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PDF EMIF02-SPK01F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF02-SPK01F2 | |
| Descripción | 2 LINE EMI FILTER AND ESD PROTECTION | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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®
IPAD™
EMIF02-SPK01F2
2 LINE EMI FILTER
AND ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required :
■ Mobile phones and communication systems
■ Computers, printers and MCU Boards
DESCRIPTION
The EMIF02-SPK01 is a highly integrated device
designed to suppress EMI/RFI noise in all systems
subjected to electromagnetic interferences. The
EMIF02 Flip-Chip packaging means the package
size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents damage to the application when
subjected to ESD surges up 15 kV.
BENEFITS
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Very low PCB space consuming:
1.07 mm x 1.47 mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through inte-
gration & wafer level packaging
Flip-Chip
(5 Bumps)
Table 1: Order Code
Part Number
EMIF02-SPK01F2
Marking
FX
Figure 1: Pin Configuration (bump side)
321
I2 I1
A
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC 61000-4-2
Level 4 on input pins 15 kV (air discharge)
8 kV (contact discharge)
Level 1 on output pins 2 kV (air discharge)
2 kV (contact discharge)
MIL STD 883E -Method 3015-6 Class 3
Figure 2: Basic Cell Configuration
GND
O2 O1
B
C
Low-pass Filter
Input
Output
Ri/o = 10 Ω
Cline = 200 pF
GND
GND
TM: IPAD is a trademark of STMicroelectronics.
October 2005
GND
REV 1
1/7
1 page  
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EMIF02-SPK01F2
Figure 10: Order code
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
Figure 11: FLIP-CHIP Package Mechanical Data
500µm ± 10
250µm ± 10
315µm ± 50
650µm ± 50
1.07mm ± 50µm
Figure 12: Foot print recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 13: Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year ww = week)
E
xxz
y ww
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF02-SPK01F2.PDF ] | |
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