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What is BUK7E07-55B?

This electronic component, produced by the manufacturer "NXP Semiconductors", performs the same function as "N-channel TrenchMOS standard level FET".


BUK7E07-55B Datasheet PDF - NXP Semiconductors

Part Number BUK7E07-55B
Description N-channel TrenchMOS standard level FET
Manufacturers NXP Semiconductors 
Logo NXP Semiconductors Logo 


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BUK7E07-55B
N-channel TrenchMOS standard level FET
Rev. 01 — 29 January 2008
www.DataSheet4U.com
Product data sheet
1. Product profile
1.1 General description
N-channel enhancement mode power Field-Effect Transistor (FET) in a plastic package
using NXP High-Performance Automotive (HPA) TrenchMOS technology. This product has
been designed and qualified to the appropriate AEC standard for use in Automotive critical
applications.
1.2 Features
I Very low on-state resistance
I 175 °C rated
I Q101 compliant
I Standard level compatible
1.3 Applications
I Automotive systems
I Motors, lamps and solenoids
I General purpose power switching
I 12 V and 24 V loads
1.4 Quick reference data
I EDS(AL)S 351 mJ
I ID 75 A
I RDSon = 5.8 m(typ)
I Ptot 203 W
2. Pinning information
Table 1. Pinning
Pin Description
1 gate (G)
2 drain (D)
3 source (S)
mb mounting base; connected to drain (D)
Simplified outline
mb
Symbol
D
G
mbb076 S
123
SOT226 (I2PAK)

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BUK7E07-55B equivalent
NXP Semiconductors
BUK7E07-55B
www.DataSheet4U.com
N-channel TrenchMOS standard level FET
6. Characteristics
Table 5. Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Static characteristics
V(BR)DSS drain-source breakdown voltage ID = 0.25 mA; VGS = 0 V
Tj = 25 °C
Tj = 55 °C
VGS(th) gate-source threshold voltage ID = 1 mA; VDS = VGS; see Figure 9 and 10
Tj = 25 °C
Tj = 175 °C
Tj = 55 °C
IDSS drain leakage current
VDS = 55 V; VGS = 0 V
Tj = 25 °C
Tj = 175 °C
IGSS gate leakage current
VGS = ±20 V; VDS = 0 V
RDSon drain-source on-state resistance VGS = 10 V; ID = 25 A; see Figure 6 and 8
Tj = 25 °C
Tj = 175 °C
Dynamic characteristics
QG(tot)
QGS
QGD
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
LD
total gate charge
gate-source charge
gate-drain charge
input capacitance
output capacitance
reverse transfer capacitance
turn-on delay time
rise time
turn-off delay time
fall time
internal drain inductance
ID = 25 A; VDS = 44 V; VGS = 10 V;
see Figure 14
VGS = 0 V; VDS = 25 V; f = 1 MHz;
see Figure 12
VDS = 30 V; RL = 1.2 ;
VGS = 10 V; RG = 10
measured from drain lead 6 mm from
package to centre of die
LS
internal source inductance
measured from source lead
to source bond pad
Source-drain diode
VSD source-drain voltage
trr reverse recovery time
Qr recovered charge
IS = 25 A; VGS = 0 V; see Figure 15
IS = 20 A; dIS/dt = 100 A/µs;
VGS = 0 V; VR = 30 V
Min Typ Max Unit
55 - - V
50 - - V
234V
1- - V
- - 4.4 V
-
0.02 1
µA
- - 500 µA
- 2 100 nA
- 5.8 7.1 m
- - 14.2 m
- 53 - nC
- 12 - nC
- 17 - nC
- 2820 3760 pF
- 554 665 pF
- 200 274 pF
- 24 - ns
- 52 - ns
- 77 - ns
- 41 - ns
- 4.5 - nH
- 7.5 - nH
- 0.85 1.2 V
- 62 - ns
- 60 - nC
BUK7E07-55B_1
Product data sheet
Rev. 01 — 29 January 2008
© NXP B.V. 2008. All rights reserved.
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Part NumberDescriptionMFRS
BUK7E07-55BThe function is N-channel TrenchMOS standard level FET. NXP SemiconductorsNXP Semiconductors

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