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PDF SGC-4363Z Data sheet ( Hoja de datos )

Número de pieza SGC-4363Z
Descripción Silicon Germanium Cascadable Gain Block
Fabricantes SIRENZA MICRODEVICES 
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SGC-4363Z
Product Description
Sirenza Microdevices’ SGC-4363Z is a high performance SiGe HBT MMIC
amplifier utilizing a Darlington configuration with a patented active bias
50-4000 MHz Active Bias Silicon
network. The active bias network provides stable current over temperature Germanium Cascadable Gain Block
and process Beta variations. Designed to run directly from a 3V supply, the
SGC-4363Z does not require a dropping resistor as compared to typical
Darlington amplifiers. The SGC-4363Z is designed for high linearity 3V gain
block applications that require small size and minimal external components.
It is internally matched to 50 ohms.
Pb RoHS Compliant
& Green Package
Gain & Return Loss VD = 3V, ID = 54mA
30
S21
20
10
Bias Tee Data, ZS = ZL = 50 Ohms, TL = 25C
0
-10 S22
-20 S11
-30
0 0.5 1 1.5 2 2.5 3 3.5
Frequency (GHz)
Product Features
Single Fixed 3V Supply
No Dropping Resistor Required
Patented Self-Bias Circuitry
P1dB = 12.4 dBm at 1950 MHz
OIP3 = 26.5 dBm at 1950 MHz
Robust 1000V ESD, Class 1C HBM
Applications
PA Driver Amplifier
Cellular, PCS, GSM, UMTS, WCDMA
IF Amplifier
4 Wireless Data, Satellite
Symbol
Parameters
G Small Signal Gain
P1dB Output Power at 1dB Compression
OIP3
IRL
Output Third Order Intercept Point
Input Return Loss
Units
dB
dBm
dBm
dB
Frequency
850 MHz
1950 MHz
2400 MHz
850 MHz
1950 MHz
2400 MHz
850 MHz
1950 MHz
2400 MHz
1950 MHz
Min.
15.6
11.2
11.4
24.5
9.5
Typ.
17.1
12.7
11.8
13.3
12.4
11.8
28.5
26.5
25.5
13.5
Max.
18.6
14.2
ORL Output Return Loss
dB 1950 MHz 8.5 12.5
NF Noise Figure
dB 1930 MHz
4.0 5.0
VD Device Operating Voltage
V
3
ID Device Operating Current
mA
48 54 60
Rth, j-l Thermal Resistance (junction to lead)
°C/W
180
Test Conditions: VD = 3.0V
ID = 54mA
Bias Tee Data
TL = 25°C
ZS = ZL = 50 Ohms
OIP3 Tone Spacing = 1MHz
Pout per tone = -5 dBm
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this
information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or
granted to any third party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2005 Sirenza Microdevices, Inc.. All worldwide rights
reserved.
303 S. Technology Ct.
Phone: (800) SMI-MMIC
http://www.sirenza.com
Broomfield, CO 80021
1
EDS-104977 Rev C

1 page




SGC-4363Z pdf
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SGC-4363Z 0.05-4.0 GHz Cascadeable MMIC Amplifier
SOT-363 PCB Pad Layout
Dimensions in inches [millimeters]
RF
OUT
RF
IN
Notes:
1. Provide a large ground pad area under device pins 1,
2, 4, and 5 with several plated-through holes placed as
shown.
2. 1-2 ounce finished copper thickness is recommended.
3. RF I/O lines are 50Ω
SOT-363 Nominal Package Dimensions
Dimensions in inches [millimeters]
A link to the SOT-363 package outline drawing with full dimensions and
tolerances may be found on the product web page at www.sirenza.com.
303 S. Technology Ct.
Broomfield, CO 80021
Phone: (800) SMI-MMIC
5
http://www.sirenza.com
EDS-104977 Rev C

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