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PDF CY14B101Q3 Data sheet ( Hoja de datos )

Número de pieza CY14B101Q3
Descripción 1 Mbit (128K x 8) Serial SPI nvSRAM
Fabricantes Cypress Semiconductor 
Logotipo Cypress Semiconductor Logotipo



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CY14B101Q1
CY14B101Q2
www.DataSheet4U.com
CY14B101Q3
1 Mbit (128K x 8) Serial SPI nvSRAM
Features
1 Mbit Nonvolatile SRAM
Internally organized as 128K x 8
STORE to QuantumTrap Nonvolatile Elements initiated au-
tomatically on Power Down (AutoStore) or by user using HSB
Pin (Hardware Store) or SPI instruction (Software Store)
RECALL to SRAM initiated on Power Up (Power Up Recall)
or by SPI Instruction (Software RECALL)
Automatic STORE on Power Down with a small Capacitor
High Reliability
Infinite Read, Write, and RECALL Cycles
1 Million STORE cycles to QuantumTrap
Data Retention: 20 Years
High Speed Serial Peripheral Interface (SPI)
40 MHz Clock Rate
Supports SPI Modes 0 (0,0) and 3 (1,1)
Write Protection
Hardware Protection using Write Protect (WP) Pin
Software Protection using Write Disable Instruction
Software Block Protection for 1/4,1/2, or entire Array
Low Power Consumption
Single 3V +20%, –10% Operation
Average VCC current of 10 mA at 40 MHz Operation
Industry Standard Configurations
Industrial Temperature
CY14B101Q1 has identical pin configuration to industry stan-
dard 8-pin NV Memory
8-pin DFN and 16-pin SOIC Packages
RoHS Compliant
Logic Block Diagram
Functional Overview
The Cypress CY14B101Q1/CY14B101Q2/CY14B101Q3
combines a 1 Mbit nonvolatile static RAM with a nonvolatile
element in each memory cell. The memory is organized as 128K
words of 8 bits each. The embedded nonvolatile elements incor-
porate the QuantumTrap technology, creating the world’s most
reliable nonvolatile memory. The SRAM provides infinite read
and write cycles, while the QuantumTrap cell provides highly
reliable nonvolatile storage of data. Data transfers from SRAM to
the nonvolatile elements (STORE operation) takes place
automatically at power down. On power up, data is restored to
the SRAM from the nonvolatile memory (RECALL operation).
Both STORE and RECALL operations can also be triggered by
the user.
Configuration
Feature
AutoStore
Software
STORE
Hardware
STORE
CY14B101Q1
No
Yes
CY14B101Q2
Yes
Yes
CY14B101Q3
Yes
Yes
No No Yes
VCC
VCAP
CS
WP
SCK
HOLD
SI
Instruction decode
Write protect
Control logic
Quantum Trap
128K X 8
SRAM ARRAY
128K X 8
STORE
RECALL
Instruction
register
Address
Decoder
A0-A16
D0-D7
Data I/O register
Power Control
STORE/RECALL
Control
HSB
SO
Status register
Cypress Semiconductor Corporation • 198 Champion Court
Document #: 001-50091 Rev. *D
• San Jose, CA 95134-1709 • 408-943-2600
Revised January 04, 2010

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CY14B101Q3 pdf
CY14B101Q1
CY14B101Q2
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AutoStore Operation
The AutoStore operation is a unique feature of nvSRAM which
automatically stores the SRAM data to QuantumTrap during
power down. This Store mechanism is implemented using a
capacitor (VCAP) and enables the device to safely STORE the
data in the nonvolatile memory when power goes down.
During normal operation, the device draws current from VCC to
charge the capacitor connected to the VCAP pin. When the
voltage on the VCC pin drops below VSWITCH during power down,
the device inhibits all memory accesses to nvSRAM and
automatically performs a conditional STORE operation using the
charge from the VCAP capacitor. The AutoStore operation is not
initiated if no write cycle has been performed since last RECALL.
