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BAP1321LX PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 BAP1321LX
기능 Silicon PIN diode
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BAP1321LX 데이터시트, 핀배열, 회로
BAP1321LX
Silicon PIN diode
Rev. 01 — 30 July 2007
www.DataSheet4U.com
Product data sheet
1. Product profile
1.1 General description
Planar PIN diode in a SOD882T leadless ultra small plastic SMD package.
1.2 Features
I High voltage, current controlled
I RF resistor for RF attenuators and switches
I Low diode capacitance
I Low diode forward resistance
I Very low series inductance
I For applications up to 3 GHz
1.3 Applications
I RF attenuators and switches
2. Pinning information
Table 1.
Pin
1
2
Discrete pinning
Description
cathode
anode
Simplified outline Symbol
[1]
12
Transparent
top view
sym006
[1] The marking bar indicates the cathode.
3. Ordering information
Table 2. Ordering information
Type number Package
Name Description
BAP1321LX -
leadless ultra small plastic package; 2 terminals;
body 1 × 0.6 × 0.4 mm
Version
SOD882T




BAP1321LX pdf, 반도체, 판매, 대치품
NXP Semiconductors
BAP1321LX
www.DataSheet4U.com
Silicon PIN diode
400
Cd
(fF)
300
200
100
001aag770
102
rD
()
10
1
001aag771
0
0 5 10 15 20
VR (V)
f = 1 MHz; Tj = 25 °C.
Fig 1. Diode capacitance as a function of reverse
voltage; typical values
101
101
1
10 102
If (mA)
f = 100 MHz; Tj = 25 °C.
Fig 2. Forward resistance as a function of forward
current; typical values
0
ISL
(dB)
10
001aag772
20
30
40
0
1000
2000
3000
f (MHz)
Tamb = 25 °C
Diode zero biased and inserted in series with a 50
stripline circuit
Fig 3. Isolation of the diode as a function of
frequency; typical values
0
Lins
(dB)
0.2
(3)
(4)
0.4
001aag773
(1)
(2)
0.6
0.8
1.0
0
1000
2000
3000
f (MHz)
Tamb = 25 °C
(1) IF = 100 mA
(2) IF = 10 mA
(3) IF = 1 mA
(4) IF = 0.5 mA
Diode inserted in series with a 50 stripline circuit
and biased via the analyzer Tee network
Fig 4. Insertion loss of the diode as a function of
frequency; typical values
BAP1321LX_1
Product data sheet
Rev. 01 — 30 July 2007
© NXP B.V. 2007. All rights reserved.
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BAP1321LX 전자부품, 판매, 대치품
NXP Semiconductors
BAP1321LX
www.DataSheet4U.com
Silicon PIN diode
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet Development
Preliminary [short] data sheet Qualification
Product [short] data sheet
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
BAP1321LX_1
Product data sheet
Rev. 01 — 30 July 2007
© NXP B.V. 2007. All rights reserved.
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BAP1321LX

Silicon PIN diode

NXP Semiconductors
NXP Semiconductors

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