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PDF TV00570003CDGB Data sheet ( Hoja de datos )

Número de pieza TV00570003CDGB
Descripción (TV00570002CDGB / TV00570003CDGB) Pseudo SRAM and NOR Flash Memory Mixed Multi-Chip Package
Fabricantes Toshiba 
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No Preview Available ! TV00570003CDGB Hoja de datos, Descripción, Manual

TV00570002/003CDGB
TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS
TENTATIVE
Pseudo SRAM and NOR Flash Memory Mixed Multi-Chip Package
DESCRIPTION
The TV00570002/003CDGB is a mixed multi-chip package containing a 33,554,432-bit pseudo static RAM and a
134,217,728-bit Nor Flash Memory. The TV00570002/003CDGB is available in a 81-pin BGA package making it
suitable for a variety of applications.
MCP Features
Power supply voltage of 2.7 to 3.3 V
Operating temperature of 30° to 85°C
Package
P-TFBGA81-0710-0.80BZ (Weight: 0.15 g)
Pseudo SRAM Features
Organization : 2M × 16 bits
www.DataSPhoeweet4rUd.cisosmipation
Operating :
40 mA maximum
Standby :
150 μA maximum
Deep power-down standby : 5 μA maximum
Access time :
Random / Page : 70 ns / 30 ns @CL=30pF
Page read operation by 8 words
Deep power-down mode : Memory cell data invalid
Nor Flash Memory Features
Organization: 8M × 16 bits
Power dissipation
Read operating :
55 mA maximum
Address Increment Read operation:
Page Read operating :
24mA maximum
5 mA maximum
Program / Erase operating: 15 mA maximum
Standby :
Access time :
Random :
10 μA maximum
70 ns @CL=30pF
Page :
25 ns @CL=30pF
Functions
Simultaneous Read/Write
Page read
Auto-Program , Auto Page Program
Auto Block Erase , Auto Chip Erase
Program Suspend / Resume
Erase Suspend/Resume
Data polling / Toggle bit
Password block protection
Block Protection/Boot Block Protection
Automatic Sleep, supports for hidden ROM Area
Common Flash Memory Interface (CFI)
Block erase architecture
8 × 8 Kbytes / 127 × 64 Kbytes
Bank architecture
16 Mbits × 8 Banks
Boot block architecture
TV00570002CDGB : top boot block
TV00570003CDGB : bottom boot block
Mode control
Compatible with JEDEC standard commands
Erase/Program cycles
100,000 cycles typ.
2008-05-08 1/9

1 page




TV00570003CDGB pdf
MODE SELECTION
Pseudo SRAM
MODE
Read(Word)
Read(Lower Byte)
Read(Upper Byte)
Write(Word)
Write(Lower Byte)
Write(Upper Byte)
Outputs Disabled
Standby
Deep Power-down Standby
CE1ps CE2ps
LH
HH
HL
OE
L
X
H
X
X
WE
H
L
H
X
X
LB
L
L
H
L
L
H
X
X
X
TV00570002/003CDGB
UB Add DQ0~DQ7 DQ8~DQ15
L DOUT
H DOUT
L High-Z
L
HX
DIN
DIN
L Invalid
X High-Z
X High-Z
X High-Z
DOUT
High-Z
DOUT
DIN
Invalid
DIN
High-Z
High-Z
High-Z
Nor Flash Memory
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MODE
Read / Page Read
Standby
Output Disable
Write
Hardware Reset / Standby
Boot Block Protect
CEf
L
H
X
L
X
X
OE WE RESET
LH
H
XX
H
HH
X
H (1) H
XX
L
XX
X
WP
X
X
X
X
X
L
DQ0~DQ15
DOUT
High-Z
High-Z
DIN
High-Z
X
Notes: L = VIL; H = VIH; X = VIH or VIL
Does not apply when CEf = VIL and CE1ps
(1) Pulse input
= VIL and CE2ps = VIH at the same time.
2008-05-08 5/9

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TV00570003CDGB arduino
AC CHARACTERISTICS AND OPERATING CONDITIONS
(Ta = −30°C to 85°C, VDD = 2.7 to 3.3 V) (See Note 1 to 7)
TC51WHM516B
SYMBOL
PARAMETER
tRC Read Cycle Time
tACC
Address Access Time
tCO Chip Enable ( CE1 ) Access Time
tOE Output Enable Access Time
tBA Data Byte Control Access Time
tCOE
Chip Enable Low to Output Active
tOEE
Output Enable Low to Output Active
tBE Data Byte Control Low to Output Active
tOD Chip Enable High to Output High-Z
tODO
Output Enable High to Output High-Z
www.DataStBhDeet4U.com Data Byte Control High to Output High-Z
tOH Output Data Hold Time
tPM Page Mode Time
tPC Page Mode Cycle Time
tAA Page Mode Address Access Time
tAOH
Page Mode Output Data Hold Time
tWC Write Cycle Time
tWP Write Pulse Width
tCW Chip Enable to End of Write
tBW Data Byte Control to End of Write
tAW Address Valid to End of Write
tAS Address Set-up Time
tWR Write Recovery Time
tCEH
Chip Enable High Pulse Width
tWEH
Write Enable High Pulse Width
tODW
WE Low to Output High-Z
tOEW
WE High to Output Active
tDS Data Set-up Time
tDH Data Hold Time
tCS CE2 Set-up Time
tCH CE2 Hold Time
tDPD
CE2 Pulse Width
tCHC
CE2 Hold from CE1
tCHP
CE2 Hold from Power On
AC TEST CONDITIONS
PARAMETER
Output load
Input pulse level
Timing measurements
Reference level
tR, tF
MIN
MAX
UNIT
70 10000 ns
70 ns
70 ns
25 ns
25 ns
10 ns
0 ns
0 ns
20 ns
20 ns
20 ns
5 ns
70 10000 ns
30 ns
30 ns
5 ns
70 10000 ns
50 ns
70 ns
60 ns
60 ns
0 ns
0 ns
10 ns
6 ns
20 ns
0 ns
30 ns
0 ns
0 ns
300
μs
10 ms
0 ns
30 ⎯ μs
CONDITION
30 pF + 1 TTL Gate
VDD 0.2 V, 0.2 V
VDD × 0.5
VDD× 0.5
5 ns
2007-03-12 P-2/6

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