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PDF CSPEMI202A Data sheet ( Hoja de datos )
| Número de pieza | CSPEMI202A | |
| Descripción | 2 Channel Headset Microphone EMI Filter with ESD Protection | |
| Fabricantes | California Micro Devices | |
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CwwSwP.DaEtaMSheIe2t40U.c2oAm
2 Channel Headset Microphone EMI Filter with ESD Protection
Features
• Two channels of EMI filtering
• Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
• Greater than 40dB attenuation at 1GHz
• +8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
• +15kV ESD protection on each channel (HBM)
• Supports bipolar signals—ideal for
audio applications
• Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
• 5-bump, 0.950mm X 1.410mm footprint
Chip Scale Package (CSP)
• Lead-free version available
Applications
• EMI filtering and ESD protection for headset
microphone ports
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Camcorders
• Notebooks
• Desktop PCs
Product Description
The CSPEMI202A is a dual low-pass filter array inte-
grating two pi-style filters (C-R-C) that reduce EMI/RFI
emissions while at the same time providing ESD pro-
tection. This part is custom-designed to interface with a
microphone port on a cellular telephone or similar
device. Each high quality filter provides more than
35dB attenuation in the 800-2700 MHz range. These
pi-style filters support bidirectional filtering, controlling
EMI both to and from a microphone element. They also
support bipolar signals, enabling audio signals to pass
through without distortion.
In addition, the CSPEMI202A provides a very high
level of protection for sensitive electronic components
that may be subjected to electrostatic discharge (ESD).
The input pins are designed and characterized to
safely dissipate ESD strikes of 8kV, the maximum
requirement of the IEC 61000-4-2 international stan-
dard. Using the MIL-STD-883 (Method 3015) specifica-
tion for Human Body Model (HBM) ESD, the device
provides protection for contact discharges to greater
than 15kV.
The CSPEMI202A is particularly well suited for porta-
ble electronics (e.g., cellular telephones, PDAs, note-
book computers) because of its small package format
and low weight. The CSPEMI202A is available in a
space-saving, low-profile Chip Scale Package with
optional lead-free finishing.
Electrical Schematic
A1
MIC_IN1
A3
MIC_IN2
B2
GND
68Ω
47pF
47pF
68Ω
47pF
47pF
C1
MIC_OUT1
C3
MIC_OUT2
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
1
1 page  
CwwSwP.DaEtaMSheIe2t40U.c2oAm
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask defined pads
0.325mm Round
0.125 - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50µm
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CSPEMI202A.PDF ] | |
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