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PDF ADP172 Data sheet ( Hoja de datos )
| Número de pieza | ADP172 | |
| Descripción | Low Quiescent Current CMOS Linear Regulator | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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FEATURES
Maximum output current: 300 mA
Input voltage range: 1.6 V to 3.6 V
Low quiescent current
IGND = 23 μA with 0 mA load
IGND = 170 μA with 300 mA load
Low shutdown current: <1 μA
Low dropout voltage: 50 mV at 300 mA load
Output voltage accuracy: ±1%
Up to 31 fixed-output voltage options available
from 0.8 V to 3.0 V
Accuracy over line, load, and temperature: ±3%
Stable with small 1 μF ceramic output capacitor
PSRR performance of 70 dB at 10 kHz and 73 dB at 1 kHz
Low noise: 30 μV rms at VOUT = 0.8 V
Current limit and thermal overload protection
Logic-controlled enable
Tiny 4-ball, 0.5 mm pitch WLCSP package
APPLICATIONS
Mobile phones
Digital camera and audio devices
Portable and battery-powered equipment
DSP/FPGA/microprocessor supplies
Post dc-to-dc regulation
GENERAL DESCRIPTION
The ADP172 is a low voltage input, low quiescent current, low-
dropout (LDO) linear regulator that operates from 1.6 V to 3.6 V
and provides up to 300 mA of output current. The low 50 mV
dropout voltage at 300 mA load improves efficiency and allows
operation over a wide input voltage range. The low 23 μA of
quiescent current at no load makes the ADP172 ideal for
battery-operated portable equipment.
The ADP172 is capable of 31 fixed-output voltage options, ranging
from 0.8 V to 3.0 V. The ADP172 is optimized for stable operation
with small 1 μF ceramic output capacitors. Ideal for powering
digital processors, the ADP172 exhibits good transient perform-
ance and occupies minimal board space. Compared with
300 mA, Low Quiescent Current,www.DataSheet4U.com
CMOS Linear Regulator
ADP172
TYPICAL APPLICATION CIRCUITS
VIN = 2.3V
C1
ON
OFF
VIN VOUT
EN U1GND
VOUT = 1.8V
C2
Figure 1. ADP172 with Fixed Output Voltage, 1.8 V
commodity-type LDOs, the ADP172 provides 20 dB to 40 dB
better power supply rejection ratio (PSRR) at 100 kHz, making the
ADP172 an ideal power source for analog-to-digital converter
(ADC) mixed-signal processor systems and allowing use of
smaller size bypass capacitors. In addition, low output noise
performance without the need for an additional bypass capacitor
further reduces printed circuit board (PCB) component count.
Short-circuit protection and thermal overload protection circuits
prevent damage in adverse conditions. The ADP172 is available
in a tiny 4-ball, 0.5 mm pitch WLCSP for the smallest footprint
solution to meet a variety of portable power applications.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2010 Analog Devices, Inc. All rights reserved.
1 page  
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN to GND
VOUT to GND
EN to GND
Storage Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Soldering Conditions
Rating
−0.3 V to +4.0 V
−0.3 V to VIN
−0.3 V to +4.0 V
−65°C to +150°C
−40°C to +125°C
−40°C to +85°C
JEDEC J-STD-020
Stresses above those listed under absolute maximum ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply only individually, not in
combination. The ADP172 can be damaged when the junction
temperature limits are exceeded. Monitoring ambient
temperature does not guarantee that TJ is within the specified
temperature limits. In applications with high power dissipation
and poor thermal resistance, the maximum ambient temperature
may have to be derated.
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (TJ) of
the device is dependent on the ambient temperature (TA), the
power dissipation of the device (PD), and the junction-to-
ambient thermal resistance of the package (θJA).
Maximum junction temperature (TJ) is calculated from the
ambient temperature (TA) and power dissipation (PD) using the
following formula:
TJ = TA + (PD × θJA)
Junction-to-ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
ADP172www.DataSheet4U.com
the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θJA may vary, depending
on PCB material, layout, and environmental conditions. The
specified values of θJA are based on a 4-layer, 4 in. × 3 in. PCB.
Refer to JESD51-7 for detailed information regarding board
construction.
ΨJB is the junction-to-board thermal characterization parameter
with units of °C/W. The ΨJB of the package is based on modeling
and calculation using a 4-layer board. The Guidelines for Reporting
and Using Electronic Package Thermal Information: JESD51-12
states that thermal characterization parameters are not the same
as thermal resistances. ΨJB measures the component power flowing
through multiple thermal paths rather than a single path as in
thermal resistance, θJB. Therefore, ΨJB thermal paths include
convection from the top of the package as well as radiation from
the package—factors that make ΨJB more useful in real-world
applications. Maximum junction temperature (TJ) is calculated
from the board temperature (TB) and power dissipation (PD)
using the formula
TJ = TB + (PD × ΨJB)
Refer to JESD51-8 and JESD51-12 for more detailed information
about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA ΨJB Unit
4-Ball, 0.5 mm Pitch WLCSP 260
58
°C/W
ESD CAUTION
Rev. B | Page 5 of 20
5 Page 
THEORY OF OPERATION
The ADP172 is a low quiescent current, low-dropout linear
regulator that operates from 1.6 V to 3.6 V and can provide up to
300 mA of output current. Drawing a low 170 μA of quiescent
current (typical) at full load makes the ADP172 ideal for battery-
operated portable equipment. Shutdown current consumption is
typically 100 nA.
Optimized for use with small 1 μF ceramic capacitors, the
ADP172 provides excellent transient performance.
ADP172
VIN
VOUT
GND
SHORT CIRCUIT,
UVLO AND
THERMAL
PROTECT
R1
EN SHUTDOWN
0.5V REFERENCE
R2
Figure 23. ADP172 Internal Block Diagram
ADP172www.DataSheet4U.com
Internally, the ADP172 consists of a reference, an error
amplifier, a feedback voltage divider, and a PMOS pass transistor.
Output current is delivered via the PMOS pass device, which is
controlled by the error amplifier. The error amplifier compares
the reference voltage with the feedback voltage from the output
and amplifies the difference. If the feedback voltage is lower than
the reference voltage, the gate of the PMOS device is pulled lower,
allowing more current to pass and increasing the output voltage.
If the feedback voltage is higher than the reference voltage, the
gate of the PMOS device is pulled higher, allowing less current
to pass and decreasing the output voltage.
The ADP172 uses the EN pin to enable and disable the VOUT
pin under normal operating conditions. When EN is high, VOUT
turns on; when EN is low, VOUT turns off. For automatic
startup, EN can be tied to VIN.
Rev. B | Page 11 of 20
11 Page | ||
| Páginas | Total 20 Páginas | |
| PDF Descargar | [ Datasheet ADP172.PDF ] | |
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