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PDF EMIF02-1003M6 Data sheet ( Hoja de datos )
| Número de pieza | EMIF02-1003M6 | |
| Descripción | 2 line IPAD EMI filter and ESD protection | |
| Fabricantes | STMicroelectronics | |
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EMIF02-1003M6
2 line IPAD™, EMI filter and ESD protection in Micro QFN package
Features
■ Dual line EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Very low PCB space consumption:
1.0 mm x 1.45 mm
■ Very thin package: 0.6 mm max
■ High efficiency in ESD suppression
(IEC 61000-4-2 level 4).
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging.
■ Lead free package
■ Easy layout and flexibility due to single line
topology
■ Low capacitance
Complies with following standards
■ IEC 61000-4-2 level 4, input and output pins
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ MIL STD 883G - Method 3015-7 Class 3B (all
pins)
Applications
Where EMI filtering in ESD sensitive equipment is
required:
■ Keyboard for mobile phones
■ Computers and printers
■ Communication systems
■ MCU Boards
Description
The EMIF02-1003M6 is a 2 line highly integrated
device designed to suppress EMI/RFI noise in all
systems exposed to electromagnetic interference.
This filter includes ESD protection circuitry, which
prevents damage to the application when
subjected to ESD surges up to 15 kV on all pins.
Micro QFN 1.45 mm x 1.00 mm
(bottom view)
Figure 1. Pin configuration (top view)
IN 1
GND 2
IN 3
6 OUT
5 GND
4 OUT
Figure 2. Basic cell configuration
Input
R = 100 Ω
CLINE = 30 pF typ. @ 0 V
Output
TM: IPAD is a trademark of STMicroelectronics
October 2007
Rev 1
1/10
www.st.com
1 page  
EMIF02-1003M6
4 Package information
Pacwkwawge.DiantafoShrmeeat4tiUo.cnom
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 3. Micro QFN 1.45 x 1.00 6L dimensions
D
N
12
E
Dimensions
Ref. Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A 0.50 0.55 0.60 0.020 0.022 0.024
A
A1
12
e
L
k
b
A1 0.00 0.02 0.05 0.000 0.001 0.002
b 0.18 0.25 0.30 0.007 0.010 0.012
D 1.45
0.057
E 1.00
0.039
e 0.50
0.020
K 0.20
0.008
L 0.30 0.35 0.40 0.012 0.014 0.016
Figure 10. Footprint in mm [inches]
0.50
[0.020]
0.25
[0.010]
Figure 11. Marking
Dot : Pi n 1 Identification
XX = Marking
0.60
[0.023]
0.30 1.60
[0.012] [0.063]
F
5/10
5 Page | ||
| Páginas | Total 10 Páginas | |
| PDF Descargar | [ Datasheet EMIF02-1003M6.PDF ] | |
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