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부품번호 | 28F320C3 기능 |
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기능 | 3 Volt Advanced+ Boot Block Flash Memory | ||
제조업체 | Intel Corporation | ||
로고 | |||
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Intel£ Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Datasheet
Product Features
■ Flexible SmartVoltage Technology
— 2.7 V– 3.6 V Read/Program/Erase
— 12 V for Fast Production Programming
■ 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option
— Reduces Overall System Power
■ High Performance
— 2.7 V– 3.6 V: 70 ns Max Access Time
■ Optimized Architecture for Code Plus
Data Storage
— Eight 4 Kword Blocks, Top or Bottom
Parameter Boot
— Up to One Hundred-Twenty-Seven 32
Kword Blocks
— Fast Program Suspend Capability
— Fast Erase Suspend Capability
■ Flexible Block Locking
— Lock/Unlock Any Block
— Full Protection on Power-Up
— WP# Pin for Hardware Block Protection
■ Low Power Consumption
— 9 mA Typical Read
— 7 A Typical Standby with Automatic
Power Savings Feature (APS)
■ Extended Temperature Operation
— –40 °C to +85 °C
■ 128-bit Protection Register
— 64 bit Unique Device Identifier
— 64 bit User Programmable OTP Cells
■ Extended Cycling Capability
— Minimum 100,000 Block Erase Cycles
■ Software
— Intel® Flash Data Integrator (FDI)
— Supports Top or Bottom Boot Storage,
Streaming Data (e.g., voice)
— Intel Basic Command Set
— Common Flash Interface (CFI)
■ Standard Surface Mount Packaging
— 48-Ball µBGA*/VFBGA
— 64-Ball Easy BGA Packages
— 48-Lead TSOP Package
■ ETOX™ VIII (0.13 µm) Flash
Technology
— 16, 32 Mbit
■ ETOX™ VII (0.18 µm) Flash Technology
— 16, 32, 64 Mbit
■ ETOX™ VI (0.25 µm) Flash Technology
— 8, 16 and 32 Mbit
The Intel® Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power applications.
The C3 device incorporates low-voltage capability (3 V read, program, and erase) with high-
speed, low-power operation. Flexible block locking allows any block to be independently locked
or unlocked. Add to this the Intel® Flash Data Integrator (FDI) software and you have a cost-
effective, flexible, monolithic code plus data storage solution. Intel® Advanced+ Boot Block Flash
Memory (C3) products will be available in 48-lead TSOP, 48-ball CSP, and 64-ball Easy BGA
packages. Additional information on this product family can be obtained by accessing the Intel®
Flash website: http://www.intel.com/design/flash.
Notice: This specification is subject to change without notice. Verify with your local Intel sales
office that you have the latest datasheet before finalizing a design.
Order Number: 290645-016
May 2003
Contents
www.DataSheet4U.com
5.6.1 Program Protection................................................................................................ 32
6.0 Power Consumption.................................................................................................................... 33
6.1 Active Power (Program/Erase/Read).................................................................................. 33
6.2 Automatic Power Savings (APS) ........................................................................................ 33
6.3 Standby Power ................................................................................................................... 33
6.4 Deep Power-Down Mode.................................................................................................... 33
6.5 Power and Reset Considerations ....................................................................................... 34
6.5.1 Power-Up/Down Characteristics............................................................................ 34
6.5.2 RP# Connected to System Reset .......................................................................... 34
6.5.3 VCC, VPP and RP# Transitions ............................................................................ 34
6.6 Power Supply Decoupling................................................................................................... 35
7.0 Thermal and DC Characteristics ................................................................................................ 35
7.1 Absolute Maximum Ratings ................................................................................................ 35
7.2 Operating Conditions .......................................................................................................... 36
7.3 DC Current Characteristics................................................................................................. 36
7.4 DC Voltage Characteristics................................................................................................. 39
8.0 AC Characteristics ...................................................................................................................... 40
8.1 AC Read Characteristics .................................................................................................... 40
8.2 AC Write Characteristics..................................................................................................... 44
8.3 Erase and Program Timings ............................................................................................... 48
8.4 Reset Specifications ........................................................................................................... 49
8.5 AC I/O Test Conditions ....................................................................................................... 50
8.6 Device Capacitance............................................................................................................ 50
Appendix A Write State Machine States .............................................................................................51
Appendix B Flow Charts ......................................................................................................................53
Appendix C Common Flash Interface.................................................................................................59
Appendix D Mechanical Specifications ..............................................................................................65
Appendix E Additional Information ....................................................................................................68
Appendix F Ordering Information .......................................................................................................69
4 Datasheet
4페이지 1.0
1.1
1.2
1.3
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Intel£ Advanced+ Boot Block Flash Memory (C3)
Introduction
Document Purpose
This datasheet contains the specifications for the Intel® Advanced+ Boot Block Flash Memory
(C3) device family. These flash memories add features such as instant block locking and protection
registers that can be used to enhance the security of systems.
Nomenclature
0x
0b
Byte
Word
Kword
Mword
Kb
KB
Mb
MB
APS
CUI
OTP
PR
PRD
PLR
RFU
SR
SRD
WSM
Hexadecimal prefix
Binary prefix
8 bits
16 bits
1024 words
1,048,576 words
1024 bits
1024 bytes
1,048,576 bits
1,048,576 bytes
Automatic Power Savings
Command User Interface
One Time Programmable
Protection Register
Protection Register Data
Protection Lock Register
Reserved for Future Use
Status Register
Status Register Data
Write State Machine
Conventions
The terms pin and signal are often used interchangeably to refer to the external signal connections
on the package. (ball is the term used for CSP).
Group Membership Brackets: Square brackets will be used to designate group membership or to
define a group of signals with similar function (i.e. A[21:1], SR[4:1])
Set: When referring to registers, the term set means the bit is a logical 1.
Clear: When referring to registers, the term clear means the bit is a logical 0.
Block: A group of bits (or words) that erase simultaneously with one block erase instruction.
Main Block: A block that contains 32 Kwords.
Parameter Block: A block that contains 4 Kwords.
Datasheet
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28F320C3 | 3 Volt Advanced+ Boot Block Flash Memory | Intel Corporation |
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