Note If a capacitor is not connected to VCAP pin, Autostore must
be disabled by issuing the AutoStore Disable instruction
specified in AutoStore Disable (ASDISB) on page 13. If
AutoStore is enabled without a capacitor on VCAP pin, the device
attempts an AutoStore operation without sufficient charge to
complete the Store. This may corrupt the data stored in nvSRAM
and Status register. In such case, WRSR instruction needs to be
issued to update the nonvolatile bits BP0, BP1, WPEN to resume
normal functionality.
During power down, the memory accesses are inhibited after the
voltage on VCC pin drops below VSWITCH. To avoid inadvertent
writes, it must be ensured that CS is not left floating prior to this
event. Therefore, during power down the device must be
deselected and CS must be allowed to follow VCC.
Figure 3 shows the proper connection of the storage capacitor
(VCAP) for AutoStore operation. Refer to DC Electrical Charac-
teristics on page 14 for the size of the VCAP.
Note CY14B101Q1 does not support AutoStore operation. The
user must perform Software STORE operation by using the SPI
STORE instruction to secure the data.
Software Store Operation
Software STORE enables the user to trigger a STORE operation
through a special SPI instruction. This operation is initiated
irrespective of whether a write has been performed since last nv
operation.
A STORE cycle takes tSTORE to complete, during which all the
memory accesses to nvSRAM are inhibited. The RDY bit of the
Status register or the HSB pin may be polled to find the Ready
or Busy status of the nvSRAM. After the tSTORE cycle time is
completed, the SRAM is activated again for read and write
operations.
Hardware STORE and HSB pin Operation
The HSB pin in CY14B101Q3 is used to control and
acknowledge STORE operations. If no STORE or RECALL is in
progress, this pin can be used to request a Hardware STORE
cycle. When the HSB pin is driven LOW, nvSRAM conditionally
initiates a STORE operation after tDELAY duration. An actual
STORE cycle starts only if a write to the SRAM has been
performed since the last STORE or RECALL cycle. Reads and
Writes to the memory are inhibited for tSTORE duration or as long
as HSB pin is LOW.
The HSB pin also acts as an open drain driver that is internally
driven LOW to indicate a busy condition, when a STORE cycle
(initiated by any means) or Power up RECALL is in progress.
Upon completion of the STORE operation, the nvSRAM remains
disabled until the HSB pin returns HIGH. Leave the HSB pin
unconnected if not used.
Note CY14B101Q1/CY14B101Q2 do not have HSB pin. RDY bit
of the SPI status register may be probed to determine the Ready
or Busy status of nvSRAM
Figure 3. AutoStore Mode
VCC
0.1uF
VCC
CS VCAP
VSS
VCAP
RECALL Operation
A RECALL operation transfers the data stored in the nonvolatile
Quantum Trap elements to the SRAM. A RECALL may be
initiated in two ways: Hardware RECALL, initiated on power up;
and Software RECALL, initiated by a SPI RECALL instruction.
Internally, RECALL is a two-step procedure. First, the SRAM
data is cleared. Next, the nonvolatile information is transferred
into the SRAM cells. All memory accesses are inhibited while a
RECALL cycle is in progress. The RECALL operation does not
alter the data in the nonvolatile elements.
Hardware Recall (Power Up)
During power up, when VCC crosses VSWITCH, an automatic
RECALL sequence is initiated which transfers the content of
nonvolatile memory on to the SRAM. The data would previously
have been stored on the nonvolatile memory through a STORE
sequence.
A Power Up Recall cycle takes tFA time to complete and the
memory access is disabled during this time. HSB pin can be
used to detect the Ready status of the device. user
Software RECALL
Software RECALL enables the user to initiate a RECALL
operation to restore the content of nonvolatile memory on to the
SRAM. A Software RECALL is issued by using the SPI
instruction for RECALL.
A Software RECALL takes tRECALL to complete during which all
memory accesses to nvSRAM are inhibited. The controller must
provide sufficient delay for the RECALL operation to complete
before issuing any memory access instructions.
Document #: 001-50091 Rev. *D
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CY14B101Q1
CY14B101Q2
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Write Protect (WP) Pin
The write protect pin (WP) is used to provide hardware write
protection. WP pin enables all normal read and write operations
when held HIGH. When the WP pin is brought LOW and WPEN
bit is “1”, all write operations to the status register are inhibited.
The hardware write protection function is blocked when the
WPEN bit is “0”. This enables the user to install the device in a
system with the WP pin tied to ground, and still write to the status
register.
