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PDF EZANP Data sheet ( Hoja de datos )
| Número de pieza | EZANP | |
| Descripción | Chip Capacitor Networks | |
| Fabricantes | Panasonic Semiconductor | |
| Logotipo |  |
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Chip Capacitor Networks
Type: EZANP
GND
GND
Chip Capawcwitwo.Dr atNaSehetewt4Uo.crokms
■ Features
● Chip Capacitor Networks, exclusively developed by Panasonic using thick film technology.
8 capacitors bussed in one package (6.4 mm ҂ 3.1 mm ҂ 0.75 mm, 1.27 mm pitch), halfpitch (0.635 mm) spacing
for high density automatic placing
● Excellent noise reduction by connecting both ground terminals and a simple layout pattern (less through hole)
● Excellent mountability using concave terminals, firm solder joint (2 times that of convex terminal), self-aligning placement
during reflow soldering
<Effect of high density placing, PWB space saving>
I/O I/O
Conventional Chip Capacitors
No Through Hole
I/O
I/O
0.635 mm
Chip Capacitor Network EZANP
■ Recommended Applications
● Digital equipment such as PCs, word processors, printers, HDD, PPC, and PDAs
● Digital audio and video equipment such as CD, MD, DAT, digital cameras, digital video and digital TV
● Communication equipment, cordless phones, automobile phones, GSM, PHS, DECT
● Electronic musical instruments, and other digital devices
■ Explanation of Part Numbers
1234
E Z AN
5
P
6 7 8 9 10
E 1 0 1M
11
Product Code
Dimensions and
Circuit Configuration
Temperature
Characteristics
Capacitance Value Capacitance Suffix for Special
Tolerance
Requirement
Thick Film Noise
Suppression and
Filtering Components
8 Capacitors,
NP
6.4 mm Common
҂3.1 mm terminal type
E
+20 %/–55 %
(–25 °C to +85 °C)
The first two digits are
significant figures of
capacitance value, and
the third one denotes the
number of zeroes fellow.
ex. 101ৎ100 pF
±20 %
M
+30 %
–20 %
in
the
case
of
22
pF
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
1 page  
www.DataSheet4U.com
Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
– EX2 –
Feb. 2006
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet EZANP.PDF ] | |
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