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부품번호 TZA3026 기능
기능 SDH/SONET STM4/OC12 transimpedance amplifer
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TZA3026 데이터시트, 핀배열, 회로
TZA3026
www.DataSheet4U.com
SDH/SONET STM4/OC12 transimpedance amplifier
Rev. 01 — 2 May 2005
Product data sheet
1. General description
The TZA3026 is a transimpedance amplifier with Automatic Gain Control (AGC), designed
to be used in STM4/OC12 fiber optic links. It amplifies the current generated by a photo
detector (PIN diode or avalanche photodiode) and converts it to a differential output
voltage. It offers a current mirror of average photo current for RSSI monitoring to be used
in SFF8472 compliant modules.
The low noise characteristics makes it suitable for STM4/OC12 applications, but also for
FTTx applications.
2. Features
s Low equivalent input noise current, typically 67 nA (RMS)
s Wide dynamic range, typically 0.85 µA to 1.5 mA (p-p)
s Differential transimpedance of 14 k(typical)
s Bandwidth from DC to 650 MHz (typical)
s Differential outputs
s On-chip AGC with possibility of external control
s Single supply voltage 3.3 V, range 2.9 V to 3.6 V
s Bias voltage for PIN diode
s Current output of average photo current for RSSI monitoring
s Identical ports available on both sides of die for easy bond layout and RF polarity
selection
3. Applications
s Digital fiber optic receiver modules in telecommunications transmission systems, in
high speed data networks or in FTTx systems
4. Ordering information
Table 1: Ordering information
Type number
Package
Name
Description
TZA3026U
-
bare die, dimensions approximately
0.82 mm × 1.3 mm
Version
-




TZA3026 pdf, 반도체, 판매, 대치품
Philips Semiconductors
TZA3026
www.DataSheet4U.com
SDH/SONET STM4/OC12 transimpedance amplifier
Table 2: Bonding pad description …continued
Bonding pad locations with respect to the center of the die (see Figure 10), X and Y are in µm.
Symbol
Pad X
Y Type
Description
GND
11 486.4 278.6 ground
ground; connect together pads 9, 10, 11 and pad 12 as many as
possible
GND
12 346.4 278.6 ground
ground; connect together pads 9, 10, 11 and pad 12 as many as
possible
OUTQ
13 206.4 278.6 output
data output; complement of pad OUT; use pad 7 or pad 13
OUT
14 66.4 278.6 output
data output; use pad 8 or pad 14 [1]
AGC
15 73.6 278.6 input
AGC voltage; use pad 6 or pad 15
IDREF_MON 16 213.6 278.6 output
current output for RSSI measurements; connect a resistor to pad 5
or pad 16 and ground
VCC
17 353.6 278.6 supply
supply voltage; connect supply voltage to pad 4 or pad 17
[1] These pads go HIGH when current flows into pad IPHOTO.
7. Functional description
The TZA3026 is a TransImpedance Amplifier (TIA) intended for use in fiber optic receivers
for signal recovery in STM4/OC12 or FTTx applications. It amplifies the current generated
by a photo detector (PIN diode or avalanche photodiode) and converts it to a differential
output voltage.
The most important characteristics of the TZA3026 are high receiver sensitivity, wide
dynamic range and large bandwidth. Excellent receiver sensitivity is achieved by
minimizing transimpedance amplifier noise.
The TZA3026 has a wide dynamic range to handle the signal current generated by the
PIN diode which can vary from 0.85 µA to 1.5 mA (p-p). This is implemented by an AGC
loop which reduces the preamplifier feedback resistance so that the amplifier remains
linear over the whole input range. The AGC loop hold capacitor is integrated on-chip, so
an external capacitor is not required.
The bandwidth of TZA3026 is optimized for STM4/OC12 application. It works from DC
onward due to the absence of offset control loops. Therefore the amount of Consecutive
Identical Digits (CID) will not effect the output waveform. A differential amplifier converts
the output of the preamplifier to a differential voltage.
7.1 PIN diode connections
The performance of an optical receiver is largely determined by the combined effect of the
transimpedance amplifier and the PIN diode. In particular, the method used to connect the
PIN diode to the input (pad IPHOTO) and the layout around the input pad strongly
influences the main parameters of a transimpedance amplifier, such as sensitivity,
bandwidth, and PSRR.
Sensitivity is most affected by the value of the total capacitance at the input pad.
Therefore, to obtain the highest possible sensitivity the total capacitance should be as low
as possible.
9397 750 14763
Product data sheet
Rev. 01 — 2 May 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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TZA3026 전자부품, 판매, 대치품
Philips Semiconductors
TZA3026
www.DataSheet4U.com
SDH/SONET STM4/OC12 transimpedance amplifier
For applications where the transimpedance is controlled by the TIA it is advised to leave
the AGC pads unconnected to achieve fast attack and decay times.
The AGC function can be overruled by applying a voltage to pad AGC. In this
configuration, connecting pad AGC to ground gives maximum transimpedance and
connecting it to VCC gives minimum transimpedance. This is depicted in Figure 7. The
AGC voltage should be derived from the VCC for proper functioning.
For maximum freedom on bonding location, 2 pads are available for AGC (pads 6 and 15).
These pads are internally connected. Both pads can be used if necessary.
102
transimpedance
(k)
10
001aac623
1
101
0.3VCC
0.5VCC
0.7VCC
0.9VCC
VAGC (V)
Fig 7. Transimpedance as function of the AGC voltage
7.3 Monitoring RSSI via IDREF_MON
To facilitate RSSI monitoring in modules (e.g. SFF8472 compliant SFP modules), a
current output is provided. This output gives a current which is 20 % of the average DREF
current through the 300 bias resistor. By connecting a resistor to the IDREF_MON
output, a voltage proportional with the average input power can be obtained.
The RSSI monitoring is implemented by measuring the voltage over the 300 bias
resistor. This method is preferred over simple current mirror because at small photo
currents the voltage drop over the resistor is very small. This gives a higher bias voltage
yielding better performance of the photodiode.
For maximum freedom on bonding location, 2 pads are available for IDREF_MON (pads 5
and 16). These pads are internally connected. Both pads can be used if necessary. If only
one is used, the other can be left open.
9397 750 14763
Product data sheet
Rev. 01 — 2 May 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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