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PDF BTA316-600ET Data sheet ( Hoja de datos )
| Número de pieza | BTA316-600ET | |
| Descripción | 16 A three-quadrant high commutation triac | |
| Fabricantes | NXP Semiconductors | |
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BTA316-600ET
www.DataSheet4U.
16 A three-quadrant high commutation triac
Rev. 01 — 30 March 2010
Product data sheet
1. Product profile
1.1 General description
Planar passivated, new generation, high commutation, high operating junction
temperature, three-quadrant triac in a SOT78 plastic package.
1.2 Features and benefits
Hi-Com triac with maximum false
trigger immunity
High operating junction temperature
Planar passivated
Sensitive gate for direct triggering from
microcontrollers and logic ICs
Triggering in three quadrants only
1.3 Applications
Applications subject to high
temperature
Electronic thermostats, heating and
cooking controls
High power motor controls in washing
machines and vacuum cleaners
Refrigeration and air-conditioner
compressor controls
1.4 Quick reference data
Table 1. Quick reference
Symbol Parameter
Conditions
VDRM
repetitive peak
off-state voltage
ITSM
Tj
IT(RMS)
non-repetitive peak
on-state current
junction temperature
RMS on-state
current
full sine wave; Tj(init) = 25 °C;
tp = 20 ms; see Figure 4 and 5
full sine wave; Tmb ≤ 126 °C;
see Figure 3, 1 and 2
Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; see Figure 7
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; see Figure 7
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; see Figure 7
Min Typ Max Unit
- - 600 V
- - 140 A
- - 150 °C
- - 16 A
- - 10 mA
- - 10 mA
- - 10 mA
1 page  
NXP Semiconductors
BTA316-600ET
www.DataSheet4U.com
16 A three-quadrant high commutation triac
5. Thermal characteristics
Table 5.
Symbol
Rth(j-mb)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to
mounting base
thermal resistance from junction to
ambient
Conditions
full cycle; see Figure 6
half cycle; see Figure 6
in free air
Min Typ Max Unit
- - 1.2 K/W
- - 1.7 K/W
- 60 - K/W
10
Zth(j-mb)
(K/W)
1
10−1
10−2
10−3
10−5
10−4
10−3
10−2
003aab776
(1)
(2)
10−1
P
tp t
1 10
tp (s)
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse duration
BTA316-600ET_1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 30 March 2010
© NXP B.V. 2010. All rights reserved.
5 of 13
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NXP Semiconductors
BTA316-600ET
www.DataSheet4U.com
16 A three-quadrant high commutation triac
9. Legal information
9.1 Data sheet status
Document status [1][2]
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
Product status[3]
Development
Qualification
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
BTA316-600ET_1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 30 March 2010
© NXP B.V. 2010. All rights reserved.
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