WP pin can be used along with WPEN and Block Protect bits
(BP1 and BP0) of the status register to inhibit writes to memory.
When WP pin is LOW and WPEN is set to “1”, any modifications
to status register are disabled. Therefore, the memory is
protected by setting the BP0 and BP1 bits and the WP pin inhibits
any modification of the status register bits, providing hardware
write protection.
Note WP going LOW when CS is still LOW has no effect on any
of the ongoing write operations to the status register.
Note CY14B101Q2 does not have WP pin and therefore does
not provide hardware write protection.
Table 7 summarizes all the protection features of this device
Table 7. Write Protection Operation
WPEN
WP
WEN
Protected
Blocks
Unprotected
Blocks
Status
Register
X X 0 Protected Protected Protected
0 X 1 Protected Writable Writable
1 LOW 1 Protected Writable Protected
1 HIGH 1 Protected Writable Writable
Memory Access
All memory accesses are done using the READ and WRITE
instructions. These instructions cannot be used while a STORE
or RECALL cycle is in progress. A STORE cycle in progress is
indicated by the RDY bit of the status register and the HSB pin.
Read Sequence (READ)
The read operations on this device are performed by giving the
instruction on Serial Input pin (SI) and reading the output on
Serial Output (SO) pin. The following sequence needs to be
followed for a read operation: After the CS line is pulled LOW to
select a device, the read opcode is transmitted through the SI
line followed by three bytes of address. The Most Significant
address byte contains A16 in bit 0 and other bits as ‘don’t cares’.
Address bits A15 to A0 are sent in the following two address
bytes. After the last address bit is transmitted on the SI pin, the
data (D7-D0) at the specific address is shifted out on the SO line
on the falling edge of SCK. Any other data on SI line after the last
address bit is ignored.
CY14B101Q1/CY14B101Q2/CY14B101Q3 allows reads to be
performed in bursts through SPI which can be used to read
consecutive addresses without issuing a new READ instruction.
If only one byte is to be read, the CS line must be driven HIGH
after one byte of data comes out. However, the read sequence
may be continued by holding the CS line LOW and the address
is automatically incremented and data continues to shift out on
SO pin. When the last data memory address (0x1FFFF) is
reached, the address rolls over to 0x0000 and the device
continues to read.
Write Sequence (WRITE)
The write operations on this device are performed through the
Serial Input (SI) pin. To perform a write operation, if the device is
write disabled, then the device must first be write enabled
through the WREN instruction. When the writes are enabled
(WEN = ‘1’), WRITE instruction is issued after the falling edge of
CS. A WRITE instruction constitutes transmitting the WRITE
opcode on SI line followed by 3 bytes address sequence and the
data (D7-D0) which is to be written. The Most Significant address
byte contains A16 in bit 0 with other bits being ‘don’t cares’.
Address bits A15 to A0 are sent in the following two address
bytes.
CY14B101Q1/CY14B101Q2/CY14B101Q3 enables writes to be
performed in bursts through SPI which can be used to write
consecutive addresses without issuing a new WRITE instruction.
If only one byte is to be written, the CS line must be driven HIGH
after the D0 (LSB of data) is transmitted. However, if more bytes
are to be written, CS line must be held LOW and address is
incremented automatically. The following bytes on the SI line are
treated as data bytes and written in the successive addresses.
When the last data memory address (0x1FFFF) is reached, the
address rolls over to 0x0000 and the device continues to write.
The WEN bit is reset to “0” on completion of a WRITE sequence.
Note When a burst write reaches a protected block address, it
continues the address increment into the protected space but
does not write any data to the protected memory. If the address
roll over takes the burst write to unprotected space, it resumes
writes. The same operation is true if a burst write is initiated
within a write protected block.
Figure 11. Read Instruction Timing
CS
SCK
SI
SO
0 1 2 34 5 67 0 1 23 45 6 7
20 21 22 23 0 1 2 3 4 5 6 7
Op-Code
17-bit Address
0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 A16
MSB
A3 A2 A1 A0
LSB
D7 D6 D5 D4 D3 D2 D1 D0
MSB
Data
LSB
Document #: 001-50091 Rev. *D
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