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부품번호 | H55S2622JFR-A3M 기능 |
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기능 | 256MBit MOBILE SDR SDRAMs based on 2M x 4Bank x32 I/O | ||
제조업체 | Hynix Semiconductor | ||
로고 | |||
www.DataSheet4U.com
256MBit MOBILE SDR SDRAMs based on 2M x 4Bank x32 I/O
Specification of
256M (8Mx32bit) Mobile SDRAM
Memory Cell Array
- Organized as 4banks of 2,097,152 x32
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev 1.0 / Nov. 2008
1
11256Mbit (8Mx32bit) Mobile SDR
H55Sw2w6w2.D2aJtaFSRheSeet4rUi.ecsom
H55S2532JFR Series
INFORMATION for Hynix KNOWN GOOD DIE
With the advent of Multi-Chip package (MCPs), Package on Package (PoP) and system in a package (SiP) applications,
customer demand for Known Good Die (KGD) has increased.
Requirements for smaller form factors and higher memory densities are fueling the need for Wafer-level memory solu-
tions due to their superior flexibility. Hynix Known Good Die (KGD) products can be used in packaging technologies
such as systems-in-a-package (SIPs) and multi-chip packages (MCPs) to reduce the board area required, making them
ideal for hand-held PCs, and many other portable digital applications.
Hynix Mobile DRAM will be able to continue its constant effort of enabling the Advanced package products of all appli-
cation customers.
- Please Contact Hynix Office for Hynix KGD product availability and informations.
Rev 1.0 / Nov. 2008
4
4페이지 11256Mbit (8Mx32bit) Mobile SDR
H55Sw2w6w2.D2aJtaFSRheSeet4rUi.ecsom
H55S2532JFR Series
BALL DESCRIPTION
x32 (2KBytes) Ballout
12 34
678
9
A DQ
26
DQ
24
VSS
B DQ
28
VDDQ VSSQ
C VSSQ
DQ
27
DQ
25
D VSSQ
DQ
29
DQ
30
E VDDQ
DQ
31
NC
F VSS
DQM
3
A3
G
A4 A5
A6
VDD
DQ
23
VDDQ VSSQ
DQ
21
DQ
19
DQ
22
DQ
20
VDDQ
DQ
17
DQ VDDQ
18
NC
DQ
16
VSSQ
A2
DQM
2
VDD
A10 A0
A1
TOPH A7 A8 NC
NC
BA
1
A11
VIEWJ CLK CKE
A9
BA
0
/CS /RAS
K
DQM
NC
NC
1
/CAS
/WE
DQM
0
L VDDQ
DQ
8
VSS
VDD
DQ
7 VSSQ
M VSSQ
DQ
10
DQ
9
DQ
6
DQ
5
VDDQ
N VSSQ
DQ
12
DQ
14
P DQ
11
VDDQ VSSQ
DQ
1
VDDQ
DQ
3
VDDQ
VSSQ
DQ
4
R DQ
13
DQ
15
VSS
VDD
DQ
0
DQ2
Rev 1.0 / Nov. 2008
7
7페이지 | |||
구 성 | 총 30 페이지수 | ||
다운로드 | [ H55S2622JFR-A3M.PDF 데이터시트 ] |
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구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
H55S2622JFR-A3M | 256MBit MOBILE SDR SDRAMs based on 2M x 4Bank x32 I/O | Hynix Semiconductor |
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