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What is BUK9506-55A?

This electronic component, produced by the manufacturer "NXP Semiconductors", performs the same function as "TrenchMOS logic level FET".


BUK9506-55A Datasheet PDF - NXP Semiconductors

Part Number BUK9506-55A
Description TrenchMOS logic level FET
Manufacturers NXP Semiconductors 
Logo NXP Semiconductors Logo 


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BUK9506-55A; BUK9606-55A;
BUK9E06-55A
TrenchMOS™ logic level FET
Rev. 03 — 23 July 2001
Product data
1. Description
N-channel enhancement mode field-effect power transistor in a plastic package using
TrenchMOS™ technology, featuring very low on-state resistance.
Product availability:
BUK9506-55A in SOT78 (TO-220AB); BUK9606-55A in SOT404 (D2-PAK);
BUK9E06-55A in SOT226 (I2-PAK).
2. Features
s TrenchMOS™ technology
s Q101 compliant
s 175 °C rated
s Logic level compatible.
3. Applications
s Automotive and general purpose power switching:
c
c x 12 V and 24 V loads
x Motors, lamps and solenoids.
4. Pinning information
Table 1: Pinning - SOT78, SOT404, SOT226 simplified outline and symbol
Pin Description
Simplified outline
1 gate (g)
2 drain (d)
mb mb
mb
3 source (s)
mb mounting base,
connected to
drain (d)
MBK106
123
SOT78 (TO-220AB)
2
1 3 MBK116
SOT404 (D2-PAK)
123
MBK112
SOT226 (I2-PAK)
Symbol
g
MBB076
d
s

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BUK9506-55A equivalent
Philips Semiconductors
BUK9506-55A; BUK9606-55A;www.DataSheet4U.com
BUK9E06-55A
8. Characteristics
Table 5: Characteristics
Tj = 25 °C unless otherwise specified
Symbol Parameter
Conditions
Min Typ Max Unit
Static characteristics
V(BR)DSS drain-source breakdown
ID = 0.25 mA; VGS = 0 V
voltage
Tj = 25 °C
55 − − V
Tj = 55 °C
50 − − V
VGS(th)
gate-source threshold voltage ID = 1 mA; VDS = VGS;
Figure 9
IDSS
IGSS
RDSon
drain-source leakage current
gate-source leakage current
drain-source on-state
resistance
Tj = 25 °C
Tj = 175 °C
Tj = 55 °C
VDS = 55 V; VGS = 0 V
Tj = 25 °C
Tj = 175 °C
VGS = ±10 V; VDS = 0 V
VGS = 5 V; ID = 25 A;
Figure 7 and 8
1 1.5 2 V
0.5 − − V
− − 2.3 V
0.05 10
µA
− − 500 µA
2 100 nA
Dynamic characteristics
Tj = 25 °C
Tj = 175 °C
VGS = 4.5 V; ID = 25 A
VGS = 10 V; ID = 25 A
5.3 6.3 m
− − 13.2 m
− − 6.7 m
4.8 5.8 m
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
Ld
input capacitance
output capacitance
reverse transfer capacitance
turn-on delay time
rise time
turn-off delay time
fall time
internal drain inductance
VGS = 0 V; VDS = 25 V;
f = 1 MHz; Figure 12
VDD = 30 V; RL = 1.2 ;
VGS = 5 V; RG = 10
from drain lead 6 mm from
package to centre of die
6500
1000
650
45
180
420
235
4.5
8600
1200
850
pF
pF
pF
ns
ns
ns
ns
nH
from contact screw on
mounting base to centre of
die SOT78
3.5
nH
from upper edge of drain
mounting base to centre of
die SOT404 / SOT226
2.5
nH
Ls
internal source inductance from source lead to source
bond pad
7.5
nH
9397 750 08416
Product data
Rev. 03 — 23 July 2001
© Philips Electronics N.V. 2001. All rights reserved.
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