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PDF MSW2000-200 Data sheet ( Hoja de datos )
| Número de pieza | MSW2000-200 | |
| Descripción | Surface Mount PIN Diode SP2T Switches | |
| Fabricantes | Aeroflex Circuit Technology | |
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Surface Mount PIN Diode
SP2T Switches
MSW2000-200 & MSW2001-200
Series Datasheet
www.DataSheet4U.com
Features
• Surface Mount SP2T Switch in Compact Outline:
8mm L x 5mm W x 2.5 mm H
• Higher Average Power Handling than Plastic (125 W C.W.)
• Higher Voltage > 500 Volts for Higher RF Peak Power (500 W)
• Lower Insertion Loss ( 0.25 dB ) & Higher IIP3 (65 dBm)
• Operates From + Voltage Only (+5V, & +28V to +125V)
• RoHS Compliant
Description
The MSW2000-200 and MSW2001-200 Series of Surface Mount Silicon PIN Diode SP2T Switches is
manufactured using Aeroflex/Metelics proven hybrid manufacturing process incorporating High Voltage
PIN Diodes and passive devices integrated within a ceramic substrate. This low profile, compact, surface
mount component, (8mm L x 5mm W x 2.5 mm H) offers superior low and high signal performance to
comparable MMIC devices in QFN packages. The SP2T switches are designed in an asymmetrical
topology to optimize Tx-Ant Loss and Tx-Rx Isolation performance.
Using PIN Diodes with lower thermal resistance ( < 10 ºC/W ), RF C.W. incident power levels of +51 dBm
and RF peak incident power levels of +57 dBm are very achievable in higher power cold and hot
switching applications @ + 85 º C. The lower PIN Diode series resistance ( < 0.8 Ω ), coupled with the
longer minority carrier lifetime, ( > 2μS ), providesbetter IIP3distortion values> +65dBm.
Applications
These MSW2000-200 and MSW2001-200 Series SP2T Switches are designed to be used in higher power
switch applications, operating from 20 MHz to 4000 MHz, requiring high volume, surface mount, solder
re-flow manufacturing. These products are durable, reliable, and capable of meeting all military,
commercial, and industrial environments. The devices are fully RoHS compliant.
Environmental Capabilities
The MSW2000-200 and MSW2001-200 Series SP2T Switches are capable of meeting the environmental
requirements of MIL-STD-202 and MIL-STD-750.
ESD and Moisture Sensitivity Level Rating
PIN Diode Switches are susceptible to ESD conditions as with all semiconductors. The ESD rating for this
device is Class 1C, HBM. The moisture sensitivity level rating for this device is MSL 2
Document DS 12633 Rev B
Revision Date: 04/20/2010
1 page  
SP2T PIN Diode Switches
www.DataSheet4U.com
RF Bias Network Values
Part Number
F ( MHz )
MSW2000-200
MSW2001-200
50 – 1,000
400 – 4,000
DC Blocking
Capacitors
270 pF
27 pF
Inductors
560 nH
82 nH
RF Bypass
Capacitors
270 pF
270 pF
D.C. Bias to RF Truth Table
RF State
Tx-Ant Low Loss &
Tx-Rx Isolation
Ant-Rx Low Loss &
Rx – Tx Isolation
J1 Bias
+5V @ +100 mA
+5 V @ +100 mA
J2 Bias
0 V @ 25 mA
+28V @ 0 mA
B1 Bias
+28V @ 0 mA
0 V @ 100 mA
B2 Bias
0 V @ 25 mA
+28 V @ 0 mA
Minimum Reverse Bias Voltage @ Tx, Rx, DC ports vs. Frequency for 100 W C.W.
Power with 1.5:1 VSWR
Part Number
MSW2000-200
MSW2001-200
F ( MHz )
&
| - Vdc |
20 MHz
| -120 V |
20 MHz
NA
F ( MHz )
&
| - Vdc |
100 MHz
| -110 V |
100 MHz
NA
F ( MHz )
&
| - Vdc |
200 MHz
| -85 V |
200 MHz
| -110 V |
F ( MHz )
&
| - Vdc |
400 MHz
| -55 V |
400 MHz
| -85 V |
F ( MHz )
&
| - Vdc
1,000 MHz
| -28 V |
1,000 MHz
| -55 V |
F ( MHz )
&
| - Vdc |
4,000 MHz
NA
4,000 MHz
| -28 V |
Notes:
1. “ NA ” denotes the Switch is not defined for that Frequency Band.
TEL: 603-641-SEMI (7364) • [email protected] • www.aeroflex.com/metelics
Revision Date: 4/20/2010
5
5 Page 
SP2T PIN Diode Switches
www.DataSheet4U.com
Part Number Ordering Information:
Part Number
MSW2000-200-T
MSW2000-200-R
MSW2001-200-T
MSW2001-200-R
MSW2000-200-EVAL
MSW2001-200-EVAL
Packaging
Tube
Tape-Reel
Tube
Tape-Reel
RF Evaluation Board
RF Evaluation Board
Assembly Instructions
The MSW2000-200 and MSW2001-200 Switches are capable of being placed onto circuit boards with pick and place
manufacturing equipment from tube or tape-reel dispensing. The devices are attached to the circuit board using
conventional solder re-flow or wave soldering procedures with RoHS type or Sn 63 / Pb 37 type solders per Table I and
Graph I Time-Temperature recommended profile.
Table 1: Time-Temperature Profile for Sn 60/Pb40 or RoHS Type Solders
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Minimum (TSMIN)
- Temperature Maximum (TSMAX)
- Time (Minimum to maximum) (ts)
TSMAX to TL
- Ramp-up Rate
Time Maintauined above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Time within 5°C of actual
Peak Temperature (TP)
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Eutectic Assembly
3°C/second maximum
100°C
150°C
60-120 seconds
183°C
60-150 seconds
225 +0 / -5°C
10-30 seconds
6°C/second maximum
6 minutes maximum
Pb-Free Assembly
3°C/second maximum
150°C
200°C
60-180 seconds
3°C/second maximum
217°C
60-150 seconds
245 +0/-5°C
20-40 seconds
6°C/second maximum
8 minutes maximum
TEL: 603-641-SEMI (7364) • [email protected] • www.aeroflex.com/metelics
Revision Date: 4/20/2010
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet MSW2000-200.PDF ] | |
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