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PDF BTB1188M3 Data sheet ( Hoja de datos )
| Número de pieza | BTB1188M3 | |
| Descripción | Low Vcesat PNP Epitaxial Planar Transistor | |
| Fabricantes | Cystech Electonics Corp | |
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CYStech Electronics Corp.
Low Vcesat PNP Epitaxial Planar Transistor
BTB1188M3
wSpwewc..DNao.ta: SCh8e1e2tM43U.com
Issued Date : 2003.05.25
Revised Date : 2006.02.15
Page No. : 1/5
Features
• Low VCE(sat), VCE(sat)=-0.45 V (typical), at IC / IB = -2A / -0.5A
• Excellent current gain characteristics
• Complementary to BTD1766M3
• Pb-free package
Symbol
BTB1188M3
Outline
SOT-89
B：Base
C：Collector
E：Emitter
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Power Dissipation
VCBO
VCEO
VEBO
IC
ICP
Pd
Power Dissipation
Pd
Junction Temperature
Storage Temperature
Note : 1. Single Pulse , Pw=10ms
Tj
Tstg
2. When mounting on a 40 ×40 ×0.7 mm ceramic board.
BTB1188M3
BCE
Limits
-40
-30
-5
-2
-5 (Note 1)
0.5
2 (Note 2)
150
-55~+150
Unit
V
V
V
A
A
W
W
°C
°C
CYStek Product Specification
1 page  
CYStech Electronics Corp.
SOT-89 Dimension
wSpwewc..DNao.ta: SCh8e1e2tM43U.com
Issued Date : 2003.05.25
Revised Date : 2006.02.15
Page No. : 5/5
A
123
C
Marking:
H AE
B
E
F
G
D
Style: Pin 1. Base 2. Collector 3. Emitter
I
3-Lead SOT-89 Plastic
Surface Mounted Package
CYStek Package Code: M3
DIM
Inches
Min. Max.
A 0.1732 0.1811
B 0.1594 0.1673
C 0.0591 0.0663
D 0.0945 0.1024
E 0.01417 0.0201
Millimeters
Min. Max.
4.40 4.60
4.05 4.25
1.50 1.70
2.40 2.60
0.36 0.51
DIM
Inches
Min. Max.
F 0.0583 0.0598
G 0.1165 0.1197
H 0.0551 0.0630
I 0.0138 0.0161
*: Typical
Millimeters
Min. Max.
1.48 1.527
2.96 3.04
1.40 1.60
0.35 0.41
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB1188M3
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet BTB1188M3.PDF ] | |
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