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MPXV7025 데이터시트 PDF




Freescale Semiconductor에서 제조한 전자 부품 MPXV7025은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


PDF 형식의 MPXV7025 자료 제공

부품번호 MPXV7025 기능
기능 Integrated Silicon Pressure Sensor
제조업체 Freescale Semiconductor
로고 Freescale Semiconductor 로고


MPXV7025 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.




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MPXV7025 데이터시트, 핀배열, 회로
Freescale Semiconductor
+ Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXV7025 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Features
• 5.0% Maximum Error Over 0° to 85°C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated Over –40° to +125°C
• Thermoplastic (PPS) Surface Mount Package
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations
Pressure
www.DataSheet4U.com
MPXV7025
Rev 5, 1/2009
MPXV7025
Series
-25 to 25 kPa (-3.6 to 3.6 psi)
0.2 to 4.7 V Output
Application Examples
• Respiratory Systems
• Process Control
• Patient Monitoring
• Remote Monitoring Devices
ORDERING INFORMATION
Device Name
Package
Options
Case
No.
# of Ports
None Single Dual
Gauge
Small Outline Package (MPXV7025 Series)
MPXV7025GC6U
Rails
482A
MPXV7025GC6T1
Tape & Reel
482A
MPXV7025GP
Trays
1369
MPXV7025DP
Trays
1351
Small Outline Package (Media Resistant Gel) (MPVZ7025 Series)
MPVZ7025GC6T1
Tape & Reel
482A
MPVZ7025GC6U
Rails
482A
MPVZ7025GP
Trays
1369
MPVZ7025G6T1
Tape & Reel
482
MPVZ7025G6U
Rails
482
MPVZ7025DP
Trays
1351
Pressure Type
Differential Absolute
Device
Marking
MPXV7025G
MPXV7025G
MPXV7025GP
MPXV7025DP
MPVZ7025G
MPVZ7025G
MPVZ7025GP
MPVZ7025G
MPVZ7025G
MPVZ7025DP
SMALL OUTLINE PACKAGE
MPXV7025GC6U/T1
MPVZ7025GC6U/T1
CASE 482A-01
MPVZ7025G6U/T1
CASE 482-01
MPXV7025GP
MPVZ7025GP
CASE 1369-01
MPXV7025DP
MPVZ7025DP
CASE 1351-01
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.




MPXV7025 pdf, 반도체, 판매, 대치품
Pressure
On-chip Temperature Compensation and Calibration
www.DataSheet4U.com
The MPXV7025 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
5.0
4.5 Transfer Function:
Vout = VS*(0.018*P+0.5) ± ERROR
4.0 VS = 5.0 Vdc
3.5 TEMP = 0 to 85°C
3.0
2.5
MAX
2.0
1.5
1.0
MIN
0.5
0 -25 0
Differential Pressure (kPa)
TYPICAL
25
Figure 2. Output versus Pressure Differential
1.0 µF
+5 V
Vout
Vs
IPS
0.01 µF
GND
OUTPUT
470 pF
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.))
MPXV7025
4
Sensors
Freescale Semiconductor

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MPXV7025 전자부품, 판매, 대치품
5
N -B-
8
-A-
S
J
K
PACKAGE DIMENSIONS
Pressure
www.DataSheet4U.com
D 8 PL
4 0.25 (0.010) M T B S A S
G
1
V
C
M
W
PIN 1 IDENTIFIER
H
-T-
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
DIM MIN MAX
A 0.415 0.425
B 0.415 0.425
C 0.500 0.520
D 0.038 0.042
G 0.100 BSC
H 0.002 0.010
J 0.009 0.011
K 0.061 0.071
M
N 0.444 0.448
S 0.709 0.725
V 0.245 0.255
W 0.115 0.125
MILLIMETERS
MIN MAX
10.54 10.79
10.54 10.79
12.70 13.21
0.96 1.07
2.54 BSC
0.05 0.25
0.23 0.28
1.55 1.80
0˚ 7˚
11.28 11.38
18.01 18.41
6.22 6.48
2.92 3.17
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
5
-B-
8
J
K
-A-
S
N
D 8 PL
4 0.25 (0.010) M T B S A S
G
1
C
M
PIN 1 IDENTIFIER
H
-T-
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
DIM MIN MAX
A 0.415 0.425
B 0.415 0.425
C 0.212 0.230
D 0.038 0.042
G 0.100 BSC
H 0.002 0.010
J 0.009 0.011
K 0.061 0.071
M
N 0.405 0.415
S 0.709 0.725
MILLIMETERS
MIN MAX
10.54 10.79
10.54 10.79
5.38 5.84
0.96 1.07
2.54 BSC
0.05 0.25
0.23 0.28
1.55 1.80
0˚ 7˚
10.29 10.54
18.01 18.41
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
Sensors
Freescale Semiconductor
MPXV7025
7

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