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PDF CM1426 Data sheet ( Hoja de datos )

Número de pieza CM1426
Descripción LCD and Camera EMI Filter Array with ESD Protection
Fabricantes California Micro Devices 
Logotipo California Micro Devices Logotipo



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PRELIMINARY
CM1426www.DataSheet4U.com
LCD and Camera EMI Filter Array with ESD Protection
Features
• Four, six and eight channels of EMI filtering with
integrated ESD protection
• 0.5mm pitch, 10-bump, 1.96mm x 1.33mm foot-
print Chip Scale Package (CM1426-04)
• 0.5mm pitch, 15-bump, 2.96mm x 1.33mm foot-
print Chip Scale Package (CM1426-06)
• 0.5mm pitch, 20-bump, 3.96mm x 1.33mm foot-
print Chip Scale Package (CM1426-08)
• Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
±8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±15kV ESD protection on each channel (HBM)
• Greater than 20dB attenuation (typical) at 1 GHz
• Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
Optiguardcoated for improved reliability at
assembly
• Lead-free version available
Applications
• LCD and Camera data lines in mobile handsets
• I/O port protection for mobile handsets, notebook
computers, PDAs etc.
• EMI filtering for data ports in cell phones, PDAs or
notebook computers.
• Wireless handsets
• Handheld PCs/PDAs
• LCD and camera modules
Product Description
The CM1426 is a family of pi-style EMI filter arrays with
ESD protection, which integrates four, six and eight fil-
ters (C-R-C) in a Chip Scale Package with 0.50mm
pad pitch. The CM1426 has component values of
8.5pF-100Ω-8.5pF per channel. The CM1426 has a
cut-off frequency of 230MHz and can be used in appli-
cations where the data rates are as high as 92Mbps.
The parts include avalanche-type ESD diodes on every
pin, which provide a very high level of protection for
sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The ESD protection
diodes safely dissipate ESD strikes of ±8kV, well
beyond the maximum requirement of the IEC61000-4-
2 international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the pins are protected for contact dis-
charges at greater than ±15kV.
These devices are particularly well-suited for portable
electronics (e.g. wireless handsets, PDAs, notebook
computers) because of their small package and easy-
to-use pin assignments. In particular, the CM1426 is
ideal for EMI filtering and protecting data and control
lines for the I/O data ports, LCD display and camera
interface in mobile handsets.
The CM1426 incorporates Optiguardwhich results in
improved reliability at assembly. The CM1426 is avail-
able in a space-saving, low-profile Chip Scale Package
with optional lead-free finishing.
Electrical Schematic
FILTER+ESDn*
(Pins A1-An)
100Ω
8.5pF
8.5pF
FILTER+ESDn*
(Pins C1-Cn)
GND*
(Pins B1-Bm)
* See Package/Pinout Diagram
for expanded pin information.
1 of 4, 6 or 8 EMI/RFI + ESD Channels
© 2005 California Micro Devices Corp. All rights reserved.
08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
1

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CM1426 pdf
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
PRELIMINARY
CM1426www.DataSheet4U.com
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1)
© 2005 California Micro Devices Corp. All rights reserved.
08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
5

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CM1426 arduino
PRELIMINARY
CM1426www.DataSheet4U.com
Mechanical Details
CSP Mechanical Specifications
CM1426 devices are supplied in custom Chip Scale
Packages (CSP). Dimensions are presented below.
For complete information on CSP packaging, see the
CM1426-04 Mechanical Specifications
The package dimensions for the CM1426-04 are pre-
sented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
10
Dim Millimeters
Inches
Min Nom Max Min Nom Max
A1 1.915 1.960 2.005 0.0754 0.0772 0.0789
A2 1.285 1.330 1.375 0.0506 0.0524 0.0541
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.180 0.230 0.280 0.0071 0.0091 0.0110
C2 0.180 0.230 0.280 0.0071 0.091 0.0110
D1 0.575 0.644 0.714 0.0226 0.0254 0.0281
D2 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
California Micro Devices CSP Package Information
document.
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B2
B1
C
B
A
1234
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
OptiGuardTM
Coating
D1
D2
SIDE
VIEW
Package Dimensions for CM1426-04
Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CM1426-04
CHIP SIZE (mm)
1.96 x 1.33 x 0.644
POCKET SIZE (mm)
B0 X A0 X K0
2.08 x 1.45 x 0.71
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P0
4mm
P1
4mm
Top
Cover
Tape
Ko
Po
Ao
Bo
10 Pitches cumulative
±to0le.2ramncme on tape
W
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P1
User direction of feed
Center lines
of cavity
Figure 13. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 11

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