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PDF TLWD1100 Data sheet ( Hoja de datos )
| Número de pieza | TLWD1100 | |
| Descripción | Panel Circuit Indicator | |
| Fabricantes | Toshiba Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TLWD1100 (archivo pdf) en la parte inferior de esta página. Total 9 Páginas | ||
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TLWD1100(T11)
TOSHIBA LED Lamps
www.DataSheet4U.com
TLWD1100(T11)
Panel Circuit Indicator
Unit: mm
• Surface-mount devices
• 3.2 (L) × 2.8 (W) × 1.9 (H) mm
• LED chip + phosphor
• Luminous intensity : Iv = 180 mcd (typ.) @20mA
• Color: White
• Chromaticity (typ.) : Cx=0.32,Cy=0.31
• Topr / Tstg = -40 to 100°C
• Reflow soldering is possible
• Applications: automotive use,
backlighting etc.
• Standard embossed tape packing: T11 (2000/reel)
8-mm tape reel
Color and Material
Product Name
TLWD1100
Color
White
Material
InGaN
Absolute Maximum Ratings (Ta = 25°C)
JEDEC
―
JEITA
―
TOSHIBA
4-3R1
Weight: 0.035 g (typ.)
Characteristics
Symbol
Rating
Unit
Forward Current
(Note 1)
IF
30 mA
Power Dissipation
PD 120 mW
Operating Temperature
Topr
−40~100
°C
Storage Temperature
Tstg
−40~100
°C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
IF – Ta
35
30
25
20
15
10
5
0
0 20 40 60 80 100 120
Ambient temperature Ta (°C)
1
2007-10-01
1 page  
TLWD1100(T11)
Packaging
www.DataSheet4U.com
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
5°C to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
• Reflow soldering
Temperature profile (example)
240°C max(*)
10 s max (*)
140~160°C max(*)
4°C/s m(*a)x
4°C/s max(*)
60~120 s max (*)
Time (s)
• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
• Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
• Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron
: 25 W
Temperature
: 300°C or less
Time
: within 3 s
• If the product needs to be performed by other soldering method (ex. wave soldering), please contact Toshiba
sales representative.
Recommended soldering pattern
1.65 1.15 1.65
Unit: mm
2.41
5 2007-10-01
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet TLWD1100.PDF ] | |
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