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UCLAMP0524P PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 UCLAMP0524P
기능 Low Voltage TVS
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UCLAMP0524P 데이터시트, 핀배열, 회로
PROTECTION PRODUCTS - MicroClampTM
Description
The µClampTM series of TVS arrays are designed to
protect sensitive electronics from damage or latch-up
due to ESD, lightning, and other voltage-induced
transient events. Each device will protect up to four
lines operating at 5 volts.
The µClampTM0524P is a solid-state device designed
specifically for transient suppression. It is designed to
replace multilayer varistors (MLVs) in portable applica-
tions such as cell phones, notebook computers, and
PDAs. It features large cross-sectional area junctions for
conducting high transient currents. It offers superior
electrical characteristics such as lower clamping voltage
and no device degradation when compared to MLVs.
The µClampTM0524P may be used to meet the immunity
requirements of IEC 61000-4-2, level 4 (±15kV air, ±8kV
contact discharge). The “flow-thru” design of the device
results in enhanced ESD performance due to reduced
board trace inductance. The result is lower clamping
voltage and a higher level of protection when compared
to conventional TVS devices.
The µClamp0524P is in an 8-pin, RoHS/WEEE compli-
ant, SLP2116P8 package. It measures 2.1 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small package
makes it ideal for use in portable electronics such as cell
phones, digital still cameras, and notebook computers.
uClamp0524P
Low Voltage TVS
for EwwSwD.DatPaSrheoett4eU.ccotmion
Features
‹ Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
‹ Small package for use in portable electronics
‹ Protects four I/O lines
‹ Working voltage: 5V
‹ Flow thru design for easy layout
‹ Low leakage current
‹ Low operating and clamping voltages
‹ Solid-state silicon-avalanche technology
Mechanical Characteristics
‹ SLP2116P8 package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 2.1 x 1.6 x 0.58 mm
‹ Lead Pitch: 0.5mm
‹ Lead Finish: NiPd
‹ Marking: Orientation Mark and Marking Code
‹ Packaging: Tape and Reel per EIA 481
Applications
‹ Cellular Handsets & Accessories
‹ Personal Digital Assistants (PDAs)
‹ Notebooks & Handhelds
‹ Portable Instrumentation
‹ Digital Cameras
‹ Peripherals
‹ MP3 Players
Circuit Diagram
Package
18 27 3 6 4 5
2.10
12
1.60
0.50 BSC
GND
Device Schematic
Revision 1/25/2006
0.58
8 Pin SLP package (Bottom Side View)
2.1 x 1.6 x 0.58mm (Nominal)
1 www.semtech.com




UCLAMP0524P pdf, 반도체, 판매, 대치품
PROTECTION PRODUCTS
Applications Information
Device Connection Options
The µClamp0524P is designed to protect four lines. It
will present a high impedance to the protected line up to
5 volts. The device is unidirectional and may be used on
lines where the signal polarity is above ground.
Flow Thru Layout
The µClamp0524P is designed for ease of PCB layout by
allowing the traces to enter one side of the device and
exit the other side. Figure 2 shows the recommended
way to design the PCB board traces in order to use the
flow through layout. The solid line represents the PCB
trace. Note that the PCB traces enter at the input pin
and exit from the opposite pin. (pin 1 to pin 8, pin 2 to
pin 7, pin 3 to pin 6, pin 4 to pin 5). For example, line 1
enters at pin 1 and exits at Pin 8. The bottom tab is
connected to ground. This connection should be made
directly to a ground plane on the board for best results.
The path length is kept as short as possible to minimize
parasitic inductance.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression of
ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connectors
to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
uClamp0524P
www.DataSheet4U.com
Figure 1 - Circuit Diagram
18 27 3 6 4 5
GND
Figure 2 - PCB Trace Layout
In 1 Out 1
In 2 Out 2
In 3 Out 3
In 4 Out 4
2006 Semtech Corp.
4
www.semtech.com

4페이지










UCLAMP0524P 전자부품, 판매, 대치품
uClamp0524P
PROTECTION PRODUCTS
Outline Drawing - SLP2116P8
www.DataSheet4U.com
A
PIN 1
INDICATOR
(LASER MARK)
D
aaa C
A2
E1
D1
12
B
E
A SEATING
PLANE
A1 C
LxN E/2
DIMENSIONS
DIM
INCHES
MIN NOM MAX
MILLIMETERS
MIN NOM MAX
A
A1
.0-20
.023
.001
.026
.002
0.50
0.00
0.58
.003
0.65
0.05
A2 (.006)
(0.15)
b .007 .010 .012 0.20 0.25 0.30
D .079 .083 .087 2.00 2.10 2.20
D1 .061 .067 .071 1.55 1.70 1.80
E .059 .063 .067 1.50 1.60 1.70
E1 .010 .016 .020 0.25 0.40 0.50
e .020 BSC
0.50 BSC
L .011 .013 .015 0.28 0.33 0.38
N6
6
aaa .003
0.08
bbb .004
0.10
N
e
bxN
bbb C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP2116P8
P
X
DIMENSIONS
DIM INCHES
MILLIMETERS
ZG
Y
F (C)
B
C
F
G
P
X
Y
Z
.071
.060
.018
.035
.020
.012
.025
.085
1.80
1.52
0.45
0.89
0.50
0.30
0.63
2.15
B
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2006 Semtech Corp.
7
www.semtech.com

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부품번호상세설명 및 기능제조사
UCLAMP0524P

Low Voltage TVS

Semtech Corporation
Semtech Corporation

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