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Número de pieza | ADP2119 | |
Descripción | Step-Down DC-to-DC Regulators | |
Fabricantes | Analog Devices | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de ADP2119 (archivo pdf) en la parte inferior de esta página. Total 24 Páginas | ||
No Preview Available ! 2 A/1.25 A, 1.2 MHz, Synchronous,www.DataSheet4U.com
Step-Down DC-to-DC Regulators
ADP2119/ADP2120
FEATURES
Continuous output current
ADP2119: 2 A
ADP2120: 1.25 A
145 mΩ and 70 mΩ integrated MOSFETs
Input voltage range from 2.3 V to 5.5 V
Output voltage from 0.6 V to VIN
±1.5% output accuracy
1.2 MHz fixed switching frequency
Synchronizable between 1 MHz and 2 MHz
Selectable PWM or PFM mode operation
Current mode architecture
Precision threshold enable input
Power-good flag
Voltage tracking
Integrated soft start
Internal compensation
Startup with precharged output
UVLO, OVP, OCP, and thermal shutdown
10-lead, 3 mm × 3 mm LFCSP_WD package
APPLICATIONS
Point of load conversion
Communications and networking equipment
Industrial and instrumentation
Consumer electronics
Medical applications
GENERAL DESCRIPTION
The ADP2119/ADP2120 are low quiescent current, synchronous,
step-down dc-to-dc regulators in a compact 3 mm × 3 mm
LFCSP_WD package. Both devices use a current mode, constant
frequency pulse-width modulation (PWM) control scheme for
excellent stability and transient response. Under light load conditions,
they can be configured to operate in a pulse frequency modulation
(PFM) mode, which reduces switching frequency to save power.
The ADP2119/ADP2120 support input voltages from 2.3 V to
5.5 V. The output voltage can be adjusted from 0.6 V up to the
input voltage (VIN) for the adjustable version, whereas the fixed
output version is available in preset output voltage options of 3.3 V,
2.5 V, 1.8 V, 1.5 V, 1.2 V, and 1.0 V. The ADP2119/ADP2120 require
minimal external parts and provide a high efficiency solution with
their integrated power switches, synchronous rectifiers, and internal
compensation. Each IC draws less than 2 μA current from the input
source when it is disabled. Other key features include undervoltage
lockout (UVLO), integrated soft start to limit inrush current at
startup, overvoltage protection (OVP), overcurrent protection
(OCP), and thermal shutdown (TSD).
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
TYPICAL APPLICATION CIRCUIT
C1
0.1µF
VIN
5V CIN
22µF
X5R
6.3V
R1
10Ω ADP2119/ADP2120
1 VIN
EN 10
VOUT
3.3V
COUT
22µF
X5R
6.3V
L
1.5µH
RTOP
10kΩ
RBOT
2.21kΩ
2 PVIN
3 SW
SYNC/MODE 9
R2
10kΩ
PGOOD 8
4 PGND
TRK 7
5 GND
FB 6
Figure 1.
100
VIN = 5V
90 VOUT = 1.8V
80
70
PFM
60
50
40
FPWM
30
20
10
0
0.01
0.1
OUTPUT CURRENT (A)
1
Figure 2. ADP2119 Efficiency vs. Output Current
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2010 Analog Devices, Inc. All rights reserved.
1 page ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, PVIN
SW
FB, SYNC/MODE, EN, TRK, PGOOD
PGND to GND
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Rating
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +0.3 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADPw2ww1.D1a9taS/hAeeDt4UP.c2om120
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
10-Lead LFCSP_WD
θJA Unit
40 °C/W
BOUNDARY CONDITION
θJA is measured using natural convection on a JEDEC 4-layer
board, and the exposed pad is soldered to the printed circuit
board (PCB) with thermal vias.
ESD CAUTION
Rev. 0 | Page 5 of 24
5 Page T
VOUT
1
SW
2
IL
4
CH1 500mV CH2 5.00V
CH4 2.00A Ω
M2.0ms
A CH1
T 3.92ms
Figure 28. Output Short (ADP2119)
480mV
VOUT
T
1
SW
2
IL
4
CH1 500mV CH2 5.00V
CH4 2.00A Ω
M2.0ms
A CH1
T 3.96ms
Figure 29. Output Short (ADP2120)
200mV
TRK
T
FB
1
CH1 500mV CH2 500mV
M2.0ms
T 44.4%
A CH2
Figure 30. Tracking Function
730mV
ADPw2ww1.D1a9taS/hAeeDt4UP.c2om120
T
VOUT
1
SW
2
IL
4
CH1 500mV CH2 5.00V
CH4 2.00A Ω
M2.0ms
A CH1 560mV
T –2.08ms
Figure 31. Output Short Recovery (ADP2119)
T
VOUT
1
SW
2
IL
4
CH1 500mV CH2 5.00V
CH4 2.00A Ω
M2.0ms
A CH1 560mV
T –2.12ms
Figure 32. Output Short Recovery (ADP2120)
T
SYNC
1
2
SW
CH1 2.0V
CH2 2.0V
M400ns
T 0.0s
A CH1
Figure 33. Synchronized to 1 MHz
4.12V
Rev. 0 | Page 11 of 24
11 Page |
Páginas | Total 24 Páginas | |
PDF Descargar | [ Datasheet ADP2119.PDF ] |
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