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PDF BAP55L Data sheet ( Hoja de datos )
| Número de pieza | BAP55L | |
| Descripción | Silicon PIN diode | |
| Fabricantes | NXP Semiconductors | |
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BAP55L
Silicon PIN diode
Rev. 01 — 5 April 2005
www.DataSheet4U.com
Preliminary data sheet
1. Product profile
1.1 General description
Planar PIN diode in a SOD882 leadless ultra small plastic SMD package.
1.2 Features
s High speed switching for RF signals
s Low diode capacitance
s Low forward resistance
s Very low series inductance
s For applications up to 3 GHz
1.3 Applications
s RF attenuators and switches
2. Pinning information
Table 1:
Pin
1
2
Discrete pinning
Description
cathode
anode
[1] The marking bar indicates the cathode.
3. Ordering information
Simplified outline Symbol
[1]
12
Transparent
top view
sym006
Table 2: Ordering information
Type number Package
Name Description
BAP55L
-
leadless ultra small plastic package; 2 terminals; body
1.0 × 0.6 × 0.5 mm
Version
SOD882
1 page  
Philips Semiconductors
8. Package outline
Leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm
LL
1 2b
e1
BAP55Lwww.DataSheet4U.com
Silicon PIN diode
SOD882
A
A1
E
D
(2)
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
A1
max.
b
D
E
e1
mm
0.50
0.46
0.03
0.55
0.47
0.62
0.55
1.02
0.95
0.65
L
0.30
0.22
Notes
1. Including plating thickness
2. The marking bar indicates the cathode
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOD882
0
Fig 5. Package outline SOD882
9397 750 14811
Preliminary data sheet
Rev. 01 — 5 April 2005
0.5
scale
1 mm
EUROPEAN
PROJECTION
ISSUE DATE
03-04-16
03-04-17
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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