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PDF EMIF02-USB01F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF02-USB01F2 | |
| Descripción | 2-line IPAD EMI filter including ESD protection | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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EMIF02-USB01F2
2-line IPAD™, EMI filter including ESD protection
Features
■ 2-line low-pass filter + ESD protection
■ High efficiency in EMI filtering
■ Lead-free package
■ Very low PCB space occupation: < 2.5 mm2
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
(IEC61000-4-2 level 4)
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
■ IEC 61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
Application
ESD protection and EMI filtering for:
■ USB port
Description
The EMIF02-USB01F2 is a highly integrated array
designed to suppress EMI / RFI noise for USB
port filtering. The EMIF02-USB01F2 Flip Chip
packaging means the package size is equal to the
die size.
Additionally, this filter includes ESD protection
circuitry which prevents damage to the protected
device when subjected to ESD surges up to
15 kV.
Flip Chip
(8 bumps)
Figure 1.
Pin configuration (bump side
view)
32 1
APup Vbus
DZ
D+ D+
in out
GND
D- D-
in out
B
C
D
E
Figure 2. Schematic
Vbus
DZ
D+ out
1.3K
33
Pup
D+ in
GND
D- out
33
D- in
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 3
1/8
www.st.com
8
1 page  
EMIF02-USB01F2
3 Ordering information scheme
Ordering infworwmwa.DtiaotanSshecehte4Um.ceom
Figure 10. Ordering information scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
X = 2: Lead-free, pitch = 500 µm, bump = 315 µm
4 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 11. Package dimensions
700 ± 50
315 ± 50
650µm ± 65
285 µm
1.27mm ± 50µm
5/8
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet EMIF02-USB01F2.PDF ] | |
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