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PDF EMIF02-USB05F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF02-USB05F2 | |
| Descripción | 2 line EMF filter including ESD protection | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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IPAD™
EMIF02-USB05F2
2 line EMF filter including ESD protection
Main application
When EMI filtering is ESD sensitive equipment is
required:
■ Mobile phones and communication systems
■ Computers, printers and MCU boards
Description
The EMIF02-USB05F2 is a highly integrated array
designed to suppress EMI / RFI noise for USB
port filtering. The EMIF02-USB05F2 Flip-Chip
packaging means the package size is equal to the
die size.
Additionally, this low-pass filter includes an ESD
protection circuitry to prevent damage to the
application when subjected to ESD surges up
to 15 kV.
This device is designed to be fully compatible with
USB standards.
Benefits
■ 2 x EMI low-pass filter + 2 line ESD protection
■ 1.5 kΩ pull-up included
■ High efficiency in EMI filtering
■ Lead free package
■ Very low PCB space consumption:
1.92 mm x 0.92 mm
■ Very thin package: 0.65 mm
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
■ USB full speed (12 Mbps), OTG compliant
Complies with following standards:
IEC 61000-4-2
level 4
15 kV (air discharge)
8 kV (contact discharge)
MIL STD 883G - Method 3015-7 Class 3
Flip-Chip
(8 Bumps)
Pin configuration (bump side)
21
IO4 VCC A
O2 I2 B
O1 I1 C
IO3 GND D
Functional diagram
IO4
IO3
Input 2
R3
R1
VCC
Output2
GND
Input 1
R2
Output 1
Order code
Part Number
EMIF02-USB05F2
Marking
GV
TM: IPAD is a trademark of STMicroelectronics
November 2006
Rev 2
1/7
www.st.com
7
1 page  
EMIF02-USB05F2
3 Package information
Figure 8. Flip-Chip package dimensions
500 µm ± 10
315 µm ± 50
Pacwkwawge.DiantafoShrmeeat4tiUo.cnom
650 µm ± 65
0.92 mm ± 50 µm
Figure 9. Foot print recomendations Figure 10. Marking
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 315 µm copper pad diameter
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
xxz
y ww
Figure 11. Flip-Chip tape and reel specification
Dot identifying Pin A1 location
4 +/- 0.1
Ø 1.5 +/- 0.1
0.73 +/- 0.05
All dimensions in mm
4 +/- 0.1
User direction of unreeling
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF02-USB05F2.PDF ] | |
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