tubes
Tape & Reel
Tubes
Tape & Reel
Tubes
Tape & Reel
Tubes
Tape & Reel
Tubes
Tape & Reel
Tubes
Tape & Reel
© Freescale Semiconductor, Inc., 2009. All rights reserved.
1 page  
1.4 PIN FUNCTION DESCRIPTIONS
1.4.1 VCC
This pin supplies power to the device. Careful printed wiring board layout and capacitor placement is critical to ensure best per-
formance. An external bypass capacitor between this pin and VSS is required, as described in Section 1.5.
1.4.2 VSS
This pin is the power supply return node for the digital circuitry on the MMA62XXKEG device.
1.4.3 VSSA
This pin is the power supply return node for analog circuitry on the MMA62XXAKEG device. An external bypass capacitor be-
tween this pin and VCC is required, as described in Section 1.5.
1.4.4 CREG
This pin is connected to the internal digital circuitry power supply rail. An external filter capacitor must be connected between this
pin and VSS, as described in Section 1.5.
1.4.5 CREGA
These pins are connected in parallel to the internal analog circuitry power supply rail. One or two external filter capacitors must
be connected between these pins and VSSA, as described in Section 1.5. Two pins are provided to support redundant connection
to the printed wiring board assembly. Redundant external capacitors may be connected to these pins for maximum reliability, as
described in Section 1.5.
1.4.6 CREF
These pins are connected in parallel to an internal reference voltage node utilized by the analog circuitry. One or two external
filter capacitors must be connected between these pins and VSSA, as described shown in Section 1.5. Two pins are provided to
support redundant connection to the printed wiring board assembly. Redundant external capacitors may be connected to these
pins for maximum reliability, as described in Section 1.5.
1.4.7 VPP
This pin should be tied directly to VSS.
1.4.8 SCLK
This input may be left unconnected unless it is desired to initiate device reset as described in Section 1.4.9.
1.4.9 RESET
This pin may be used to initiate a hardware reset. If RESET is held low and SCLK is held high for 512 μs, the internal reset signal
www.DaistaaSshseeertt4eUd..com
An internal pull-up device is connected to this pin.
1.4.10 STATUS
This pin provides an indicator of internal status. The STATUS output will be driven to a logic high level should any of the following
fault conditions be detected:
• Internal parity fault
• Over-temperature condition
• Internal clock frequency fault
• Device reset
• Device initialization
Immediately following device reset, STATUS is placed in a high impedance state for approximately 800 μs. At the end of this time,
STATUS is driven high and a 3ms stabilization delay required by the internal circuitry begins. The STATUS condition may not be
cleared during the stabilization delay. Reset is reported by the device so the system can be aware of potential difficulties if unex-
pected resets occur.
Once asserted, the STATUS output will remain high until the ST pin is driven from a logic low to a logic high state. If a fault con-
dition persists, the STATUS output will be driven high again as soon as it is cleared.
Sensors
Freescale Semiconductor
MMA6222AKEG
5
5 Page 
2.4 CONTROL TIMING
VL ≤ (VCC - VSS) ≤ VH, TL ≤ TA ≤ TH, |ΔTA| < 4 K/min unless otherwise specified
Ref Characteristic
Symbol
Min
Typ
Max Units
DSP Low-Pass Filter (Note 9)
Cutoff frequency (Note 10)
86 Filter Option $0C, $1F
fC(LPF)
380
400
420 Hz
DSP Low-Pass Filter
Cutoff frequency (-3dB, referenced to 0 Hz)
87 Filter $0C, $1F
fC(LPF)
335
353
371 Hz
Filter Order
88 Filter $00 - $12
OLPF
—
4
—1
Power-On Recovery Time
89 Power applied to XOUT, YOUT valid
tXY ——
—
10 ms
90 Internal Oscillator Frequency
fOSC
3.8
4.0
4.2 MHz
91 Clock Monitor Threshold
fMON
3.6
—
4.4 MHz
92 Chip Select to Internal Reset (See Figure 2-3)
tCSRES
486
512
538 μs
DAC Low-Pass Filter
93 Number of Poles
94 Cutoff Frequency
nPOLES
—
1
— unit
fC 5 10 20 kHz
95 Sensing Element Rolloff Frequency (-3 dB)
BWGCELL
—
3
— kHz
Notes:
1. Parameters tested 100% at final test.
2. Parameters tested 100% at unit probe.
3. Verified by characterization, not tested in production.
4. (*) Indicates a FSL critical parameter (CPK > 1.67). (#) Indicates a FSL significant parameter (CPK > 1.33).
7. Functionality verified 100% via scan. Timing characteristic is directly determined by internal oscillator frequency.
9. Devices are trimmed at 100 Hz with 1000 Hz low-pass filter option selected.
10. Low-pass filter characteristics match those of other Freescale accelerometer devices. Cutoff frequencies shown are -4dB
referenced to 0 Hz response, to correspond with previous specifications.
(7)
(7)
(7)
(1)
(1)
(7)
(7)
(1)
(7)
(1)
www.DataSheet4U.com
Sensors
Freescale Semiconductor
MMA6222AKEG
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet MMA621010AKEG.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MMA621010AKEG | Analog Dual Axis Micromachined Accelerometer | Freescale Semiconductor |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |