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EMIF02-MIC07F3 데이터시트 PDF




ST Microelectronics에서 제조한 전자 부품 EMIF02-MIC07F3은 전자 산업 및 응용 분야에서
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부품번호 EMIF02-MIC07F3 기능
기능 EMI filter and ESD protection
제조업체 ST Microelectronics
로고 ST Microelectronics 로고


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EMIF02-MIC07F3 데이터시트, 핀배열, 회로
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EMIF02-MIC07F3
EMI filter and ESD protection
Features
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI/ESD protection
Lead-free package
Very thin package
High reliability offered by monolithic integration
High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
IEC 61000-4-2 level 4
(on external pins B1 and C1)
+ 15 kV (air discharge)
+ 8 kV (contact discharge)
IEC 61000-4-2 level 1
(on external pins)
+ 2 kV (air discharge)
+ 2 kV (contact discharge)
Applications
Where EMI filtering in ESD sensitive equipment is
required:
Mobile phones and communication systems
Computers, printers and MCU Boards
Description
The EMIF02-MIC07F3 chip is a highly integrated
audio filter device designed to suppress EMI/RFI
noise in all systems subjected to electromagnetic
interference.
This filter includes ESD protection circuitry, which
prevents damage to the protected device when
subjected to ESD surges up to 15 kV.
TM: IPAD is a trademark of STMicroelectronics.
Lead-free Flip-Chip package
(8 bumps)
Figure 1. Pin configuration (bump side)
321
MIC
Bias
Acc_Det
A
Op Gnd Mic2p
B
On Gnd Mic2n
C
Figure 2. Schematic
GND
Acc_Det
GND
C11
A2
Mic Bias
A3
R11
GND
C21
B1
Mic2p
Mic2n
C1
R31 R21 C31 B3
to ASIC
C32
R22 C3
C12 R12 C22
GND
GND
GND
GND
B2 and C2 are ground bumps and must be connected together
March 2010
Doc ID 17052 Rev 1
1/7
www.st.com
7




EMIF02-MIC07F3 pdf, 반도체, 판매, 대치품
Ordering information scheme
2 Ordering information scheme
www.DataSheet4U.com
EMIF02-MIC07F3
Figure 10. Ordering information scheme
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10 (pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
x = 3: Lead-free, pitch = 400 µm
EMIF yy - xxx zz Fx
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Flip-Chip package dimensions
400 µm ± 40
255 µm ± 40
605 µm ± 55
185 µm
1.17 mm ± 30 µm
4/7 Doc ID 17052 Rev 1

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EMIF02-MIC07F3 전자부품, 판매, 대치품
EMIF02-MIC07F3
www.DataSheet4U.com
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
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Doc ID 17052 Rev 1
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부품번호상세설명 및 기능제조사
EMIF02-MIC07F3

EMI filter and ESD protection

ST Microelectronics
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