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Bulletin I27149 08/07
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EMP25P12B
PIM+
EMP Features:
Power Module:
• NPT IGBTs 25A, 1200V
• 10us Short Circuit capability
Square RBSOA
Low Vce(on) (2.28Vtyp @ 25A, 25°C)
Positive Vce(on) temperature coefficient
• Gen III HexFred Technology
Low diode VF (1.76Vtyp @ 25A, 25°C)
Soft reverse recovery
• 4mΩ sensing resistors on all phase outputs and
DCbus minus rail
Thermal coefficient < 50ppm/°C
Description
The EMP25P12B is a Power Integrated Module for Motor
Driver applications with embedded sensing resistors on all
three-phase output currents.
Each sensing resistor’s head is directly bonded to an
external pin to reduce parasitic effects and achieve high
accuracy on feedback voltages.
Since their thermal coefficient is very low, no value
compensation is required across the complete operating
temperature range.
The device comes in the EMPTM package, fully compatible in
length, width and height with EconoPack 2 outline.
Package:
EMP – Inverter (EconoPack 2 outline compatible)
Power Module schematic:
Three phase inverter with current sensing
resistors on all output phases and thermistor
Power module frame pins mapping
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EMP25P12B I27149 08/07
Fig. 1 – Maximum DC collector
Current vs. case temperature
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Fig. 2 – Power Dissipation vs.
Case Temperature
TC = (ºC)
Fig. 3 – Forward SOA
TC = 25ºC; Tj ≤ 150ºC
TC = (ºC)
Fig. 4 – Reverse Bias SOA
Tj = 150ºC, VGE = 15V
VCE = (V)
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VCE = (V)
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EMP25P12B I27149 08/07
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Fig. 24 – Normalized Transient Thermal Impedance, Junction-to-copper plate (IGBTs)
t1, Rectangular Pulse Duration (sec)
Fig. 25 – Normalized Transient Impedance, Junction-to-copper plate (FRED diodes)
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t1, Rectangular Pulse Duration (sec)
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