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부품번호 | MPXV7025 기능 |
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기능 | Integrated Silicon Pressure Sensor | ||
제조업체 | Freescale Semiconductor | ||
로고 | |||
전체 10 페이지수
Freescale Semiconductor
+ Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXV7025 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Features
• 5.0% Maximum Error Over 0° to 85°C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated Over –40° to +125°C
• Thermoplastic (PPS) Surface Mount Package
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations
Pressure
www.DataSheet4U.com
MPXV7025
Rev 5, 1/2009
MPXV7025
Series
-25 to 25 kPa (-3.6 to 3.6 psi)
0.2 to 4.7 V Output
Application Examples
• Respiratory Systems
• Process Control
• Patient Monitoring
• Remote Monitoring Devices
ORDERING INFORMATION
Device Name
Package
Options
Case
No.
# of Ports
None Single Dual
Gauge
Small Outline Package (MPXV7025 Series)
MPXV7025GC6U
Rails
482A
•
•
MPXV7025GC6T1
Tape & Reel
482A
•
•
MPXV7025GP
Trays
1369
•
•
MPXV7025DP
Trays
1351
•
Small Outline Package (Media Resistant Gel) (MPVZ7025 Series)
MPVZ7025GC6T1
Tape & Reel
482A
•
•
MPVZ7025GC6U
Rails
482A
•
•
MPVZ7025GP
Trays
1369
•
•
MPVZ7025G6T1
Tape & Reel
482
•
MPVZ7025G6U
Rails
482 •
MPVZ7025DP
Trays
1351
•
Pressure Type
Differential Absolute
Device
Marking
MPXV7025G
MPXV7025G
MPXV7025GP
• MPXV7025DP
MPVZ7025G
MPVZ7025G
MPVZ7025GP
• MPVZ7025G
• MPVZ7025G
• MPVZ7025DP
SMALL OUTLINE PACKAGE
MPXV7025GC6U/T1
MPVZ7025GC6U/T1
CASE 482A-01
MPVZ7025G6U/T1
CASE 482-01
MPXV7025GP
MPVZ7025GP
CASE 1369-01
MPXV7025DP
MPVZ7025DP
CASE 1351-01
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
Pressure
On-chip Temperature Compensation and Calibration
www.DataSheet4U.com
The MPXV7025 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
5.0
4.5 Transfer Function:
Vout = VS*(0.018*P+0.5) ± ERROR
4.0 VS = 5.0 Vdc
3.5 TEMP = 0 to 85°C
3.0
2.5
MAX
2.0
1.5
1.0
MIN
0.5
0 -25 0
Differential Pressure (kPa)
TYPICAL
25
Figure 2. Output versus Pressure Differential
1.0 µF
+5 V
Vout
Vs
IPS
0.01 µF
GND
OUTPUT
470 pF
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.))
MPXV7025
4
Sensors
Freescale Semiconductor
4페이지 5
N -B-
8
-A-
S
J
K
PACKAGE DIMENSIONS
Pressure
www.DataSheet4U.com
D 8 PL
4 0.25 (0.010) M T B S A S
G
1
V
C
M
W
PIN 1 IDENTIFIER
H
-T-
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
DIM MIN MAX
A 0.415 0.425
B 0.415 0.425
C 0.500 0.520
D 0.038 0.042
G 0.100 BSC
H 0.002 0.010
J 0.009 0.011
K 0.061 0.071
M 0˚
7˚
N 0.444 0.448
S 0.709 0.725
V 0.245 0.255
W 0.115 0.125
MILLIMETERS
MIN MAX
10.54 10.79
10.54 10.79
12.70 13.21
0.96 1.07
2.54 BSC
0.05 0.25
0.23 0.28
1.55 1.80
0˚ 7˚
11.28 11.38
18.01 18.41
6.22 6.48
2.92 3.17
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
5
-B-
8
J
K
-A-
S
N
D 8 PL
4 0.25 (0.010) M T B S A S
G
1
C
M
PIN 1 IDENTIFIER
H
-T-
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
DIM MIN MAX
A 0.415 0.425
B 0.415 0.425
C 0.212 0.230
D 0.038 0.042
G 0.100 BSC
H 0.002 0.010
J 0.009 0.011
K 0.061 0.071
M 0˚
7˚
N 0.405 0.415
S 0.709 0.725
MILLIMETERS
MIN MAX
10.54 10.79
10.54 10.79
5.38 5.84
0.96 1.07
2.54 BSC
0.05 0.25
0.23 0.28
1.55 1.80
0˚ 7˚
10.29 10.54
18.01 18.41
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
Sensors
Freescale Semiconductor
MPXV7025
7
7페이지 | |||
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부품번호 | 상세설명 및 기능 | 제조사 |
MPXV7025 | Integrated Silicon Pressure Sensor | Freescale Semiconductor |
MPXV7025G | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned | Freescale Semiconductor |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |