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PDF STPAC02F2 Data sheet ( Hoja de datos )
| Número de pieza | STPAC02F2 | |
| Descripción | RF Detector for power amplifier control | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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STPAC02F2
IPAD™
RF Detector for power amplifier control with internal temperature compensation
Main product characteristics
■ 0.8 to 2.5 GHz frequency range
■ Detection diode voltage drop compensation
■ Temperature compensation
■ Fast response time
■ Low Power consumption
■ Chip Scale device
■ Low parasitic impedance
■ Lead free package
Description
The STPAC02F2 is an integrated RF detector for
power control chain. It has been developed to
convert the RF signal coming from the external
coupler into a DC signal usable by the mobile
digital stage. It is based on the use of two similar
diodes, one assuming the signal detection while
the second one is used to compensate the
ambient temperature effect. A biasing stage
suppresses the detection diode drop voltage
effect. The use of the IPAD technology allows the
RF front-end designer to save PCB area and to
drastically suppress the parasitic inductances of
the package.
Target applications are cellular phones and PDA
using GSM, DCS, PCS, AMPS, TDMA, CDMA
and 800 MHz to 2100 MHz frequency ranges.
Benefits
■ The use of IPAD technology allows the RF
front-end designer to save PCB area and to
drastically suppress the parasitic inductances.
Flip-Chip package
(8 Bumps)
Pin configuration
321
OUT
Not
used
A
GND GND GND B
RFin GND VBias C
Order code
Part number
STPAC02F2
Marking
RB
May 2006
Rev 1
1/7
www.st.com
7
1 page  
STPAC02F2
2 Packaging information
Figure 10. Flip-Chip dimensions
500 µm ± 50
315 µm ± 50
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Packaging information
650 µm ± 65
1.57 mm ± 50 µm
Figure 11. Foot print recommendations Figure 12. Marking
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
xxz
y ww
Figure 13. Flip-Chip tape and reel specification
Dot identifying Pin A1 location
4 +/- 0.1
Ø 1.5 +/- 0.1
0.73 +/- 0.05
4 +/- 0.1
All dimensions in mm
User direction of unreeling
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available
at: www.st.com.
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet STPAC02F2.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| STPAC02F1 | RF DETECTOR FOR POWER AMPLIFIER CONTROL WITH INTERNAL TEMPERATURE COMPENSATION IPADTM |  ST Microelectronics |
| STPAC02F2 | RF Detector for power amplifier control | STMicroelectronics |
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