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부품번호 | A82DL16X2U 기능 |
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기능 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only Simultaneous Operation Flash | ||
제조업체 | AMIC Technology | ||
로고 | |||
www.DataSheet4U.com
A82DL16x2T(U) Series
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM,
A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only,
Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM
Preliminary
Document Title
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit
(2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 2M
(128Kx16 Bit) Static RAM
Revision History
Rev. No.
0.0
0.1
History
Initial issue
Update Figure 23
Issue Date
March 25, 2005
May 17, 2005
Remark
Preliminary
PRELIMINARY (May, 2005, Version 0.1)
AMIC Technology, Corp.
Pin Configurations
A82DLw1w6wx.D2atTaS(hUee)t4SU.ecormies
69-Ball TFBGA
Top View
A1 A5 A6 A10
NC NC NC NC
B1 B3 B4 B5 B6 B7 B8
NC
A7 LB_S WP/ACC WE
A8 A11
C2 C3 C4 C5 C6 C7 C8 C9
A3 A6 UB_S RESET CE2_S A19 A12 A15
D2 D4 D4 D5 D6 D7 D8 D9
A2 A5 A18 RY/BY NC A9 A13 NC
E1 E2 E3 E4
NC A1 A4 A17
F1 F2 F3 F4
NC A0 VSS I/O1
E7 E8 E9 E10
A10 A14
NC
NC
F7 F8 F9 F10
I/O6 NC A16 NC
G2
CE_F
H2
CE1_S
G3
OE
H3
I/O0
G4 G5 G6
G7 G8
G9
I/O9 I/O3 I/O4 I/O13 I/O15(A-1) BYTE_F
H4
I/O10
H5
VCC_F
H6
VCC_S
H7
I/O12
H8
I/O7
H9
VSS
J3
I/O8
J4
I/O2
J5
I/O11
J6
NC
J7
I/O5
J8
I/O14
K1
K5 K6
K10
NC
NC NC
NC
Flash only
SRAM only
Shared
Special Handling Instructions for TFBGA Package
Special handling is required for Flash Memory products in TFBGA packages.
Flash memory devices in TFBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or
data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time
PRELIMINARY (May, 2005, Version 0.1)
3
AMIC Technology, Corp.
4페이지 A82DLw1w6wx.D2atTaS(hUee)t4SU.ecormies
Pin Descriptions
Pin No.
A0 - A19
I/O0 - I/O14
I/O15
I/O15 (A-1) A-1
CE_F
Description
Address Inputs
Data Inputs/Outputs
Data Input/Output, Word Mode
LSB Address Input, Byte Mode
Chip Enable
CE_S
Chip Enable (SRAM)
WE Write Enable
OE Output Enable
WP /ACC
RESET
BYTE_F
Hardware Write Protect/Acceleration Pin
Hardware Reset Pin, Active Low
Selects 8-bit or 16-bit Mode
RY/ BY
VSS
VCC_F
VCC_S
NC
Ready/BUSY Output
Ground
Power Supply (Flash)
Power Supply (SRAM)
Pin Not Connected Internally
Logic Symbol
20
A0-A19
I/O0-I/O15(A-1)
CE_S
CE_F
OE
WE
WP/ACC
RESET
BYTE_F
RY/BY
16 or 8
PRELIMINARY (May, 2005, Version 0.1)
6
AMIC Technology, Corp.
7페이지 | |||
구 성 | 총 30 페이지수 | ||
다운로드 | [ A82DL16X2U.PDF 데이터시트 ] |
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부품번호 | 상세설명 및 기능 | 제조사 |
A82DL16X2T | Stacked Multi-Chip Package | AMIC Technology |
A82DL16X2T | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only Simultaneous Operation Flash | AMIC Technology |
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